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    • 10. 发明授权
    • Method of forming flat multicore wire
    • 形成扁平多芯线的方法
    • US5179779A
    • 1993-01-19
    • US728503
    • 1991-07-11
    • Kazuo IuraYoshiaki YamanoKazuhito Saka
    • Kazuo IuraYoshiaki YamanoKazuhito Saka
    • H01R43/02H01R43/28H02G1/12
    • H02G1/1275H01R43/0228H01R43/28H02G1/1256Y10T29/4921Y10T29/514
    • The present invention improves the quality and productivity in a coating peeling-off process in which the coating at an intermediate portion along the length of a wire is peeled off in order to expose a conductor inside the coated wire, while enabling coatings at intermediate portions along the length of multicore wires or small-diameter wires to be peeled off.In a primary process, a heating jig 16 is brought into press contact with the upper half portion of the coating of the peeling-off designated portion at an intermediate portion along the length of coated wires 1 so as to press down the coating downwardly relative to the transverse direction of the wires, whereby a coating peeled-off portion 20 in which a part of conductors 2 is exposed is formed. Afterwards, in a secondary process, the coating of the coating peeled-off portion 20 is cut and press held at the ends thereof by cutting and peeling-off blades 13 adapted to operate from the ends of the coating peeled-off portion 2 toward the center thereof so as to remove the coating of the coating peeled-off portion 20, whereby a coating peeled-off portion 131 is formed.
    • 本发明提高了在涂层剥离过程中的质量和生产率,其中沿着线的长度的中间部分处的涂层被剥离以暴露涂覆的丝线内的导体,同时使得在中间部分处的涂层 多芯线或小直径线的长度要剥离。 在主要方法中,加热夹具16沿着涂覆线1的长度在中间部分与剥离指定部分的涂层的上半部分压接,以相对于涂覆线1向下压下涂层 电线的横向,形成导体2的一部分露出的被覆剥离部20。 之后,在第二工序中,通过切割和剥离适于从涂层剥离部分2的端部进行操作的刀片13将涂层剥离部分20的涂层切割并剥离 中心,以除去涂层剥离部分20的涂层,从而形成涂层剥离部分131。