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1. 发明授权

US07540931B2 Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet 失效
标题翻译：使用该陶瓷生片的陶瓷生片的制造方法和电子部件的制造方法
公开(公告)号：US07540931B2
公开(公告)日：2009-06-02
申请号：US10543710
申请日：2004-01-30
申请人： Masayuki Yoshida , Junichi Suto , Shunji Aoki , Genichi Watanabe
发明人： Masayuki Yoshida , Junichi Suto , Shunji Aoki , Genichi Watanabe
IPC分类号： C03B29/00 , G03F1/00
CPC分类号： H01L21/481 , H01F17/0006 , H01F41/127 , H01G4/12 , H01L21/4867 , H05K1/0306 , H05K3/0023 , H05K3/20 , H05K3/4629
摘要： An object of the invention is to provide a flat ceramic sheet including an internal electrode used for manufacturing a multilayer ceramic electronic part. Specifically, an electrode portion is formed on a surface of a transparent base member, and a photosensitive slurry containing dielectric powder is applied thereon. The photosensitive slurry is exposed from the backside of the base member up to a predetermined thickness, and then it is subjected to development. After that, the base member is removed. Thus, a ceramic green sheet is obtained.
摘要翻译：本发明的目的是提供一种包括用于制造多层陶瓷电子部件的内部电极的平坦陶瓷片。具体而言，在透明基材的表面上形成电极部，在其上涂布含有电介质粉末的感光性浆料。感光性浆料从基材的背面露出达预定厚度，然后进行显影。之后，移去基座部件。由此得到陶瓷生片。

2. 发明申请

US20060213602A1 Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet 失效
公开(公告)号：US20060213602A1
公开(公告)日：2006-09-28
申请号：US10543710
申请日：2004-01-30
申请人： Masayuki Yoshida , Junichi Suto , Shunji Aoki , Genichi Watanabe
发明人： Masayuki Yoshida , Junichi Suto , Shunji Aoki , Genichi Watanabe
IPC分类号： H01G4/12 , C03B29/00 , G03C5/00 , H01F41/04 , B28B1/30
CPC分类号： H01L21/481 , H01F17/0006 , H01F41/127 , H01G4/12 , H01L21/4867 , H05K1/0306 , H05K3/0023 , H05K3/20 , H05K3/4629
摘要： An object of the invention is to provide a flat ceramic sheet including an internal electrode used for manufacturing a multilayer ceramic electronic part. Specifically, an electrode portion is formed on a surface of a transparent base member, and a photosensitive slurry containing dielectric powder is applied thereon. The photosensitive slurry is exposed from the backside of the base member up to a predetermined thickness, and then it is subjected to development. After that, the base member is removed. Thus, a ceramic green sheet is obtained.

3. 发明授权

US07387870B2 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet 失效
标题翻译：制造陶瓷生片的方法和使用该陶瓷生片制造电子部件的方法
公开(公告)号：US07387870B2
公开(公告)日：2008-06-17
申请号：US10926042
申请日：2004-08-26
申请人： Masayuki Yoshida , Junichi Sutoh , Shunji Aoki , Genichi Watanabe
发明人： Masayuki Yoshida , Junichi Sutoh , Shunji Aoki , Genichi Watanabe
IPC分类号： B29C65/14 , G03C5/00 , B32B37/02
CPC分类号： H05K3/0023 , H05K1/0306 , H05K1/092 , H05K3/0082 , H05K3/02 , H05K2201/0108 , H05K2203/016 , H05K2203/0514
摘要： The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.
摘要翻译：本发明涉及用于制造多层陶瓷电子部件的所谓的陶瓷生片。本发明旨在提高形成在片材上的电极或其它元件的形状精度，其位置精度及其厚度均匀性。在根据本发明的方法中，在透光性基材上形成由包含具有所需电特性的粉末的感光材料制成的层。具有期望图案的掩模设置在基底构件的背面上，并且感光材料通过掩模从基底构件的背面露出。然后曝光后的感光层显影。

