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    • 1. 发明授权
    • Compound semiconductor epitaxial wafer
    • 化合物半导体外延片
    • US6057592A
    • 2000-05-02
    • US101431
    • 1998-10-21
    • Masataka WatanabeTsuneyuki KaiseMasayuki ShinoharaMasahisa EndouTohru Takahashi
    • Masataka WatanabeTsuneyuki KaiseMasayuki ShinoharaMasahisa EndouTohru Takahashi
    • H01L21/20H01L21/203H01L21/205H01L33/30H01L29/167
    • H01L33/30H01L33/12
    • At the time of forming an alloy composition gradient layer 4 of gallium arsenide phosphide GaAs.sub.x P.sub.1-x having an arsenic alloy composition x changed in such a range as not to exceed a predetermined alloy composition a with an increase of a layer thickness d between a GaP layer 3 and a composition constant layer 5 of gallium arsenide phosphide GaAs.sub.a P.sub.1-a having the predetermined alloy composition a to be grown above the GaP layer; the alloy composition x is abruptly ascended as in composition ascending zones C11 to C13 with the ascended thickness d of an epitaxial layer and then descended as in crystal stabilizing zones S11 to S13 in such a range as not to cancel the previous ascent amount. One or more combinations of such ascent and descent in the alloy composition are repeated to form as distributed in the alloy composition gradient layer 4, and then the alloy composition x is ascended to the predetermined alloy composition a. Thereby there is obtained a compound semiconductor epitaxial wafer which can effectively eliminate stresses caused by lattice mismatching, can be made thinner with an excellent productivity, and can have a high luminance due to employment of a reflective layer.
    • PCT No.PCT / JP97 / 00050 Sec。 371日期:1998年10月21日 102(e)日期1998年10月21日PCT 1997年1月13日PCT PCT。 公开号WO97 / 25747 日期1997年7月17日在形成具有砷合金组成x的砷化镓磷化镓GaAs xP 1-x的合金组成梯度层4的时间在不超过预定合金组成a的范围内变化,层厚增加 在GaP层上方生长具有规定的合金组成a的GaP层3和砷化磷化镓GaAsaP1-a的组成恒定层5之间的d; 如同外延层的上升厚度d的组成上升区域C11至C13中的合金组成x突然上升,然后如在晶体稳定区域S11至S13中下降到不消除先前上升量的范围内。 重复合金组合物中这种上升和下降的一种或多种组合,以形成分布在合金组成梯度层4中,然后合金组合物x上升到预定的合金组成a。 由此,可以获得能有效消除由晶格失配引起的应力的化合物半导体外延晶片,能够以优异的生产率变薄,并且由于使用反射层而具有高的亮度。
    • 4. 发明授权
    • Method for manufacturing compound semiconductor epitaxial wafer
    • 化合物半导体外延片的制造方法
    • US06171394B2
    • 2001-01-09
    • US09081662
    • 1998-05-20
    • Masataka WatanabeTsuneyuki KaiseMasayuki Shinohara
    • Masataka WatanabeTsuneyuki KaiseMasayuki Shinohara
    • C30B2514
    • C30B25/02C30B29/40H01L21/02392H01L21/02395H01L21/02461H01L21/02463H01L21/0251H01L21/02543
    • A method for manufacturing compound semiconductor epitaxial wafer allowing sharp changes in alloy composition and growth of high-quality epitaxial layers. In a process for epitaxially growing a gallium arsenide phosphide GaAs1-xPx alloy composition gradient layer 4 on a compound semiconductor single-crystalline substrate made of gallium phosphide GaP or gallium arsenide GaAs, one group V gas as a source for the group V element not composing the single-crystalline substrate is varied in its supply volume in at least one cycle of sharp increase/moderate decrease, while the other group V gas as a source for the group V element composing the single-crystalline substrate is moderately decreased, thereby achieving at least one cycle of sharp increase/moderate decrease of a product of partial pressures of the group III and group V gases so that at least one set of an increasing zone and a decreasing zone of the alloy composition is formed within the gallium arsenide phosphide GaAs1-xPx alloy composition gradient layer 4.
    • 一种制造化合物半导体外延晶片的方法,其允许合金组成的急剧变化和高质量外延层的生长。 在由磷化镓GaP或砷化镓GaAs制成的化合物半导体单晶衬底上外延生长砷化镓磷化物GaAs1-xPx合金组成梯度层4的方法中,作为不组成V族元素的源的V族气体 单晶基板的供给体积在急剧增加/中等下降的至少一个周期内变化,而作为构成单晶基板的V族元素的源的另一组V气体适度地减小,从而达到 III族和V族气体的分压产物急剧增加/中度降低的至少一个循环,使得在砷化镓磷化物GaAs1-4中形成至少一组增加区和减少区的合金组成, xPx合金组成梯度层4。
    • 6. 发明授权
    • Surface light source device
    • 表面光源装置
    • US09128224B2
    • 2015-09-08
    • US13821198
    • 2012-03-09
    • Gouo KurataMasayuki Shinohara
    • Gouo KurataMasayuki Shinohara
    • F21V8/00
    • G02B6/0036G02B6/0016G02B6/0028G02B6/0038G02B6/0046
    • A surface light source device has a light source, and a light guide plate introducing light of the light source from a light incidence surface and emitting the light from a light exit surface to outside. The light source being is provided at a position facing the light incidence surface of the light guide plate. The light guide plate includes a light introducing part for enclosing the light from the light source entering from the light incidence surface and a light guide plate main body having a thickness smaller than a maximum thickness of the light introducing part, provided so as to be continued to the light introducing part, and emitting the enclosed light from the light exit surface by light emitting portion to outside.
