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1. 发明申请

US20080153036A1 Chemically amplified positive resist compostion 有权
标题翻译：化学放大阳性抗蚀剂组合
公开(公告)号：US20080153036A1
公开(公告)日：2008-06-26
申请号：US11984098
申请日：2007-11-13
申请人： Masumi Suetsugu , Makoto Akita , Kazuhiko Hashimoto
发明人： Masumi Suetsugu , Makoto Akita , Kazuhiko Hashimoto
IPC分类号： G03F7/004
CPC分类号： G03F7/0045 , G03F7/0392 , Y10S430/106
摘要： The present invention provides a chemically amplified positive resist composition comprising (A) a resin obtainable by reacting a novolak resin, a poly(hydroxystyrene) and a compound having at least two vinyl ether structures, and (B) an acid generator.
摘要翻译：本发明提供了一种化学放大正型抗蚀剂组合物，其包含（A）可通过使酚醛清漆树脂，聚（羟基苯乙烯）和具有至少两个乙烯基醚结构的化合物反应获得的树脂和（B）酸产生剂。

2. 发明授权

US07972763B2 Chemically amplified positive resist composition 有权
标题翻译：化学放大正光刻胶组合物
公开(公告)号：US07972763B2
公开(公告)日：2011-07-05
申请号：US11984098
申请日：2007-11-13
申请人： Masumi Suetsugu , Makoto Akita , Kazuhiko Hashimoto
发明人： Masumi Suetsugu , Makoto Akita , Kazuhiko Hashimoto
IPC分类号： G03F7/039
CPC分类号： G03F7/0045 , G03F7/0392 , Y10S430/106
摘要： The present invention provides a chemically amplified positive resist composition comprising (A) a resin obtainable by reacting a novolak resin, a poly(hydroxystyrene) and a compound having at least two vinyl ether structures, and (B) an acid generator.
摘要翻译：本发明提供了一种化学放大正型抗蚀剂组合物，其包含（A）可通过使酚醛清漆树脂，聚（羟基苯乙烯）和具有至少两个乙烯基醚结构的化合物反应获得的树脂和（B）酸产生剂。

3. 发明授权

US07794913B2 Chemically amplified positive resist composition 有权
标题翻译：化学放大正光刻胶组合物
公开(公告)号：US07794913B2
公开(公告)日：2010-09-14
申请号：US12121458
申请日：2008-05-15
申请人： Makoto Akita , Masumi Suetsugu , Kazuhiko Hashimoto
发明人： Makoto Akita , Masumi Suetsugu , Kazuhiko Hashimoto
IPC分类号： G03F7/004
CPC分类号： G03F7/0397 , C08F8/12 , C08F8/14 , C08F12/22 , C08F212/14 , C08F212/32 , C08F220/18 , C08F2220/1891 , Y10S430/106 , Y10S430/111
摘要： A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): (ii) a polymerization unit represented by the formula (II): and (iii) at least one polymerization unit selected from the group consisting of a polymerization unit represented by the formula (III): and a polymerization unit represented by the formula (IV): and (B) at least one acid generator.
摘要翻译：一种化学放大正型抗蚀剂组合物，其包含（A）树脂，其包含（i）由式（I）表示的聚合单元：（ii）由式（II）表示的聚合单元：和（iii）至少一种聚合选自由式（III）表示的聚合单元组的单元和由式（IV）表示的聚合单元：和（B）至少一种酸产生剂。

4. 发明授权

US08808960B2 Compound and chemically amplified positive resist composition 有权
标题翻译：化合物和化学放大阳性抗蚀剂组合物
公开(公告)号：US08808960B2
公开(公告)日：2014-08-19
申请号：US12719505
申请日：2010-03-08
申请人： Makoto Akita , Isao Yoshida , Kazuhiko Hashimoto
发明人： Makoto Akita , Isao Yoshida , Kazuhiko Hashimoto
IPC分类号： G03F7/039 , C08F32/08 , C08F20/30
CPC分类号： C07C69/00 , C07C69/78 , C07C2603/24 , C08F12/24 , C08F212/14 , C08F220/30 , G03F7/0045 , G03F7/0397 , C08F220/18 , C08F2220/185 , C08F2220/303
摘要： A compound represented by the formula (I): wherein R1 represents a hydrogen atom etc., R2 and R3 each independently represent a hydrogen atom etc., R4 represents a C1-C8 divalent hydrocarbon group, R5 represents a single bond etc., and R6 represents an unsubstituted or substituted C6-C20 aromatic hydrocarbon group, a polymer comprising a structural unit derived from the compound represented by the formula (I) and a chemically amplified positive resist composition comprising the polymer, at least one acid generator and at least one solvent.
摘要翻译：由式（I）表示的化合物：其中R1表示氢原子等，R2和R3各自独立地表示氢原子等，R4表示C1-C8二价烃基，R5表示单键等，以及 R6表示未取代或取代的C6-C20芳族烃基，包含衍生自由式（I）表示的化合物的结构单元的聚合物和包含聚合物，至少一种酸产生剂和至少一种酸溶剂。

