专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080207814A1 Thermally conductive adhesive composition and process for device attachment 失效
标题翻译：导热粘合剂组合物和装置连接方法
公开(公告)号：US20080207814A1
公开(公告)日：2008-08-28
申请号：US12071280
申请日：2008-02-19
申请人： Matthew Wrosch , Miguel Albert Capote , Janet Fox , Alan Grieve
发明人： Matthew Wrosch , Miguel Albert Capote , Janet Fox , Alan Grieve
IPC分类号： C08K3/08 , B32B15/02 , B23K35/363
CPC分类号： C08F220/26 , C08F222/1006 , C08K3/08 , C08L63/00 , C09J4/00 , C09J9/00 , C09J11/04 , H05K3/321 , H05K2201/0272 , H05K2203/0425 , Y10T428/31529
摘要： A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.
摘要翻译：导热粘合剂组合物包括高熔点金属或金属合金的粉末，低熔点金属或金属合金的粉末，以及具有聚环氧化物聚合物树脂和低熔点固体或液体的可聚合助熔聚合物基质组合物酸酐和聚合物稀释剂或具有碳碳双键和/或官能羟基的稀释剂。低熔点粉末与高熔点粉末的重量比为约0.50至约0.80，并且可以为约0.64至约0.75，并且可为0.665。迄今为止，已经发现使用这些低熔点粉末与高熔点粉末的比例，实质上更高的导热性能改善。

2. 发明授权

US07888411B2 Thermally conductive adhesive composition and process for device attachment 失效
标题翻译：导热粘合剂组合物和装置连接方法
公开(公告)号：US07888411B2
公开(公告)日：2011-02-15
申请号：US12071280
申请日：2008-02-19
申请人： Matthew Wrosch , Miguel Albert Capote , Janet Fox, legal representative , Alan Grieve
发明人： Matthew Wrosch , Miguel Albert Capote , Alan Grieve
IPC分类号： C08K3/08 , C08L63/02
CPC分类号： C08F220/26 , C08F222/1006 , C08K3/08 , C08L63/00 , C09J4/00 , C09J9/00 , C09J11/04 , H05K3/321 , H05K2201/0272 , H05K2203/0425 , Y10T428/31529
摘要： A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.
摘要翻译：导热粘合剂组合物包括高熔点金属或金属合金的粉末，低熔点金属或金属合金的粉末，以及具有聚环氧化物聚合物树脂和低熔点固体或液体的可聚合助熔聚合物基质组合物酸酐和聚合物稀释剂或具有碳碳双键和/或官能羟基的稀释剂。低熔点粉末与高熔点粉末的重量比为约0.50至约0.80，并且可以为约0.64至约0.75，并且可为0.665。迄今为止，已经发现使用这些低熔点粉末与高熔点粉末的比例，实质上更高的导热性能改善。

3. 发明授权

US06242513B1 Method of applying a die attach adhesive 失效
标题翻译：应用芯片附着粘合剂的方法
公开(公告)号：US06242513B1
公开(公告)日：2001-06-05
申请号：US09416706
申请日：1999-10-12
申请人： Xiao-Qi Zhou , Henry Wevick , Nancy E. Iwamoto , Shao Wei Li , Alan Grieve
发明人： Xiao-Qi Zhou , Henry Wevick , Nancy E. Iwamoto , Shao Wei Li , Alan Grieve
IPC分类号： B05D132
CPC分类号： H01L23/293 , C08G59/24 , C08G59/38 , C08G59/4014 , C08G73/0655 , C08L63/00 , G03F7/038 , H01L21/563 , H01L24/10 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15747 , H01L2924/00 , H01L2224/0401
摘要： Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
摘要翻译：具有高耐湿性和柔软性的组合物包含有机组分和填料。有机组分包括长链脂环族环氧树脂，短链脂环族环氧树脂，氰酸酯和路易斯酸催化剂。优选地，有机组分还包含布朗斯台德酸助催化剂和/或增韧改性剂。该组合物可用于各种半导体应用，包括作为芯片附着粘合剂，底部填充剂，密封剂，通孔填充物，预浸料粘合剂，聚合物焊接掩模和倒装芯片或BGA组件上的聚合物凸块。

4. 发明申请

US20210189580A1 ELECTROLYTIC PROCESS FOR DEPOSITION OF CHEMICAL CONVERSION COATINGS 有权
公开(公告)号：US20210189580A1
公开(公告)日：2021-06-24
申请号：US16720483
申请日：2019-12-19
申请人： Craig Matzdorf , Alan Grieve , Alexander Westbrook , Jeremy Mattison
发明人： Craig Matzdorf , Alan Grieve , Alexander Westbrook , Jeremy Mattison
IPC分类号： C25D3/06 , C25D7/06
摘要： This invention is directed to a process of coating metal in a trivalent chromium conversion-electrolyte coating wherein the metal anode or cathode is subjected to a current density ranging up to about 3.0 amperes per square foot for a period ranging up to 60 minutes.

