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1. 发明授权

US5586715A Method of making solder balls by contained paste deposition 失效
标题翻译：通过包含浆料沉积制造焊球的方法
公开(公告)号：US5586715A
公开(公告)日：1996-12-24
申请号：US617585
申请日：1996-03-19
申请人： Matthew K. Schwiebert , Donald T. Campbell , Matthew Heydinger , Robert E. Kraft , Hubert A. Vander Plas
发明人： Matthew K. Schwiebert , Donald T. Campbell , Matthew Heydinger , Robert E. Kraft , Hubert A. Vander Plas
IPC分类号： H01L21/48 , H01L21/56 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/12 , H05K3/34
CPC分类号： H01L24/17 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/28 , H05K3/3436 , H05K3/3484 , H01L2224/11005 , H01L2224/1131 , H01L2224/1132 , H01L2224/11332 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/16225 , H01L2224/17051 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/742 , H01L2224/81193 , H01L2224/83102 , H01L2224/83136 , H01L2224/92125 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K2201/094 , H05K2201/09781 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , H05K2203/043 , H05K2203/0568 , H05K2203/0769 , H05K3/1216 , H05K3/3463 , Y02P70/613 , Y10T29/4913
摘要： A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
摘要翻译：将焊料凸块模版到基板上，在低于400微米的间距处提供凸起的基板。通过模板/掩模和糊剂法施加焊料; 然而，掩模在回流期间保持附着于基底。也可以通过本发明获得大于400微米的间距。本发明进一步提供均匀的可控体积金属球的产生。

2. 发明授权

US5539153A Method of bumping substrates by contained paste deposition 失效
标题翻译：通过包含的糊料沉积来碰撞基材的方法
公开(公告)号：US5539153A
公开(公告)日：1996-07-23
申请号：US287453
申请日：1994-08-08
申请人： Matthew K. Schwiebert , Donald T. Campbell , Matthew Heydinger , Robert E. Kraft , Hubert A. Vander Plas
发明人： Matthew K. Schwiebert , Donald T. Campbell , Matthew Heydinger , Robert E. Kraft , Hubert A. Vander Plas
IPC分类号： H01L21/48 , H01L21/56 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/12 , H05K3/34 , H05K1/18
CPC分类号： H01L24/17 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/28 , H05K3/3436 , H05K3/3484 , H01L2224/11005 , H01L2224/1131 , H01L2224/1132 , H01L2224/11332 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/16225 , H01L2224/17051 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/742 , H01L2224/81193 , H01L2224/83102 , H01L2224/83136 , H01L2224/92125 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K2201/094 , H05K2201/09781 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , H05K2203/043 , H05K2203/0568 , H05K2203/0769 , H05K3/1216 , H05K3/3463 , Y02P70/613 , Y10T29/4913
摘要： A solder bump is stenciled into a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls
摘要翻译：将焊料凸块模版到基板中，在低于400微米的间距处提供凸起的基板。通过模板/掩模和糊剂法施加焊料; 然而，掩模在回流期间保持附着于基底。也可以通过本发明获得大于400微米的间距。本发明进一步提供均匀的可控体积金属球的产生

3. 发明授权

US5880017A Method of bumping substrates by contained paste deposition 失效
标题翻译：通过包含的糊料沉积来碰撞基材的方法
公开(公告)号：US5880017A
公开(公告)日：1999-03-09
申请号：US920221
申请日：1997-08-25
申请人： Matthew K. Schwiebert , Donald T. Campbell , Matthew Heydinger , Robert E. Kraft , Hubert A. Vander Plas
发明人： Matthew K. Schwiebert , Donald T. Campbell , Matthew Heydinger , Robert E. Kraft , Hubert A. Vander Plas
IPC分类号： H01L21/48 , H01L21/56 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/12 , H05K3/34 , H01L21/44
CPC分类号： H01L24/17 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/28 , H05K3/3436 , H05K3/3484 , H01L2224/11005 , H01L2224/1131 , H01L2224/1132 , H01L2224/11332 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/16225 , H01L2224/17051 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/742 , H01L2224/81193 , H01L2224/83102 , H01L2224/83136 , H01L2224/92125 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K2201/094 , H05K2201/09781 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , H05K2203/043 , H05K2203/0568 , H05K2203/0769 , H05K3/1216 , H05K3/3463 , Y02P70/613 , Y10T29/4913
摘要： A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
摘要翻译：将焊料凸块模版到基板上，在低于400微米的间距处提供凸起的基板。通过模板/掩模和糊剂法施加焊料; 然而，掩模在回流期间保持附着于基底。也可以通过本发明获得大于400微米的间距。本发明进一步提供均匀的可控体积金属球的产生。

