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1. 发明授权

US07346415B2 Semiconductor wafer positioning method, and apparatus using the same 失效
标题翻译：半导体晶片定位方法及使用其的装置
公开(公告)号：US07346415B2
公开(公告)日：2008-03-18
申请号：US11296276
申请日：2005-12-08
申请人： Satoshi Ikeda , Masayuki Yamamoto
发明人： Satoshi Ikeda , Masayuki Yamamoto
IPC分类号： G06F19/00 , H01L21/68
CPC分类号： H01L21/681 , Y10S414/136
摘要： The intensity of light of a predetermined wavelength corresponding to the type of a protective tape joined to the surface of a semiconductor wafer is adjusted by a controller, and a holding stage for holding the semiconductor wafer is scanned rotationally. At this time, at a V notch portion for positioning formed in the semiconductor wafer, light is transmitted through the protective sheet covering the surface, which is received by a photoreception sensor. Based on the change in the reception amount of light in the photoreception sensor, the position of a detection site is specified.
摘要翻译：对应于与半导体晶片的表面接合的保护带的类型的预定波长的光的强度由控制器调节，用于保持半导体晶片的保持台被旋转地扫描。此时，在形成在半导体晶片中的用于定位的V形切口部分，透光通过覆盖由光接收传感器接收的表面的保护片。基于光接收传感器中的光的接收量的变化，指定检测部位的位置。

2. 发明申请

US20100171823A1 ALIGNMENT APPARATUS FOR SEMICONDUCTOR WAFER 审中-公开
标题翻译：半导体波形对准装置
公开(公告)号：US20100171823A1
公开(公告)日：2010-07-08
申请号：US12649120
申请日：2009-12-29
申请人： Masayuki Yamamoto , Satoshi Ikeda
发明人： Masayuki Yamamoto , Satoshi Ikeda
IPC分类号： H04N7/18 , G01B11/26
CPC分类号： H01L21/681
摘要： A wafer has an annular ridge formed along an outer periphery thereof to serve as a reinforcing portion, and a circuit pattern surrounded with the reinforcing portion. The wafer is placed on a wafer placement plane of a holding stage in a state that the circuit pattern is directed downward. The wafer placement plane is larger in size than the wafer. On the holding stage, a center of the wafer is aligned with a center of the holding stage in such a manner that a plurality of guide pins are engaged with relevant cutout portions formed on the reinforcing portion. Then, the holding stage rotates while suction-holding the reinforcing portion of the wafer, and simultaneously a photosensor detects a portion for alignment formed on the outer periphery of the wafer.
摘要翻译：晶片具有沿其外周形成的环形脊，用作加强部分，以及由加强部分包围的电路图案。将晶片放置在电路图案向下的状态下的保持台的晶片放置平面上。晶片放置平面的尺寸大于晶片。在保持台上，将晶片的中心与保持台的中心对准，使得多个引导销与形成在加强部上的相关切口部接合。然后，在保持晶片的加强部分的同时，保持台旋转，同时光电传感器检测形成在晶片的外周上的对准部分。

3. 发明申请

US20090011525A1 METHOD FOR JOINING ADHESIVE TAPE TO SEMICONDUCTOR WAFER AND METHOD FOR SEPARATING PROTECTIVE TAPE FROM SEMICONDUCTOR WAFER 失效
标题翻译：用于将粘合带粘合到半导体波长的方法和从半导体波形分离保护带的方法
公开(公告)号：US20090011525A1
公开(公告)日：2009-01-08
申请号：US12166127
申请日：2008-07-01
申请人： Masayuki Yamamoto , Satoshi Ikeda
发明人： Masayuki Yamamoto , Satoshi Ikeda
IPC分类号： H01L21/66
CPC分类号： H01L21/67132 , H01L21/67288
摘要： An arithmetic processing part in a controller detects a position of a defect such as a chip or a crack that occurs at an outer periphery of a semiconductor wafer, and then a memory in the controller stores position information of the defect. The controller reads the position information of the defect through a network in each process. On the basis of this position information, the controller determines a direction of joining a dicing tape to the semiconductor wafer or a direction of separating a protective tape from a front face of the semiconductor wafer.
摘要翻译：控制器中的算术处理部分检测在半导体晶片的外周发生的诸如芯片或裂纹的缺陷的位置，然后控制器中的存储器存储缺陷的位置信息。控制器在每个过程中通过网络读取缺陷的位置信息。基于该位置信息，控制器确定将切割带接合到半导体晶片的方向或者从半导体晶片的正面分离保护带的方向。