4. 发明授权

US07232496B2 Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board 失效
标题翻译：多层陶瓷电子部件，电路板以及用于制造这些部件和电路板的陶瓷生片的制造方法
公开(公告)号：US07232496B2
公开(公告)日：2007-06-19
申请号：US11068781
申请日：2005-03-02
申请人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
发明人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
IPC分类号： B32B37/00 , B32B38/00 , H01F41/00 , H01G13/00
CPC分类号： H05K3/4667 , C04B35/6269 , H01G4/30 , H05K1/0306 , H05K3/0023 , H05K2201/09881 , H05K2203/0514
摘要： The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a substrate an internal electrode having a predetermined thickness by a discretional process, forming a photosensitive ceramic slurry on a surface of the substrate or the layer and the internal electrode in such a way that its thickness just before exposure will be substantially equal to or smaller than the thickness of the internal electrode from the surface of the substrate or the layer, irradiating the photosensitive ceramic slurry with light from the upper side of the substrate to perform exposure while masking the internal electrode pattern, to selectively harden the surface of the photosensitive ceramic slurry, the exposure amount being controlled in such a way that the surface of the photosensitive ceramic slurry is hardened, and removing the portion of the photosensitive ceramic slurry that has not been exposed by a development process to expose a surface of the internal electrode pattern.
摘要翻译：本发明提供一种能够应对小型化，提高多层电子部件的性能和质量的电子部件的制造方法。通过在基板上或在基板上形成具有预定厚度的内部电极的层来形成陶瓷生片，在基板或层和内部电极的表面上形成感光陶瓷浆料使其刚刚曝光之前的厚度将基本上等于或小于从基板或层的表面的内部电极的厚度，用来自基板的上侧的光照射感光陶瓷浆料以进行曝光同时掩蔽内部电极图案，以选择性地硬化感光陶瓷浆料的表面，曝光量被控制为使得感光陶瓷浆料的表面硬化，并且去除不具有感光陶瓷浆料的部分感光陶瓷浆料通过显影处理曝光以暴露内部电极图案的表面。

5. 发明申请

US20060223331A1 Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions 失效
公开(公告)号：US20060223331A1
公开(公告)日：2006-10-05
申请号：US10553517
申请日：2004-04-14
申请人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
发明人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H05K1/16 , H01F17/0013 , H05K1/0306 , H05K1/162 , H05K1/165 , H05K3/4611 , H05K3/4629 , H05K2201/0187 , H05K2203/0156
摘要： The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.

6. 发明申请

US20050045268A1 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet 失效
标题翻译：制造陶瓷生片的方法和使用该陶瓷生片制造电子部件的方法
公开(公告)号：US20050045268A1
公开(公告)日：2005-03-03
申请号：US10926033
申请日：2004-08-26
申请人： Masayuki Yoshida , Junichi Sutoh , Shunji Aoki , Genichi Watanabe
发明人： Masayuki Yoshida , Junichi Sutoh , Shunji Aoki , Genichi Watanabe
IPC分类号： H01G4/12 , B32B18/00 , C04B35/468 , G03F7/20 , H01F41/00 , H01F41/04 , H01F41/34 , H01G4/30 , H01G4/40 , H01G13/00 , H05K1/03 , H05K3/00 , H05K3/10 , H05K3/12 , H05K3/40 , H05K3/46 , C03B29/00
CPC分类号： C04B35/6269 , B32B18/00 , C04B35/468 , C04B2237/346 , C04B2237/52 , C04B2237/66 , C04B2237/68 , C04B2237/704 , G03F7/203 , H05K1/0306 , H05K3/0023 , H05K3/0082 , H05K3/107 , H05K3/1258 , H05K3/4061 , H05K3/4614 , H05K3/4629
摘要： The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.
摘要翻译：本发明涉及用于制造多层陶瓷电子部件的所谓的陶瓷生片。本发明涉及形成具有凹凸复杂形状的绝缘层或类似层，同时保持其形状的精度，其形成位置的精度和厚度的均匀性。在根据本发明的方法中，在透光性基材上形成由包含具有所需电特性的粉末的感光材料制成的层。具有第一图案的紫外线的光从基体的背面辐射到感光材料，并且具有第二图案的光如从基底部件的背面辐射到感光材料，使得感光材料被曝光。然后曝光后的感光层显影。

7. 发明授权

US07326310B2 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet 失效
标题翻译：制造陶瓷生片的方法和使用该陶瓷生片制造电子部件的方法
公开(公告)号：US07326310B2
公开(公告)日：2008-02-05
申请号：US10926033
申请日：2004-08-26
申请人： Masayuki Yoshida , Junichi Sutoh , Shunji Aoki , Genichi Watanabe
发明人： Masayuki Yoshida , Junichi Sutoh , Shunji Aoki , Genichi Watanabe
IPC分类号： B32B37/00 , B32B38/00 , H01F41/00 , H01G13/00
CPC分类号： C04B35/6269 , B32B18/00 , C04B35/468 , C04B2237/346 , C04B2237/52 , C04B2237/66 , C04B2237/68 , C04B2237/704 , G03F7/203 , H05K1/0306 , H05K3/0023 , H05K3/0082 , H05K3/107 , H05K3/1258 , H05K3/4061 , H05K3/4614 , H05K3/4629
摘要： The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.
摘要翻译：本发明涉及用于制造多层陶瓷电子部件的所谓的陶瓷生片。本发明涉及形成具有凹凸复杂形状的绝缘层或类似层，同时保持其形状的精度，其形成位置的精度和厚度的均匀性。在根据本发明的方法中，在透光性基材上形成由包含具有所需电特性的粉末的感光材料制成的层。具有第一图案的紫外线的光从基体的背面照射到感光材料，并且具有第二图案的光如从基体的背面辐射到感光材料，感光材料被曝光。然后曝光后的感光层显影。

