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    • 1. 发明申请
    • Thin film piezoelectric element and its manufacturing method
    • 薄膜压电元件及其制造方法
    • US20030155845A1
    • 2003-08-21
    • US10287797
    • 2002-11-05
    • Matsushita Elec. Ind. Co. Ltd.
    • Hirokazu UchiyamaYuko OgawaHiroyuki Kita
    • H01L041/08
    • H01L41/332H01L41/314Y10S29/001Y10S29/016Y10T29/42Y10T29/49128Y10T29/49155Y10T29/4981
    • A method of manufacturing a thin film piezoelectric element, wherein main electrode layer, piezoelectric thin film, and opposed electrode layer respectively having specified shapes are first formed on first substrate and second substrate, and after that, the opposed electrodes are opposed and bonded to each other, and insulating resin layer is formed over the peripheral portion thereof, and then the second substrate is removed, the insulating resin layer is etched, and connecting electrode pad is formed, and finally, the first substrate is removed to obtain a completely separated thin film piezoelectric element. By this method, it is possible to improve the reproducibility of shapes and to prevent trouble such as shorting between the electrodes which hold the piezoelectric thin film, thereby making it possible to provide a thin film piezoelectric element that may assure high yield without variation in piezoelectric characteristics, and its manufacturing method.
    • 首先,在第一基板和第二基板上首先形成分别具有特定形状的主电极层,压电薄膜和相对电极层的薄膜压电元件的制造方法,然后将相对的电极相对并贴合 其它绝缘树脂层形成在其周边部分上,然后除去第二基板,蚀刻绝缘树脂层,形成连接电极焊盘,最后移除第一基板以获得完全分离的薄片 薄膜压电元件。 通过这种方法,可以提高形状的再现性,并且可以防止保持压电薄膜的电极之间的短路等故障,从而可以提供可以保证高产率而不会在压电变化的情况下提供的薄膜压电元件 特点及其制造方法。