4. 发明申请

US20090009755A1 METHOD FOR DETECTING POSITION OF DEFECT ON SEMICONDUCTOR WAFER 失效
标题翻译：检测半导体波形缺陷位置的方法
公开(公告)号：US20090009755A1
公开(公告)日：2009-01-08
申请号：US12166037
申请日：2008-07-01
申请人： Masayuki Yamamoto , Satoshi Ikeda
发明人： Masayuki Yamamoto , Satoshi Ikeda
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/9503
摘要： A method of this invention involves: detecting a shape of an outer periphery of a semiconductor wafer with a first detecting device; determining a center position of the semiconductor wafer based on a detected result by the first detecting device; receiving a light beam reflected from a surface of the semiconductor wafer with a second detecting device; detecting an alignment part based on a detected result by the second detecting device to determine a position of the alignment part; and detecting a defect based on the detected result by the second detecting device to determine a position of the defect.
摘要翻译：本发明的方法涉及：利用第一检测装置检测半导体晶片的外周的形状; 基于所述第一检测装置的检测结果确定所述半导体晶片的中心位置; 用第二检测装置接收从半导体晶片的表面反射的光束; 基于所述第二检测装置的检测结果来检测对准部，以确定所述对准部的位置; 以及基于由所述第二检测装置检测到的结果来检测缺陷以确定所述缺陷的位置。

5. 发明授权

US07876432B2 Method for detecting position of defect on semiconductor wafer 失效
标题翻译：检测半导体晶片缺陷位置的方法
公开(公告)号：US07876432B2
公开(公告)日：2011-01-25
申请号：US12166037
申请日：2008-07-01
申请人： Masayuki Yamamoto , Satoshi Ikeda
发明人： Masayuki Yamamoto , Satoshi Ikeda
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/9503
摘要： A method of this invention involves: detecting a shape of an outer periphery of a semiconductor wafer with a first detecting device; determining a center position of the semiconductor wafer based on a detected result by the first detecting device; receiving a light beam reflected from a surface of the semiconductor wafer with a second detecting device; detecting an alignment part based on a detected result by the second detecting device to determine a position of the alignment part; and detecting a defect based on the detected result by the second detecting device to determine a position of the defect.
摘要翻译：本发明的方法涉及：利用第一检测装置检测半导体晶片的外周的形状; 基于所述第一检测装置的检测结果确定所述半导体晶片的中心位置; 用第二检测装置接收从半导体晶片的表面反射的光束; 基于所述第二检测装置的检测结果来检测对准部，以确定所述对准部的位置; 以及基于由所述第二检测装置检测到的结果来检测缺陷以确定所述缺陷的位置。