5. 发明申请

US20060194920A1 Thermally conductive adhesive composition and process for device attachment 审中-公开
标题翻译：导热粘合剂组合物和装置连接方法
公开(公告)号：US20060194920A1
公开(公告)日：2006-08-31
申请号：US10550408
申请日：2004-03-30
申请人： Miguel Capote , Alan Grieve
发明人： Miguel Capote , Alan Grieve
IPC分类号： C08K3/10 , C08F20/02
CPC分类号： C09J9/00 , C08F220/26 , C08F222/1006 , C08K3/08 , C08K5/0025 , C08L63/00 , C09J4/00 , C09J11/04 , H01L23/3737 , H01L2924/0002 , H05K1/0203 , H05K3/305 , H05K3/321 , H05K2201/0215 , H05K2201/0272 , H05K2203/0425 , Y02P70/613 , C08F220/10 , H01L2924/00
摘要： Thermally conductive, sinterable, adhesive compositions, free of fugitive solvents, that include a powder of a relatively high melting point metal or metal alloy, a powder of a relatively low melting point metal or metal alloy powder and a thermally curable adhesive flux composition that comprises (i) a polymerizable fluxing agent; (ii) an inerting agent to react with the fluxing agent at elevated temperature, rendering it inert. The fluxing agent preferably comprises a compound with formula RCOOH, wherein R comprises a moiety having one or more polymerizable carbon-carbon double bonds. Optionally, the inventive compositions also include (a) a diluent that is capable of polymerizing with the fluxing agent's polymerizable carbon-carbon double bonds; (b) free radical initiators; (c) a curable resin; and (d) crosslinking agents and accelerators. The compositions can be applied directly onto the surfaces of devices to be joined mechanically and/or electrically and are ideally suited for semiconductor die attachment. During heating, the fluxing agent promotes wetting of the high melting point powder by the molten low melting point powder, causing liquid phase sintering of the powders. The fluxing agent also promotes wetting of the metallizations on the die and substrate by the molten low melting point alloy, providing improved thermal conductivity. Simultaneously, the fluxing agent itself crosslinks to further mechanically bond the adherent surfaces. The absence of fugitive solvents creates a void-free bond.
摘要翻译：包含相对高熔点金属或金属合金的粉末，相对低熔点的金属或金属合金粉末的粉末以及可热固化的粘合剂助焊剂组合物的导热，可烧结，粘合剂组合物，不含挥发性溶剂，其包含（i）可聚合助熔剂; （ii）惰性剂在升高的温度下与助熔剂反应，使其惰性。助熔剂优选包含具有式RCOOH的化合物，其中R包含具有一个或多个可聚合碳 - 碳双键的部分。任选地，本发明的组合物还包括（a）能够与助熔剂的可聚合碳 - 碳双键聚合的稀释剂; （b）自由基引发剂; （c）可固化树脂; 和（d）交联剂和促进剂。组合物可以直接施加到机械和/或电连接的装置的表面上，并且理想地适用于半导体芯片附接。在加热过程中，助熔剂通过熔融的低熔点粉末促进高熔点粉末的润湿，引起粉末的液相烧结。助熔剂还通过熔融的低熔点合金促进模具和衬底上的金属化的润湿，提供改进的导热性。同时，助熔剂本身交联以进一步机械地结合附着表面。没有挥发性溶剂会产生无空隙的键。

6. 发明授权

US06844379B2 Long and short-chain cycloaliphatic epoxy resin, cyanate ester and Lewis and Bronsted catalysts 失效
标题翻译：长链和短链脂环族环氧树脂，氰酸酯和Lewis和Bronsted催化剂
公开(公告)号：US06844379B2
公开(公告)日：2005-01-18
申请号：US10300493
申请日：2002-11-19
申请人： Xiao-Qi Zhou , Henry Wevick , Nancy Iwamoto , Shao Wei Li , Alan Grieve
发明人： Xiao-Qi Zhou , Henry Wevick , Nancy Iwamoto , Shao Wei Li , Alan Grieve
IPC分类号： C08G59/24 , C08G59/38 , C08G59/40 , C08G73/06 , C08L63/00 , G03F7/038 , H01L21/56 , H01L23/29 , H01L23/485 , C08K3/08 , C08L79/00
CPC分类号： H01L23/293 , C08G59/24 , C08G59/38 , C08G59/4014 , C08G73/0655 , C08L63/00 , G03F7/038 , H01L21/563 , H01L24/10 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15747 , H01L2924/00 , H01L2224/0401
摘要： Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
摘要翻译：具有高耐湿性和柔软性的组合物包含有机组分和填料。有机组分包括长链脂环族环氧树脂，短链脂环族环氧树脂，氰酸酯和路易斯酸催化剂。优选地，有机组分还包含布朗斯台德酸助催化剂和/或增韧改性剂。该组合物可用于各种半导体应用，包括作为芯片附着粘合剂，底部填充剂，密封剂，通孔填充物，预浸料粘合剂，聚合物焊接掩模和倒装芯片或BGA组件上的聚合物凸块。

