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1. 发明授权

US5616164A Methods for making metal particle spherical and removing oxide film solder paste and soldering method 失效
标题翻译：制造金属颗粒球形和去除氧化膜焊膏的方法和焊接方法
公开(公告)号：US5616164A
公开(公告)日：1997-04-01
申请号：US367775
申请日：1995-01-03
申请人： Masayuki Ochiai , Kaoru Hashimoto , Toshimi Kawahara , Mayumi Osumi
发明人： Masayuki Ochiai , Kaoru Hashimoto , Toshimi Kawahara , Mayumi Osumi
IPC分类号： B22F1/00 , B23K1/20 , B23K35/02 , B23K35/26 , B23K35/30 , B23K35/36 , C23G5/032 , H05K3/34 , C23G5/00
CPC分类号： B22F1/0048 , B23K1/20 , B23K35/0244 , B23K35/36 , C23G5/032 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/268 , B23K35/3006 , H05K3/3431 , H05K3/3484 , H05K3/3494
摘要： Metal such as solder is immersed in a heating medium containing a rosin or derivative thereof and an organic solvent and heated to a temperature above the melting point of the metal, to remove the oxide film of the metal and make the metal spherical. If a hardened caster oil or high softening point rosin or derivative thereof is further added as a thickener to the heating medium, the size increase of the metal particle can be prevented. By heating at a temperature lower than the melting point of the metal, the oxide film can be removed without making the particles spherical. Using thus obtained solder particles, fluxless soldering can be done. Also, a fluxless soldering method is provided.
摘要翻译：将诸如焊料的金属浸入含有松香或其衍生物和有机溶剂的加热介质中，并加热至高于金属熔点的温度，以除去金属的氧化物膜并使金属球形。如果进一步将加硬的脚轮油或高软化点松香或其衍生物作为增稠剂加入到加热介质中，则可以防止金属颗粒的尺寸增加。通过在比金属的熔点低的温度下加热，可以除去氧化膜而不使颗粒成球形。使用如此获得的焊料颗粒，可以进行无焊剂焊接。另外，提供无焊剂焊接方法。

2. 发明授权

US5284796A Process for flip chip connecting a semiconductor chip 失效
标题翻译：用于倒装芯片连接半导体芯片的工艺
公开(公告)号：US5284796A
公开(公告)日：1994-02-08
申请号：US939695
申请日：1992-09-02
申请人： Teru Nakanishi , Kazuaki Karasawa , Masayuki Ochiai , Kaoru Hashimoto
发明人： Teru Nakanishi , Kazuaki Karasawa , Masayuki Ochiai , Kaoru Hashimoto
IPC分类号： H01L21/60 , H05K3/30 , H05K3/34 , H01L21/283 , H01L21/58
CPC分类号： H01L24/81 , H01L2224/10135 , H01L2224/1134 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/45124 , H01L2224/45144 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12033 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/303 , H05K3/3431
摘要： A process for a flip chip connection of a semiconductor chip includes the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and on the outside of the solder bumps, providing a cut groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.
摘要翻译：一种用于半导体芯片的倒装芯片连接的方法包括以下步骤：在半导体芯片的外周附近形成有多个焊料凸块的半导体芯片上形成多个凸块凸块，焊料凸起，在多个焊料凸块和凸块凸块之间提供切割槽，将半导体芯片上的焊料凸块与电路板上的相应焊料凸块配合，并加热用于随后的配合焊料凸块的集成，以及断开方式在倒装芯片连接之后沿着切割凹槽的半导体芯片的外周部分，以便去除凸块凸块。

3. 发明授权

US07531115B2 Conductive material and method for filling via-hole 有权
标题翻译：用于填充通孔的导电材料和方法
公开(公告)号：US07531115B2
公开(公告)日：2009-05-12
申请号：US11074729
申请日：2005-03-09
申请人： Isao Watanabe , Kaoru Hashimoto , Osamu Taniguchi
发明人： Isao Watanabe , Kaoru Hashimoto , Osamu Taniguchi
IPC分类号： H01B1/02
CPC分类号： H01L21/76898 , H05K1/0306 , H05K3/4061 , H05K2201/0272 , H05K2201/0347 , H05K2203/0425 , H05K2203/085 , H05K2203/1105 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49169
摘要： The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.
摘要翻译：导电材料包括熔点不超过250℃的第一金属材料和熔点不低于500℃的第二金属材料，并且在不高于250℃的温度下是糊状物由此导电材料的导电率可以高于树脂浆料。导电材料可以用于糊料，由此导电材料可以以与树脂浆料相同的方式埋在通孔中。