6. 发明授权

US07723211B2 Method for joining adhesive tape to semiconductor wafer and method for separating protective tape from semiconductor wafer 失效
标题翻译：将胶粘带接合到半导体晶片的方法和用于从半导体晶片分离保护带的方法
公开(公告)号：US07723211B2
公开(公告)日：2010-05-25
申请号：US12166127
申请日：2008-07-01
申请人： Masayuki Yamamoto , Satoshi Ikeda
发明人： Masayuki Yamamoto , Satoshi Ikeda
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67288
摘要： An arithmetic processing part in a controller detects a position of a defect such as a chip or a crack that occurs at an outer periphery of a semiconductor wafer, and then a memory in the controller stores position information of the defect. The controller reads the position information of the defect through a network in each process. On the basis of this position information, the controller determines a direction of joining a dicing tape to the semiconductor wafer or a direction of separating a protective tape from a front face of the semiconductor wafer.
摘要翻译：控制器中的算术处理部分检测在半导体晶片的外周发生的诸如芯片或裂纹的缺陷的位置，然后控制器中的存储器存储缺陷的位置信息。控制器在每个过程中通过网络读取缺陷的位置信息。基于该位置信息，控制器确定将切割带接合到半导体晶片的方向或者从半导体晶片的正面分离保护带的方向。

7. 发明申请

US20070139642A1 Method for determining position of semiconductor wafer, and apparatus using the same 失效
标题翻译：用于确定半导体晶片的位置的方法及其使用方法
公开(公告)号：US20070139642A1
公开(公告)日：2007-06-21
申请号：US11604355
申请日：2006-11-27
申请人： Satoshi Ikeda , Masayuki Yamamoto
发明人： Satoshi Ikeda , Masayuki Yamamoto
IPC分类号： G01B1/00
CPC分类号： G01B11/002 , G01B11/028 , G01N21/9503 , H01L21/681 , Y10S451/914
摘要： A light source emits light toward a semiconductor wafer, and a light receiving sensor detects light passing a peripheral edge of the semiconductor wafer. Each coordinates of the peripheral edge of the semiconductor wafer is obtained from a result of the detection. Further, a center of the semiconductor wafer is obtained from a group of the coordinates. Then, an illumination device emits light toward the peripheral edge of the semiconductor wafer and an optical camera detects light reflected from the peripheral edge of the semiconductor wafer. A position of a “V”-shaped notch formed on the peripheral edge of the semiconductor wafer is obtained from a result of the detection. A handling position of the semiconductor wafer is determined based on the center of the semiconductor wafer and the position of the “V”-shaped notch.
摘要翻译：光源朝向半导体晶片发光，光接收传感器检测通过半导体晶片周边的光。从该检测结果可以得到半导体晶片的周缘的各坐标。此外，从一组坐标获得半导体晶片的中心。然后，照明装置朝向半导体晶片的周缘发光，光学摄像机检测从半导体晶片的周缘反射的光。从该检测结果可以得到形成在半导体晶片的周缘上的“V”字槽口的位置。基于半导体晶片的中心和“V”形凹口的位置确定半导体晶片的处理位置。

8. 发明授权

US07849899B2 Adhesive film position detector and adhesive film joining apparatus 失效
标题翻译：粘合胶片位置检测器和粘合膜接合装置
公开(公告)号：US07849899B2
公开(公告)日：2010-12-14
申请号：US12392372
申请日：2009-02-25
申请人： Masayuki Yamamoto , Satoshi Ikeda
发明人： Masayuki Yamamoto , Satoshi Ikeda
IPC分类号： B32B41/00
CPC分类号： B32B38/1841 , B32B2457/14 , B32B2457/202 , G01B11/02 , G01B11/028 , G02B27/62
摘要： An illuminator emits light obliquely to an end of an adhesive film. A CCD camera is provided in a direction perpendicular to the adhesive film to capture an image of the light reflected irregularly from the end of the adhesive film. A black plate is provided on a back side of the adhesive film. In the image obtained by the CCD camera, therefore, only the end of the adhesive film is displayed whitely in a line shape. A position of the adhesive film is determined based on a line corresponding to the end of the adhesive film. Since the light reflected from the end of the adhesive film is utilized, the position of the adhesive film can be determined accurately irrespective of a color of the adhesive film, a color of a base film to which the adhesive film is joined, and a depth of each color.
摘要翻译：照明器向粘合膜的一端倾斜发光。在垂直于粘合膜的方向上设置CCD照相机，以捕获从粘合膜的端部不规则地反射的光的图像。在粘合膜的背面设置黑色板。因此，在由CCD照相机获得的图像中，只有粘合膜的端部以白线形显示。基于与粘合膜的端部对应的线来确定粘合膜的位置。由于使用从粘合膜的端部反射的光，因此可以准确地确定粘合膜的位置，而不管粘合膜的颜色，粘合膜的基底膜的颜色，以及粘合膜的接合深度的每种颜色。