8. 发明申请

US20050194084A1 Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board 失效
标题翻译：多层陶瓷电子部件，电路板以及用于制造这些部件和电路板的陶瓷生片的制造方法
公开(公告)号：US20050194084A1
公开(公告)日：2005-09-08
申请号：US11068781
申请日：2005-03-02
申请人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
发明人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
IPC分类号： H01G4/12 , C03B29/00 , H01F17/00 , H01F41/04 , H01G4/00 , H01G4/30 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/06 , H05K3/46
CPC分类号： H05K3/4667 , C04B35/6269 , H01G4/30 , H05K1/0306 , H05K3/0023 , H05K2201/09881 , H05K2203/0514
摘要： The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a substrate an internal electrode having a predetermined thickness by a discretional process, forming a photosensitive ceramic slurry on a surface of the substrate or the layer and the internal electrode in such a way that its thickness just before exposure will be substantially equal to or smaller than the thickness of the internal electrode from the surface of the substrate or the layer, irradiating the photosensitive ceramic slurry with light from the upper side of the substrate to perform exposure while masking the internal electrode pattern, to selectively harden the surface of the photosensitive ceramic slurry, the exposure amount being controlled in such a way that the surface of the photosensitive ceramic slurry is hardened, and removing the portion of the photosensitive ceramic slurry that has not been exposed by a development process to expose a surface of the internal electrode pattern.
摘要翻译：本发明提供一种能够应对小型化，提高多层电子部件的性能和质量的电子部件的制造方法。通过在基板上或在基板上形成具有预定厚度的内部电极的层来形成陶瓷生片，在基板或层和内部电极的表面上形成感光陶瓷浆料使其刚刚曝光之前的厚度将基本上等于或小于从基板或层的表面的内部电极的厚度，用来自基板的上侧的光照射感光陶瓷浆料以进行曝光同时掩蔽内部电极图案，以选择性地硬化感光陶瓷浆料的表面，曝光量被控制为使得感光陶瓷浆料的表面硬化，并且去除不具有感光陶瓷浆料的部分感光陶瓷浆料通过显影处理曝光以暴露内部电极图案的表面。

9. 发明授权

US07611982B2 Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions 失效
标题翻译：形成具有用于形成多层布线板的异物部分的片材和具有外来部分的片材的方法
公开(公告)号：US07611982B2
公开(公告)日：2009-11-03
申请号：US10553517
申请日：2004-04-14
申请人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
发明人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
IPC分类号： H01L21/4763
CPC分类号： H05K1/16 , H01F17/0013 , H05K1/0306 , H05K1/162 , H05K1/165 , H05K3/4611 , H05K3/4629 , H05K2201/0187 , H05K2203/0156
摘要： The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.
摘要翻译：层叠型电子部件技术领域本发明涉及层叠型电子部件，其目的在于提供有助于电子部件的高集成度，小型化和提高可靠性的片材制造方法和片材。为了实现该目的，根据本发明的制造方法包括在支撑体上形成由正性抗蚀剂构成的层，反复进行曝光处理，显影处理以及将具有期望的电特性的物质沉积到获得相对于层的图案空间，然后移除支撑体。通过该制造方法提供由具有三种或更多种类型的不同物理性质的片材组成的片材，其中图案的纵横比等于或大于1。

10. 发明申请

US20050048415A1 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet 失效
标题翻译：制造陶瓷生片的方法和使用该陶瓷生片制造电子部件的方法
公开(公告)号：US20050048415A1
公开(公告)日：2005-03-03
申请号：US10926042
申请日：2004-08-26
申请人： Masayuki Yoshida , Junichi Sutoh , Shunji Aoki , Genichi Watanabe
发明人： Masayuki Yoshida , Junichi Sutoh , Shunji Aoki , Genichi Watanabe
IPC分类号： H01G4/12 , G03F7/00 , H01F41/00 , H01F41/04 , H01F41/34 , H01G4/30 , H01G13/00 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/02
CPC分类号： H05K3/0023 , H05K1/0306 , H05K1/092 , H05K3/0082 , H05K3/02 , H05K2201/0108 , H05K2203/016 , H05K2203/0514
摘要： The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.
摘要翻译：本发明涉及用于制造多层陶瓷电子部件的所谓的陶瓷生片。本发明旨在提高形成在片材上的电极或其它元件的形状精度，其位置精度及其厚度均匀性。在根据本发明的方法中，在透光性基材上形成由包含具有所需电特性的粉末的感光材料制成的层。具有期望图案的掩模设置在基底构件的背面上，并且感光材料通过掩模从基底构件的背面露出。然后曝光后的感光层显影。

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