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    • 1. 发明授权
    • Piezoelectric fan and air cooling apparatus using the piezoelectric fan
    • 使用压电风扇的压电风扇和空气冷却装置
    • US09368426B2
    • 2016-06-14
    • US13370341
    • 2012-02-10
    • Masayoshi TanidaMidori SunagaHiroaki Wada
    • Masayoshi TanidaMidori SunagaHiroaki Wada
    • H01L23/467F04D33/00H05K7/20
    • H01L23/467F04D33/00H01L2924/0002H01L2924/3011H05K7/20172H01L2924/00
    • A piezoelectric fan includes a vibration plate one end of which in a length direction is supported in a fixed manner and the other end of which in the length direction is a free end; and piezoelectric elements, attached on at least one of front and back surfaces of the vibration plate. In an intermediate portion of the vibration plate in the length direction, a right-angle bent portion is provided, and a plurality of divided blades are defined by slits in an area of the vibration plate extending from the free end to a position located a predetermined distance from the bent portion toward the free end. The piezoelectric element is attached on the portion of the vibration plate between the fixed end and the bent portion. Hence, variations in resonant frequency among the blades are reduced and the blades are efficiently excited using a common piezoelectric element.
    • 压电风扇包括振动板,其一端在长度方向上以固定方式支撑,另一端在长度方向上为自由端; 以及安装在振动板的前表面和后表面中的至少一个上的压电元件。 在振动板的长度方向的中间部分,设置有直角弯曲部,并且在振动板的从自由端延伸到位于规定的位置的位置的狭缝中形成有多个分割叶片 从弯曲部分向自由端的距离。 压电元件安装在固定端和弯曲部分之间的振动板的部分上。 因此,叶片之间的谐振频率的变化减小,并且使用公共的压电元件有效地激励叶片。
    • 7. 发明授权
    • Semiconductor device and control method of the same
    • 半导体器件及其控制方法相同
    • US07606085B2
    • 2009-10-20
    • US11501449
    • 2006-08-08
    • Hiroaki WadaKazuhiro Kurihara
    • Hiroaki WadaKazuhiro Kurihara
    • G11C5/14
    • G11C16/30G11C5/147H04N5/23241
    • The present invention is a semiconductor device including: a resistor R11 (first resistor part) and an FET 15 (second resistor part) connected in series between a power supply Vcc (first power supply) and ground (second power supply); an output node N11 provided between the resistor R11 and FET 15 and used for outputting a reference voltage; a feedback node N12 provided between the power supply Vcc and the ground; and a voltage control circuit (19) that maintains a voltage of the feedback node N12 at a constant level by using the reference voltage of the output node N11 and the voltage of the feedback node N12. The present invention can provide a semiconductor device having a reference voltage generating circuit capable of generating the reference voltage that does not greatly depend on a power supply voltage and its control method.
    • 本发明是一种半导体器件,包括:串联连接在电源Vcc(第一电源)和地(第二电源)之间的电阻器R11(第一电阻器部分)和FET 15(第二电阻器部件); 输出节点N11,设置在电阻器R11和FET15之间,用于输出参考电压; 设置在电源Vcc和地之间的反馈节点N12; 以及通过使用输出节点N11的参考电压和反馈节点N12的电压将反馈节点N12的电压维持在恒定电平的电压控制电路(19)。 本发明可以提供一种具有能够产生不依赖于电源电压的参考电压的参考电压产生电路及其控制方法的半导体器件。
    • 8. 发明申请
    • Semiconductor device and control method of the same
    • 半导体器件及其控制方法相同
    • US20070030740A1
    • 2007-02-08
    • US11501449
    • 2006-08-08
    • Hiroaki WadaKazuhiro Kurihara
    • Hiroaki WadaKazuhiro Kurihara
    • G11C5/14
    • G11C16/30G11C5/147H04N5/23241
    • The present invention is a semiconductor device including: a resistor R11 (first resistor part) and an FET 15 (second resistor part) connected in series between a power supply Vcc (first power supply) and ground (second power supply); an output node N11 provided between the resistor R11 and FET 15 and used for outputting a reference voltage; a feedback node N12 provided between the power supply Vcc and the ground; and a voltage control circuit (19) that maintains a voltage of the feedback node N12 at a constant level by using the reference voltage of the output node N11 and the voltage of the feedback node N12. The present invention can provide a semiconductor device having a reference voltage generating circuit capable of generating the reference voltage that does not greatly depend on a power supply voltage and its control method.
    • 本发明是一种半导体器件,包括:串联连接在电源Vcc(第一电源)和地(第二电源)之间的电阻器R11(第一电阻器部分)和FET 15(第二电阻器部件); 输出节点N11,设置在电阻器R11和FET15之间,用于输出参考电压; 设置在电源Vcc和地之间的反馈节点N12; 以及通过使用输出节点N11的参考电压和反馈节点N12的电压将反馈节点N12的电压维持在恒定电平的电压控制电路(19)。 本发明可以提供一种具有能够产生不依赖于电源电压的参考电压的参考电压产生电路及其控制方法的半导体器件。
    • 9. 发明授权
    • Process for making a silicon carbide sintered body
    • 制造碳化硅烧结体的方法
    • US6001756A
    • 1999-12-14
    • US853719
    • 1997-05-09
    • Yoshitomo TakahashiHiroaki WadaTaro Miyamoto
    • Yoshitomo TakahashiHiroaki WadaTaro Miyamoto
    • C04B35/575C04B35/569
    • C04B35/575
    • A silicon carbide sintered body according to the present invention is a silicon carbide sintered body having a density of 2.9 g/cm.sup.3 or higher, obtained by means of hot pressing a mixture of silicon carbide powder and a non-metal-based sintering additive such as an organic compound which produces carbon upon heating at a temperature of 2,000.degree. C. to 2,400.degree. C. and under a pressure of 300 to 700 kgf/cm.sup.2 in a non-oxidizing atmosphere. It is preferable that the silicon carbide powder have an average particle diameter of from 0.01 to 10 .mu.m and that the non-metal sintering additive be a resol type phenol resin. The present invention is to provide a silicon carbide sintered body of high quality which has a high density, a high purity, and a high electrical conductivity and which is useful for semiconductor manufacturing industry.
    • 根据本发明的碳化硅烧结体是通过热压碳化硅粉末和非金属类烧结添加剂的混合物得到的密度为2.9g / cm 3以上的碳化硅烧结体,例如 在非氧化性气氛中,在2,000〜2400℃,300〜700kgf / cm2的压力下加热生成碳的有机化合物。 碳化硅粉末的平均粒径优选为0.01〜10μm,非金属烧结添加剂为甲阶型酚醛树脂。 本发明提供一种高密度,高纯度,高导电性的高品质碳化硅烧结体,可用于半导体制造业。