4. 发明授权

US6156259A Method of manufacturing piezoelectric materials 失效
标题翻译：制造压电材料的方法
公开(公告)号：US6156259A
公开(公告)日：2000-12-05
申请号：US540028
申请日：1995-10-06
申请人： Motoyuki Nishizawa , Mineharu Tsukada , Kaoru Hashimoto , Nobuo Kamehara
发明人： Motoyuki Nishizawa , Mineharu Tsukada , Kaoru Hashimoto , Nobuo Kamehara
IPC分类号： C04B35/46 , C04B35/472 , C04B35/497 , C04B35/499 , C04B35/645 , H01L41/187 , H01L41/39 , C04B33/32
CPC分类号： C04B35/497 , C04B35/499 , C04B35/6455 , H01L41/1875 , H01L41/43
摘要： In a method of manufacturing piezoelectric ceramics by molding pre-fired or calcined powders of ingredients of a piezoelectric ceramic material and sintering the powder mold at a high pressure, the powder mold is pre-sintered at an atmospheric pressure before sintering at high pressure (HIP). Preferably, after the sintering HIP step, a thermal treatment is performed at a temperature of from 500 to 1000.degree. C. under an oxidizing atmosphere. For a Pb(Zn.sub.1/3 Nb.sub.2/3)O.sub.3 --PbTiO.sub.3 based piezoelectric ceramic, the composition is preferably set to (Pb.sub.1-x Ba.sub.x)[(Zn.sub.1/3 Nb.sub.2/3).sub.1-y Ti.sub.y ]O.sub.3, where 0.001
摘要翻译：在通过模制压电陶瓷材料的预成型或煅烧粉末并在高压下烧结粉末模具来制造压电陶瓷的方法中，在高压烧结（HIP）之前将粉末模具在大气压下预烧结）。优选在烧结HIP工序后，在氧化气氛下，在500〜1000℃的温度下进行热处理。对于Pb（Zn1 / 3Nb2 / 3）O3-PbTiO3基压电陶瓷，组合物优选设定为（Pb1-xBax）[（Zn1 / 3Nb2 / 3）1-yTiy] O3，其中0.001

5. 发明授权

US5440454A Electrical connecting device and method for making same 失效
标题翻译：电气连接装置及其制造方法
公开(公告)号：US5440454A
公开(公告)日：1995-08-08
申请号：US277992
申请日：1994-07-20
申请人： Kaoru Hashimoto , Tatsuo Chiyonobu , Kyoichiro Kawano , Kouji Watanabe
发明人： Kaoru Hashimoto , Tatsuo Chiyonobu , Kyoichiro Kawano , Kouji Watanabe
IPC分类号： H01R13/03 , H01L21/48 , H01L23/498 , H01R24/00 , H01R43/00 , H01R43/16 , H05K3/34 , H05K1/02
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49811 , H01L23/49866 , H05K3/3436 , H05K3/3463 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K2201/0373 , H05K2201/09863 , H05K2203/0594 , H05K2203/1105 , Y02P70/613 , Y10T29/49126 , Y10T29/49204 , Y10T29/49215
摘要： An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.
摘要翻译：一种电连接装置，包括在其上设置有输入/输出端子的第一电路板，每个端子具有涂覆有镓的尖端表面和在其上设置有接触端子的第二电路板，每个端子具有涂覆有铟的尖端表面或锡。当第一电路板的输入/输出端子与第二电路板的各个端子接触并且彼此电连接时，通过镓和铟或锡之间的相互作用形成低熔点合金层。第二金属层包括大致垂直于端子表面延伸的多个线状金属支撑体和由线状金属支撑体保持的低熔点金属。

6. 发明授权

US5262118A Method for producing a hollow FRP article 失效
标题翻译：中空玻璃钢制品的制造方法
公开(公告)号：US5262118A
公开(公告)日：1993-11-16
申请号：US853978
申请日：1992-03-20
申请人： Toshihari Fukushima , Masuhiro Okada , Kaoru Hashimoto , Eizi Abe , Kunio Hiyama
发明人： Toshihari Fukushima , Masuhiro Okada , Kaoru Hashimoto , Eizi Abe , Kunio Hiyama
IPC分类号： B29C43/12 , B29C49/20 , B29C70/08 , B29C70/44 , B29C70/86
CPC分类号： B29C70/44 , B29C49/20 , B29C70/086 , B29C70/86 , B29C43/12 , B29L2031/5227
摘要： In the production of a hollow FRP article such as a wood type carbon black golf club head, a hollow resin shell is formed via blow molding, heat-resistant fine particles are filled as a filler into the interior of the resin shell, the interior of the resin shell is decompressed to form an inner mold, the inner mold is covered with FRP prepreg including thermoplastic resin to form a prepreg composite, the prepreg composite is heated in a metallic mold under pressure and the fine articles are removed after demolding. A golf club shaft is formed by heating a mandrel, applying thermoplastic resin powder to the mandrel and then winding a lamellar prepreg around the mandrel to thereby form a hollow shaft. A golf club is formed from a head and shaft formed as described above by enlarging the end of the shaft, placing the shaft and the head in a mold and heating the mold under pressure.
摘要翻译：在制造中空玻璃钢制品如木质炭黑高尔夫球杆头时，通过吹塑成型形成中空树脂壳，将耐热细颗粒作为填料填充到树脂壳的内部，内部减压树脂壳形成内模，内模用包括热塑性树脂的FRP预浸料覆盖以形成预浸料复合材料，在金属模具中加压预浸料复合材料，脱模后除去精细制品。通过加热心轴，将热塑性树脂粉末施加到心轴上，然后围绕心轴缠绕层状预浸料，从而形成空心轴，形成高尔夫球杆杆。如上所述，通过放大轴的端部，将轴和头部放置在模具中并在压力下加热模具，由如上所述形成的头部和轴部形成高尔夫球杆。