7. 发明授权

US11155928B2 Electrolytic process for deposition of chemical conversion coatings 有权
公开(公告)号：US11155928B2
公开(公告)日：2021-10-26
申请号：US16720483
申请日：2019-12-19
申请人： Craig Matzdorf , Alan Grieve , Alexander Westbrook , Jeremy Mattison
发明人： Craig Matzdorf , Alan Grieve , Alexander Westbrook , Jeremy Mattison
IPC分类号： C25D3/06 , C25D7/06
摘要： This invention is directed to a process of coating metal in a trivalent chromium conversion-electrolyte coating wherein the metal anode or cathode is subjected to a current density ranging up to about 3.0 amperes per square foot for a period ranging up to 60 minutes.

8. 发明申请

US20050148695A1 Moisture resistant, flexible epoxy/cyanate ester formulation 审中-公开
标题翻译：防水，柔性环氧/氰酸酯配方
公开(公告)号：US20050148695A1
公开(公告)日：2005-07-07
申请号：US11035391
申请日：2005-01-13
申请人： Xiao-Qi Zhou , Henry Wevick , Nancy Iwamoto , Shao Li , Alan Grieve
发明人： Xiao-Qi Zhou , Henry Wevick , Nancy Iwamoto , Shao Li , Alan Grieve
IPC分类号： C08G59/24 , C08G59/38 , C08G59/40 , C08G73/06 , C08L63/00 , G03F7/038 , H01L21/56 , H01L23/29 , H01L23/485
CPC分类号： H01L23/293 , C08G59/24 , C08G59/38 , C08G59/4014 , C08G73/0655 , C08L63/00 , G03F7/038 , H01L21/563 , H01L24/10 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15747 , H01L2924/00 , H01L2224/0401
摘要： Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
摘要翻译：具有高耐湿性和柔软性的组合物包含有机组分和填料。有机组分包括长链脂环族环氧树脂，短链脂环族环氧树脂，氰酸酯和路易斯酸催化剂。优选地，有机组分还包含青铜酸助催化剂和/或增韧改性剂。该组合物可用于各种半导体应用，包括作为芯片附着粘合剂，底部填充剂，密封剂，通孔填充物，预浸料粘合剂，聚合物焊接掩模和倒装芯片或BGA组件上的聚合物凸块。

9. 发明授权

US5744533A Adhesive composition for bonding a semiconductor device 失效
标题翻译：用于粘合半导体器件的粘合剂组合物
公开(公告)号：US5744533A
公开(公告)日：1998-04-28
申请号：US868508
申请日：1997-06-04
申请人： Nancy E. Iwamoto , Jesse L. Pedigo , Shao Wei Li , Alan Grieve
发明人： Nancy E. Iwamoto , Jesse L. Pedigo , Shao Wei Li , Alan Grieve
IPC分类号： C09J201/00 , C08K3/00
CPC分类号： C09J201/00
摘要： Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.
摘要翻译：描述了适用于将半导体器件粘合到基底上的粘合剂组合物，其包含约60-90wt。％颗粒银; 约10-40重量％％的包含至少一种非导电有机化合物的粘合剂材料; 和包含能够在银颗粒之间形成导电桥的至少一种导电有机化合物的填料。粘合剂组合物可以另外包括至少一种用于粘合剂材料的固化催化剂，使组合物更柔性的增韧剂，促进与基材和/或材料接触的表面活性剂以有助于调节组合物的流变性。

10. 发明申请

US20190309395A1 ALUMINUM ANODE ALLOY 审中-公开
公开(公告)号：US20190309395A1
公开(公告)日：2019-10-10
申请号：US16444008
申请日：2019-06-18
申请人： Craig Matzdorf , Alan Grieve
发明人： Craig Matzdorf , Alan Grieve
IPC分类号： C22C21/00 , H01M4/46
摘要： An aluminum anode alloy consisting essentially of an aluminum base and effective amounts of tin and indium. The aluminum alloy is useful particularly as a sacrificial metallic coating, as a protective aluminum anode, and as pigment in polymeric and other organic coatings.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式