    • 面光源装置具有光源和导光板,该光导板从光入射面引入光源的光,并将光从光出射面发射到外部。 光源设置在与导光板的光入射面相对的位置。 导光板包括用于封闭来自光入射面的光源的光的导光部和具有比光导入部的最大厚度小的厚度的导光板主体,该导光板主体被设置为继续 并且通过发光部将来自光出射面的封闭光发射到外部。
    • 8. 发明申请
    • SURFACE LIGHT SOURCE DEVICE
    • 表面光源设备
    • US20110286237A1
    • 2011-11-24
    • US13162106
    • 2011-06-16
    • Yasuhiro TanoueGouo KurataMasayuki Shinohara
    • Yasuhiro TanoueGouo KurataMasayuki Shinohara
    • F21V8/00
    • G02B6/0021G02B6/0016G02B6/0018G02B6/002G02B6/0028G02B6/0031G02B6/0038G02F1/133615
    • A light guide plate is formed of a light introducing part positioned to face a point light source for confining light and a light guide plate body having a thickness smaller than the thickness of an end of the light introducing part on a point light source side and causing the confined light to be output from a light exit surface to outside. The light introducing part has an inclined surface, and a directivity conversion pattern formed on the inclined surface. The directivity conversion pattern is configured by arranging V grooves in parallel to each other, each having a vertical angle of 120°, and each extends in a direction approximately perpendicular to a light incidence end face of the light guide plate. The length of the inclined surface in a inclination direction where part of light incident to the light introducing part enters the inclined surface at least twice.
    • 导光板由位于面对用于限制光的点光源的光引入部和具有比点光源侧的光导入部的端部的厚度小的导光板主体形成,并且导致 被限制的光从光出射表面输出到外部。 光引入部分具有倾斜表面和形成在倾斜表面上的方向性转换图案。 方向性转换图案通过将V沟槽彼此平行布置而构成,每个V形槽具有120°的垂直角,并且各自沿与导光板的光入射端面大致垂直的方向延伸。 入射到光导入部的光的倾斜方向的倾斜面的长度进入倾斜面至少两次。
    • 9. 发明申请
    • Optical Sheet and Surface Light Source Device
    • 光学片和表面光源装置
    • US20080198621A1
    • 2008-08-21
    • US11662784
    • 2005-09-09
    • Yasuhiro TanoueMasayuki Shinohara
    • Yasuhiro TanoueMasayuki Shinohara
    • F21V7/04G02B27/10
    • G02B6/0056G02B5/045G02B5/124G02B6/0021G02B6/0036G02B6/0038G02F1/133615G02F2001/133342
    • A semi-permeable/reflective sheet (19) has a lower surface as a flag light incident surface (47) and a surface opposite to the light incident surface (47) where a light reflection area (43a) and a light transmittance area (43b) are provided. The light transmittance area (43b) is a flat surface parallel to the light incident surface (47). The light reflection area (43a) is formed by a convex pattern (42) having a cross section of a rectangular equilateral triangular shape. A part of light (41) coming from the light incident surface (47) to the light transmittance area (43b) transmits the semi-permeable/reflective sheet (19) and goes out of the surface opposite to the light incident surface (47). A part of the remaining light (41) incident from the light incident surface (47) is reflected twice by reflection walls (44, 45) forming the convex pattern (42). The light reflected by the reflection walls (44, 45) is emitted in parallel to the previous incident direction and in the reverse direction to the incident light.
    • 半透光性反射片(19)具有作为标志光入射面(47)的下表面和与光入射面(47)相反的面,其中光反射区域(43a)和透光率区域 43 b)。 光透射区域(43b)是与光入射面(47)平行的平坦面。 光反射区域(41a)由具有矩形等边三角形形状的横截面的凸形图案(42)形成。 从光入射面(47)到透光区域(43b)的一部分光(41)透射半透射反射片(19),并从与光入射面(47)相反的面 )。 从光入射面(47)入射的剩余光(41)的一部分被形成凸图案(42)的反射壁(44,45)反射两次。 由反射壁(44,45)反射的光与前一个入射方向平行并且与入射光反向发射。