7. 发明授权

US5016051A Electrophotographic copying machine with device for shifting an image 失效
标题翻译：具有用于移动图像的装置的电子照相复印机
公开(公告)号：US5016051A
公开(公告)日：1991-05-14
申请号：US432392
申请日：1989-11-08
申请人： Takeshi Morikawa , Kaoru Hashimoto , Hiroyuki Ideyama
发明人： Takeshi Morikawa , Kaoru Hashimoto , Hiroyuki Ideyama
IPC分类号： G03G15/00 , G03G15/04
CPC分类号： G03G15/50 , G03G15/04 , G03G15/6564 , G03G15/041 , G03G2215/00405 , G03G2215/00409 , G03G2215/00556 , G03G2215/00599
摘要： A copying machine of the scanning exposure type has a device for entering the position on a copy sheet where a copy image corresponding to a document image is to be formed. According to the input from the device, the operation timing of a feeder is controlled which feeds the copy sheet to a position where an image formed by scanning exposure on a photosensitive member is transferred from the member to the sheet, such that the copy image is formed on the specified position on the sheet. When an edition copy mode is set or the image forming position input is given with the setting of this mode, the scanner is controlled to move a distance which permits a shift of the document image as specified by the position input.
摘要翻译：扫描曝光型的复印机具有用于进入复印纸上的位置的装置，其中将形成与原稿图像相对应的复印图像。根据来自设备的输入，控制馈送器的操作定时，其将复印片材馈送到通过在感光部件上的扫描曝光形成的图像从该部件转印到片材的位置，使得复印图像为形成在纸张上的指定位置。当设置版本复制模式或通过该模式的设置来给出图像形成位置输入时，扫描器被控制以移动一定距离，该距离允许由位置输入指定的文档图像的移动。

8. 发明授权

US4786942A Image forming apparatus 失效
标题翻译：图像形成装置
公开(公告)号：US4786942A
公开(公告)日：1988-11-22
申请号：US83039
申请日：1987-08-07
申请人： Keiji Kusumoto , Kaoru Hashimoto , Kenzo Nagata
发明人： Keiji Kusumoto , Kaoru Hashimoto , Kenzo Nagata
IPC分类号： G03G15/08
CPC分类号： G03G15/0849 , G03G15/0853
摘要： An electrostatic latent image formed on a surface of a photoconductor drum 61 of a copying apparatus is caused to be visible by a developing device 4. The developing device 4 comprises a toner tank 43 and a toner supply roller 44 for supplying toner to a developer container 45. A toner density in the developer container 45 is detected by a sensor 11 and a detecting circuit 1. When irregular supply of toner is requested through a switch 91, a control circuit 2 compares the detected toner density with a prescribed density and drives the roller 44 to supply toner till the detected density attains the prescribed density. If copy operation is instructed through a switch 92 during the supply of toner, the control circuit 2 permits the copy operation and the supply of toner is continued during the copy operation.
摘要翻译：通过显影装置4使形成在复印装置的感光鼓61的表面上的静电潜像被显影装置4可见。显影装置4包括调色剂罐43和调色剂供应辊44，用于将调色剂供应到显影剂容器显影剂容器45中的调色剂浓度由传感器11和检测电路1检测。当通过开关91要求不规则的调色剂供应时，控制电路2将检测到的调色剂浓度与规定的浓度进行比较，并驱动辊44供应调色剂，直到检测到的浓度达到规定的浓度。如果在供给调色剂期间通过开关92指示复印操作，则控制电路2允许复印操作，并且在复印操作期间继续供应调色剂。