9. 发明申请

US20100171966A1 ALIGNMENT APPARATUS FOR SEMICONDUCTOR WAFER 审中-公开
标题翻译：半导体波形对准装置
公开(公告)号：US20100171966A1
公开(公告)日：2010-07-08
申请号：US12648565
申请日：2009-12-29
申请人： Masayuki Yamamoto , Kenji Nonomura , Satoshi Ikeda
发明人： Masayuki Yamamoto , Kenji Nonomura , Satoshi Ikeda
IPC分类号： G01B11/14
CPC分类号： H01L21/681
摘要： An alignment apparatus of this invention includes a holding stage that is larger in size than a semiconductor wafer, and an optical sensor that optically detects a position of a peripheral edge of the semiconductor wafer placed on and suction-held by the holding stage. The holding stage has a slits formed thereon vertically in a circumferential direction, and an outer periphery of the semiconductor wafer lies on the slits. The optical sensor is of a transparent type and includes a projector and a photodetector opposed vertically to each other with the slit interposed therebetween. The optical sensor measures the peripheral edge of the semiconductor wafer on the slits of the holding stage.
摘要翻译：本发明的对准装置包括尺寸大于半导体晶片的保持台，以及光学检测放置在保持台上并被保持的半导体晶片的周缘的位置的光学传感器。保持台具有在周向上垂直形成的狭缝，并且半导体晶片的外周位于狭缝上。光学传感器是透明型的，并且包括投影仪和光电探测器，它们彼此垂直对置，并且狭缝插入其间。光学传感器在保持台的狭缝上测量半导体晶片的周边边缘。

10. 发明申请

US20090218046A1 ADHESIVE FILM POSITION DETECTOR AND ADHESIVE FILM JOINING APPARATUS 失效
标题翻译：粘合胶片位置检测器和粘合胶片接合装置
公开(公告)号：US20090218046A1
公开(公告)日：2009-09-03
申请号：US12392372
申请日：2009-02-25
申请人： Masayuki Yamamoto , Satoshi Ikeda
发明人： Masayuki Yamamoto , Satoshi Ikeda
IPC分类号： B65H19/18
CPC分类号： B32B38/1841 , B32B2457/14 , B32B2457/202 , G01B11/02 , G01B11/028 , G02B27/62
摘要： An illuminator emits light obliquely to an end of an adhesive film. A CCD camera is provided in a direction perpendicular to the adhesive film to capture an image of the light reflected irregularly from the end of the adhesive film. A black plate is provided on a back side of the adhesive film. In the image obtained by the CCD camera, therefore, only the end of the adhesive film is displayed whitely in a line shape. A position of the adhesive film is determined based on a line corresponding to the end of the adhesive film. Since the light reflected from the end of the adhesive film is utilized, the position of the adhesive film can be determined accurately irrespective of a color of the adhesive film, a color of a base film to which the adhesive film is joined, and a depth of each color.
摘要翻译：照明器向粘合膜的一端倾斜发光。在垂直于粘合膜的方向上设置CCD照相机，以捕获从粘合膜的端部不规则地反射的光的图像。在粘合膜的背面设置黑色板。因此，在由CCD照相机获得的图像中，只有粘合膜的端部以白线形显示。基于与粘合膜的端部对应的线来确定粘合膜的位置。由于使用从粘合膜的端部反射的光，因此可以准确地确定粘合膜的位置，而不管粘合膜的颜色，粘合膜的基底膜的颜色，以及粘合膜的接合深度的每种颜色。

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