5. 发明授权

US07893293B2 Chemically amplified positive resist composition 有权
标题翻译：化学放大正光刻胶组合物
公开(公告)号：US07893293B2
公开(公告)日：2011-02-22
申请号：US12143268
申请日：2008-06-20
申请人： Makoto Akita , Isao Yoshida , Kazuhiko Hashimoto
发明人： Makoto Akita , Isao Yoshida , Kazuhiko Hashimoto
IPC分类号： C07C69/753 , C07C43/21 , C07C43/215 , C08F12/32 , G03F7/039
CPC分类号： G03F7/0397 , C07C69/00 , C07C2603/24 , C08F212/14 , C08F212/34 , C08F220/18 , G03F7/0045 , G03F7/0046 , Y10S430/106
摘要： A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): wherein R7 represents a hydrogen atom etc., R8 represents a C1-C4 alkyl group, p represents an integer of 1 to 3, and q represents an integer of 0 to 2, (ii) at least one polymerization unit selected from a group consisting of a polymerization unit represented by the formula (II): wherein R1 represents a hydrogen atom etc., R2 represents a C1-C8 alkyl group and ring X represents an alicyclic hydrocarbon group, and a polymerization unit represented by the formula (IV): wherein R3 represents a hydrogen atom etc., R4 and R5 independently represents a hydrogen atom etc., R10 represents a C1-C6 alkyl group etc., and (iii) a polymerization unit represented by the formula (III): wherein R3, R4 and R5 are the same as defined above, E represents a divalent hydrocarbon group, G represents a single bond etc., Z represents a carbonyl group etc. and L represents an anthryl group etc., and (B) at least one acid generator.
摘要翻译：一种化学放大正型抗蚀剂组合物，其包含（A）树脂，其包含（i）由式（I）表示的聚合单元：其中R7表示氢原子等，R8表示C1-C4烷基，p表示整数为1〜3，q为0〜2的整数，（ii）至少一种选自由式（II）表示的聚合单元的聚合单元：其中，R1表示氢原子等，R2 代表C1-C8烷基，X代表脂环族烃基，和由式（Ⅳ）表示的聚合单元：其中R3表示氢原子等，R4和R5独立地表示氢原子等，R10表示 C 1 -C 6烷基等，和（iii）由式（III）表示的聚合单元：其中R3，R4和R5与上述定义相同，E表示二价烃基，G表示单键等 Z表示羰基等，L r 表示蒽基等，和（B）至少一种酸发生剂。

6. 发明申请

US20090004600A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION 有权
标题翻译：化学放大正电阻组合物
公开(公告)号：US20090004600A1
公开(公告)日：2009-01-01
申请号：US12143268
申请日：2008-06-20
申请人： Makoto Akita , Isao Yoshida , Kazuhiko Hashimoto
发明人： Makoto Akita , Isao Yoshida , Kazuhiko Hashimoto
IPC分类号： G03C1/053
CPC分类号： G03F7/0397 , C07C69/00 , C07C2603/24 , C08F212/14 , C08F212/34 , C08F220/18 , G03F7/0045 , G03F7/0046 , Y10S430/106
摘要： A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): wherein R7 represents a hydrogen atom etc., R8 represents a C1-C4 alkyl group, p represents an integer of 1 to 3, and q represents an integer of 0 to 2, (ii) at least one polymerization unit selected from a group consisting of a polymerization unit represented by the formula (II): wherein R1 represents a hydrogen atom etc., R2 represents a C1-C8 alkyl group and ring X represents an alicyclic hydrocarbon group, and a polymerization unit represented by the formula (IV): wherein R3 represents a hydrogen atom etc., R4 and R5 independently represents a hydrogen atom etc., R10 represents a C1-C6 alkyl group etc., and (iii) a polymerization unit represented by the formula (III): wherein R3, R4 and R5 are the same as defined above, E represents a divalent hydrocarbon group, G represents a single bond etc., Z represents a carbonyl group etc. and L represents an anthryl group etc., and (B) at least one acid generator.
摘要翻译：一种化学放大正型抗蚀剂组合物，其包含（A）树脂，其包含（i）由式（I）表示的聚合单元：其中R7表示氢原子等，R8表示C1-C4烷基，p表示整数为1〜3，q为0〜2的整数，（ii）至少一种选自由式（II）表示的聚合单元的聚合单元：其中，R1表示氢原子等，R2 代表C1-C8烷基，X代表脂环族烃基，和由式（Ⅳ）表示的聚合单元：其中R3表示氢原子等，R4和R5独立地表示氢原子等，R10表示 C 1 -C 6烷基等，和（iii）由式（III）表示的聚合单元：其中R3，R4和R5与上述定义相同，E表示二价烃基，G表示单键等 Z表示羰基等，L r 表示蒽基等，和（B）至少一种酸发生剂。