4. 发明授权

US5672542A Method of making solder balls by contained paste deposition 失效
标题翻译：通过包含浆料沉积制造焊球的方法
公开(公告)号：US5672542A
公开(公告)日：1997-09-30
申请号：US618226
申请日：1996-03-19
申请人： Matthew K. Schwiebert , Donald T. Campbell , Matthew Heydinger , Robert E. Kraft , Hubert A. Vander Plas
发明人： Matthew K. Schwiebert , Donald T. Campbell , Matthew Heydinger , Robert E. Kraft , Hubert A. Vander Plas
IPC分类号： H01L21/48 , H01L21/56 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/12 , H05K3/34 , H01L21/44
CPC分类号： H01L24/17 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/28 , H05K3/3436 , H05K3/3484 , H01L2224/11005 , H01L2224/1131 , H01L2224/1132 , H01L2224/11332 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/16225 , H01L2224/17051 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/742 , H01L2224/81193 , H01L2224/83102 , H01L2224/83136 , H01L2224/92125 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K2201/094 , H05K2201/09781 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , H05K2203/043 , H05K2203/0568 , H05K2203/0769 , H05K3/1216 , H05K3/3463 , Y02P70/613 , Y10T29/4913
摘要： A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
摘要翻译：将焊料凸块模版到基板上，在低于400微米的间距处提供凸起的基板。通过模板/掩模和糊剂法施加焊料; 然而，掩模在回流期间保持附着于基底。也可以通过本发明获得大于400微米的间距。本发明进一步提供均匀的可控体积金属球的产生。

5. 发明授权

US08824142B2 Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices 有权
标题翻译：用于薄型，薄型或高纵横比电子器件的电动液体动力流体移动器技术
公开(公告)号：US08824142B2
公开(公告)日：2014-09-02
申请号：US13105343
申请日：2011-05-11
申请人： Nels Jewell-Larsen , Kenneth A. Honer , Ron Goldman , Matthew K. Schwiebert
发明人： Nels Jewell-Larsen , Kenneth A. Honer , Ron Goldman , Matthew K. Schwiebert
IPC分类号： H01T23/00 , H05K7/20
CPC分类号： G06F1/203 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.
摘要翻译：用于电磁屏蔽的表面，在EHD流体移动器设计中保持静电电荷并且确实收集离子电流可以形成为电子设备中的其它部件和/或结构的表面。以这种方式，可以减小尺寸并增加包装密度。在一些情况下，EHD流体驱动器的静电操作部分形成为外壳，EMI屏蔽，电路板和/或热管或扩展器的表面或表面。根据这些静电操作部分的作用，可以应用电介质，电阻和/或臭氧坚固或催化涂层或调理。

6. 发明授权

US6084494A Shuntable magnetic mask support apparatus 失效
标题翻译：可分流磁性面罩支撑装置
公开(公告)号：US6084494A
公开(公告)日：2000-07-04
申请号：US787615
申请日：1997-01-23
申请人： Geary L. Chew , Matthew K. Schwiebert , Ayn R. Lavagnino , Andy H. Uchida
发明人： Geary L. Chew , Matthew K. Schwiebert , Ayn R. Lavagnino , Andy H. Uchida
IPC分类号： H01L21/687 , H01F7/20
CPC分类号： H01L21/68721 , H01L21/68728 , H01L21/68757 , H01L21/68778 , H01L21/68785
摘要： A mask support device including two communicating elements, a first element having ferromagnetic shunts, and a second element containing permanent magnets, and wherein the elements are rotatable about a central axis and assume fixed positions in the rotation. The mask support device in one position attracts a ferromagnetic metal mask. In a second position, owing to the shunt redirecting the magnetic field, releases the metal mask.
摘要翻译：一种掩模支撑装置，包括两个连通元件，具有铁磁分流器的第一元件和包含永磁体的第二元件，并且其中所述元件可围绕中心轴线旋转并且在旋转中呈现固定位置。一个位置的掩模支撑装置吸引铁磁金属掩模。在第二位置，由于分流重定向磁场，释放金属掩模。