9. 发明授权

US6121062A Process of fabricating semiconductor unit employing bumps to bond two components 失效
标题翻译：制造半导体单元的方法，该半导体单元采用凸块来结合两个部件
公开(公告)号：US6121062A
公开(公告)日：2000-09-19
申请号：US606503
申请日：1996-02-23
申请人： Kazuaki Karasawa , Teru Nakanishi , Kaoru Hashimoto , Toshihiro Sakamura
发明人： Kazuaki Karasawa , Teru Nakanishi , Kaoru Hashimoto , Toshihiro Sakamura
IPC分类号： H01L21/60 , H01L21/66 , H01L23/485 , H05K3/34 , G01R31/26 , H01L21/44 , H01L21/48
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L22/12 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/81136 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12043 , H05K3/3431
摘要： A bump forming step forms a predetermined number of bumps on at least a first one of two components. A height measuring step measures the heights of the predetermined number of bumps. A fixing step fixes the two components together by means of the bumps with the distance between the two components determined, using the result of the height measurement, so that all of the predetermined number of bumps should come in contact with the second one of the two components. An oxide-film removing step removes the oxide film formed on the predetermined number of bumps after the height measuring step and before the fixing step. The fixing step comprises a press fixing step for press fixing the two components at the above distance by means of a press fixing method, and a melting step for causing the bumps to melt in a predetermined atmosphere so that the bumps firmly join the two components together. The distance is established by at least one of the press fixing step and the melting step.
摘要翻译：凸起形成步骤在两个部件中的至少第一个部件上形成预定数量的凸块。高度测量步骤测量预定数量的凸块的高度。固定步骤通过使用高度测量的结果确定的两个部件之间的距离通过凸块将两个部件固定在一起，使得所有预定数量的凸块应该与两个部件中的第二个部件接触组件。氧化膜去除步骤在高度测量步骤之后和定影步骤之前去除在预定数量的凸块上形成的氧化膜。定影步骤包括用于通过压力定影方法将两个部件压在上述距离处的压力固定步骤，以及用于使凸起在预定的气氛中熔化的熔化步骤，使得凸块牢固地将两个部件连接在一起。通过压力固定步骤和熔融步骤中的至少一个来建立距离。

10. 发明授权

US5779492A Connector employing liquid conductor for electrical contact 失效
标题翻译：连接器采用液体导体进行电接触
公开(公告)号：US5779492A
公开(公告)日：1998-07-14
申请号：US788699
申请日：1997-01-24
申请人： Takeshi Okuyama , Kouji Watanabe , Tatsuo Chiyonobu , Kaoru Hashimoto , Kyoichiro Kawano
发明人： Takeshi Okuyama , Kouji Watanabe , Tatsuo Chiyonobu , Kaoru Hashimoto , Kyoichiro Kawano
IPC分类号： H01L23/32 , H01R3/08 , H01R13/03 , H01R24/00 , H01R33/76 , H01R107/00
CPC分类号： H01R13/03 , H01R12/523 , H01R12/58 , H01R3/08
摘要： A first contact member comprises a liquid conductor which comes into contact with a second contact member so as to establish the electric connection between the two contact members. A container contains the first contact member therein. The second contact member is pin-shaped. The container is tube-shaped and has a containing portion, which is filled with the liquid conductor, and has an opening through which the second contact member is inserted. An area contraction portion for contracting the cross sectional area of the container is formed at a position between the containing portion and the opening. The container is installed in a through hole provided in a base member. The container includes a pipe member of an electric conductor which comes into direct contact with the liquid conductor and a plug member to be inserted into the hole, before the pipe member is inserted, for preventing the liquid conductor from escaping from the container. The container is formed of elastic material. The portion of the container near to the opening is split into segments and portions of the segments are positioned away from each other as the portions are near to the opening so that the outer diameter of the segments is larger than the inner diameter of the hole before the container is installed into the hole, the segments approaching each other as the container is being inserted into the hole against the elastic force of the segments.
摘要翻译：第一接触构件包括与第二接触构件接触以便建立两个接触构件之间的电连接的液体导体。容器中包含第一接触构件。第二接触构件是针形。容器是管状的，并且具有填充有液体导体的容纳部分，并且具有插入第二接触构件的开口。用于收缩容器的横截面积的区域收缩部分形成在容纳部分和开口之间的位置处。容器安装在设置在基座构件中的通孔中。容器包括在插入管构件之前与液体导体直接接触的电导体的管构件和插入孔中的插塞构件，以防止液体导体从容器中逸出。容器由弹性材料形成。容器的靠近开口的部分被分割成段，并且部分的部分彼此远离彼此，因为部分靠近开口，使得段的外径大于孔的内径容器被安装到孔中，当容器相对于段的弹力被插入到孔中时，段彼此接近。

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