7. 发明申请

US20050227429A1 Electronic component mounting method and apparatus and ultrasondic bonding head 有权
标题翻译：电子元器件安装方法及装置及超级焊接头
公开(公告)号：US20050227429A1
公开(公告)日：2005-10-13
申请号：US10508460
申请日：2003-03-27
申请人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
发明人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
IPC分类号： B23K20/10 , H01L21/00 , H01L21/8238
CPC分类号： H01L24/81 , B23K20/10 , B23K2101/40 , H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75252 , H01L2224/75355 , H01L2224/75743 , H01L2224/81205 , H01L2224/8121 , H01L2224/81222 , H01L2224/81224 , H01L2224/81815 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.
摘要翻译：一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8）所述基板以及将所述部件与所述基板对准的定位装置（6,7）。安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

8. 发明授权

US5556456A Pigment compositions 失效
标题翻译：颜料组成
公开(公告)号：US5556456A
公开(公告)日：1996-09-17
申请号：US363882
申请日：1994-12-27
申请人： Hiroki Inoue , Yoshiaki Hayashi , Hideki Senba , Keisuke Ito , Makoto Akita
发明人： Hiroki Inoue , Yoshiaki Hayashi , Hideki Senba , Keisuke Ito , Makoto Akita
IPC分类号： C09B67/20 , C09B19/02 , C09B67/22 , C08K5/00
CPC分类号： C09B67/0034 , C09B19/02
摘要： A pigment composition which comprises an organic pigment and a dioxazine pigment derivative represented by the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2 each independently represents a substituted or unsubstituted and saturated or unsaturated aliphatic hydrocarbon group or aromatic hydrocarbon group, or R.sub.1 and R.sub.2 form a heterocyclic ring; L is an integer of 1-6; m is 0.5-3; and n is 0.5-3.5 provided that total of m and n is 1-5 or a salt thereof; andthe pigment composition can be used with excellent pigment characteristics for various uses, and particularly, when they are used for paints or printing inks in the form of non-aqueous dispersion system, the dispersion system has lower dispersion viscosity and exhibits good flowability and there occurs no color segregation in the dispersion system and it has high coloring power and gives good prints or coats having good gloss and high transparency.
摘要翻译：一种颜料组合物，其包含由下式（I）表示的有机颜料和二恶嗪颜料衍生物; （I）其中R 1和R 2各自独立地表示取代或未取代的饱和或不饱和的脂族烃基或芳族烃基，或者R 1和R 2形成杂环; L为1-6的整数; m为0.5-3; 并且n为0.5-3.5，条件是m和n的总和为1-5或其盐; 并且颜料组合物可以用于各种用途的优异的颜料特性，特别是当以非水分散体系形式用于油漆或印刷油墨时，分散体系具有较低的分散粘度和显示出良好的流动性，并且在那里在分散系统中没有发生颜色偏析，并且具有高着色力，并且具有良好的光泽度和高透明度的良好的印刷品或涂层。

9. 发明申请

US20070187457A1 Component mounting method, component mounting apparatus, and ultrasonic bonding head 有权
标题翻译：部件安装方法，部件安装装置和超声波焊接头
公开(公告)号：US20070187457A1
公开(公告)日：2007-08-16
申请号：US11731312
申请日：2007-03-30
申请人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
发明人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
IPC分类号： B23K1/06
CPC分类号： H01L24/81 , B23K20/10 , B23K2101/40 , H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75252 , H01L2224/75355 , H01L2224/75743 , H01L2224/81205 , H01L2224/8121 , H01L2224/81222 , H01L2224/81224 , H01L2224/81815 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.
摘要翻译：部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

10. 发明授权

US07229854B2 Electronic component mounting method and apparatus and ultrasonic bonding head 有权
标题翻译：电子元件安装方法及设备及超声波焊接头
公开(公告)号：US07229854B2
公开(公告)日：2007-06-12
申请号：US10508460
申请日：2003-03-27
申请人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
发明人： Shozo Minamitani , Takaharu Mae , Yasuharu Ueno , Akira Yamada , Shinji Kanayama , Makoto Akita , Nobuhisa Watanabe , Akira Mori , Hiroyuki Naito , Shinya Marumo , Makoto Morikawa
IPC分类号： H01L21/50
CPC分类号： H01L24/81 , B23K20/10 , B23K2101/40 , H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75252 , H01L2224/75355 , H01L2224/75743 , H01L2224/81205 , H01L2224/8121 , H01L2224/81222 , H01L2224/81224 , H01L2224/81815 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.
摘要翻译：一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8）所述基板以及将所述部件与所述基板对准的定位装置（6,7）。安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

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