7. 发明申请

US20110292560A1 ELECTROHYDRODYNAMIC FLUID MOVER TECHNIQUES FOR THIN, LOW-PROFILE OR HIGH-ASPECT-RATIO ELECTRONIC DEVICES 有权
标题翻译：用于薄型，低配置型或高比例电子设备的电动液体流动技术
公开(公告)号：US20110292560A1
公开(公告)日：2011-12-01
申请号：US13105343
申请日：2011-05-11
申请人： Nels Jewell-Larsen , Kenneth A. Honer , Ron Goldman , Matthew K. Schwiebert
发明人： Nels Jewell-Larsen , Kenneth A. Honer , Ron Goldman , Matthew K. Schwiebert
IPC分类号： H01T23/00
CPC分类号： G06F1/203 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.
摘要翻译：用于电磁屏蔽的表面，在EHD流体移动器设计中保持静电电荷并且确实收集离子电流可以形成为电子设备中的其它部件和/或结构的表面。以这种方式，可以减小尺寸并增加包装密度。在一些情况下，EHD流体驱动器的静电操作部分形成为外壳，EMI屏蔽，电路板和/或热管或扩展器的表面或表面。根据这些静电操作部分的作用，可以应用电介质，电阻和/或臭氧坚固或催化涂层或调理。

8. 发明授权

US06239385B1 Surface mountable coaxial solder interconnect and method 失效
标题翻译：表面贴装同轴焊接互连及方法
公开(公告)号：US06239385B1
公开(公告)日：2001-05-29
申请号：US09031864
申请日：1998-02-27
申请人： Matthew K. Schwiebert , Ron Barnett , Geary L. Chew , Gerald J. Gleason , Dean B. Nicholson
发明人： Matthew K. Schwiebert , Ron Barnett , Geary L. Chew , Gerald J. Gleason , Dean B. Nicholson
IPC分类号： H01R1204
CPC分类号： H05K1/025 , H01L2223/6622 , H01P5/085 , H01R24/50 , H05K1/0222 , H05K1/113 , H05K3/3436 , H05K3/3484 , H05K3/4644 , H05K2201/09618 , H05K2201/09809 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , Y02P70/613
摘要： A surface mountable coaxial solder interconnect. The invention provides a small, low-cost, passively self-aligning, high-frequency electronic interconnect adapted to mass production and method. The invention includes a substrate, a signal conductor, and an annular conductor. The substrate incorporates an annular pad and a signal pad substantially centered within the annular pad. The signal conductor includes reflowed solder and is wetted to the signal pad. Similarly, the annular conductor includes reflowed solder and is wetted to the annular pad. The invention may also provide a second substrate substantially parallel to the first substrate that includes a second annular pad and a second signal pad substantially centered within the second annular pad. In such a case, the signal conductor is also wetted to the second signal pad, and, similarly, the annular conductor is also wetted to the second annular pad. The method of the invention includes obtaining a mask and a substrate. The mask obtained defines a center cavity and an annular cavity surrounding the center cavity, and may also define an outer cavity in fluidic communication with the annular cavity. The substrate obtained includes a solder-wettable signal pad, and a solder-wettable annular pad surrounding the signal pad. The mask is then filled with solder paste and aligned with the substrate such that the center cavity of the mask is in registry with the signal pad. The solder paste is then reflowed, generating solder wetting the solder-wettable signal pad and the solder-wettable annular pad.
摘要翻译：可表面安装的同轴焊接互连。本发明提供了适用于批量生产和方法的小型，低成本，被动自对准的高频电子互连。本发明包括基板，信号导体和环形导体。衬底包括环形垫和基本上位于环形垫内的信号垫。信号导体包括回流焊料并被润湿到信号焊盘。类似地，环形导体包括回流焊料并被润湿到环形垫。本发明还可以提供基本上平行于第一基板的第二基板，该第二基板包括第二环形垫和基本上位于第二环形垫内的第二信号垫。在这种情况下，信号导体也被润湿到第二信号焊盘，并且类似地，环形导体也被润湿到第二环形焊盘。本发明的方法包括获得掩模和基底。获得的掩模限定了中心空腔和围绕中心空腔的环形空腔，并且还可以限定与环形空腔流体连通的外部空腔。获得的基板包括可焊接润湿信号焊盘和围绕信号焊盘的可焊接润湿的环形焊盘。然后将掩模用焊膏填充并与衬底对准，使得掩模的中心腔与信号垫对准。然后将焊膏回流，产生焊料润湿可焊接润湿的信号垫和可焊接润湿的环形垫。

9. 发明授权

US6139972A Solder paste containment device 失效
标题翻译：焊膏遏制装置
公开(公告)号：US6139972A
公开(公告)日：2000-10-31
申请号：US179245
申请日：1998-10-26
申请人： Gary R Trott , Geary L. Chew , Matthew K. Schwiebert
发明人： Gary R Trott , Geary L. Chew , Matthew K. Schwiebert
IPC分类号： B23K3/06 , H05K3/34 , B32B15/08 , B23K1/00
CPC分类号： B23K3/0638 , H05K3/3484 , B23K2201/40 , H05K2203/0113 , H05K2203/0338 , Y10T428/31681 , Y10T428/31721
摘要： The invention provides an improved donor substrate for the formation and transfer of solder bumps useful in IC packaging and related interconnect applications. The donor substrate is improved by shaping the solder paste containment region (cavity) so that during reflow, the solder bump is urged to protrude significantly above the surface of the donor substrate, enabling proximity transfer of the solder bump to a receiving substrate.
摘要翻译：本发明提供了用于形成和转移用于IC封装和相关互连应用的焊料凸块的改进的施主衬底。通过使焊膏容纳区域（空腔）成形来提高施主衬底，使得在回流期间，焊料凸块被迫突出地突出地超过施主衬底的表面，使得焊料凸块接近传递到接收衬底。

10. 发明申请

US20120121487A1 ELECTRONIC SYSTEM WITH VENTILATION PATH THROUGH INLET-POSITIONED EHD AIR MOVER, OVER OZONE REDUCING SURFACES, AND OUT THROUGH OUTLET-POSITIONED HEAT EXCHANGER 审中-公开
标题翻译：电子系统通过入口定位的EHD AIR MOVER，通过OZONE减少表面和通过出口定位的热交换器
公开(公告)号：US20120121487A1
公开(公告)日：2012-05-17
申请号：US13289870
申请日：2011-11-04
申请人： Nels Jewell-Larsen , Kenneth A. Honer , Matthew K. Schwiebert
发明人： Nels Jewell-Larsen , Kenneth A. Honer , Matthew K. Schwiebert
IPC分类号： B01D53/66 , B21D53/02 , B01D53/72 , B01D53/56 , B01D53/50
CPC分类号： H01L23/467 , F28D15/0266 , F28D15/0275 , F28F2250/08 , H01L2924/0002 , H05K7/20136 , Y10T29/4935 , H01L2924/00
摘要： An electronic system enclosure houses a plurality of electronic components together presenting one or more surfaces coated with ozone reducing material. An EHD air mover positioned remote from an outlet ventilation boundary of the enclosure motivates air flow through the enclosure along a flow path past the one or more surfaces coated with ozone destructive material over heat transfer surfaces and out through an outlet ventilation boundary of the enclosure.
摘要翻译：电子系统外壳一起容纳多个电子元件，呈现涂有臭氧还原材料的一个或多个表面。位于远离外壳出口通风边界的EHD空气推动器沿着沿着通过热传递表面涂覆有臭氧破坏性材料的一个或多个表面的流动路径流过外壳的空气流动，并通过外壳的出口通风边界引出。

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