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    • 7. 发明申请
    • MASK BLANK TRANSPARENT SUBSTRATE MANUFACTURING METHOD, MASK BLANK MANUFACTURING METHOD, AND EXPOSURE MASK MANUFACTURING METHOD
    • 掩模空白透明基板制造方法,掩模制造方法和曝光掩模制造方法
    • US20110027701A1
    • 2011-02-03
    • US12904970
    • 2010-10-14
    • Masaru TANABE
    • Masaru TANABE
    • G03F1/00G03F7/20G06F17/50
    • G03F7/705G03F1/32G03F1/60G03F7/70783
    • A method includes a preparation step of preparing a transparent substrate having a precision-polished main surface, a surface shape information obtaining step of obtaining, as surface shape information, height information at a plurality of measurement points on the main surface of the transparent substrate that contacts a mask stage of an exposure apparatus, a simulation step of obtaining, based on the surface shape information and shape information of the mask stage, height information at the plurality of measurement points by simulating the state where the transparent substrate is set in the exposure apparatus, a flatness calculation step of calculating, based on the height information obtained through the simulation, a flatness of the transparent substrate when it is set in the exposure apparatus, a judging step of judging whether or not the calculated flatness satisfies a specification, and a thin film forming step of forming a thin film as serving as a mask pattern, on the main surface of the transparent substrate whose flatness satisfies the specification.
    • 一种方法包括准备具有精密抛光主表面的透明基板的准备步骤,在透明基板的主表面上的多个测量点处获得作为表面形状信息的高度信息的表面形状信息获取步骤, 接触曝光装置的掩模台,模拟步骤,基于掩模台的表面形状信息和形状信息,通过模拟在曝光中设置透明基板的状态,在多个测量点处获取高度信息 装置,平面度计算步骤,基于通过模拟获得的高度信息,计算在设置在曝光装置中时透明基板的平坦度;判断步骤,判断所计算的平面度是否满足规格;以及 在主su上形成薄膜作为掩模图案的薄膜形成步骤 平坦度满足规格的透明基板的表面。
    • 9. 发明申请
    • MASK BLANK SUBSTRATE SET AND MASK BLANK SET
    • MASK BLANK基板设置和MASK BLANK SET
    • US20100081067A1
    • 2010-04-01
    • US12570190
    • 2009-09-30
    • Masaru TANABE
    • Masaru TANABE
    • G03F7/20G03F1/00
    • G03F1/60G03F1/00
    • A substrate set is a mask blank substrate set including a plurality of substrates each for use in a mask blank for producing a photomask to be chucked on a mask stage of an exposure apparatus. In each of the substrates in the mask blank substrate set, a main surface, on the side where a thin film for forming a transfer pattern is to be formed, has a convex shape being relatively high at its center and relatively low at its peripheral portion. In each substrate, the flatness in a 142 mm square area, including a central portion, of the main surface is 0.3 μm or less and the difference upon fitting to a reference main surface of a reference substrate is 40 nm or less.
    • 衬底组是掩模空白衬底组,其包括多个衬底,每个衬底用于掩模坯料中,用于制造要夹持在曝光设备的掩模台上的光掩模。 在掩模基板组中的每个基板中,要形成转印图案的薄膜侧的主表面的凸形形状在其中心处相对较高,在其周边部分相对较低 。 在每个基板中,主表面的142mm正方形区域(包括中心部分)的平坦度为0.3μm以下,与基准基板的基准主面嵌合的差为40nm以下。
    • 10. 发明申请
    • METHOD OF MANUFACTURING A TRANSFER MASK AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造转移掩模的方法和制造半导体器件的方法
    • US20120251928A1
    • 2012-10-04
    • US13436132
    • 2012-03-30
    • Masaru TANABEHideaki MITSUINaoki NISHIDASatoshi IWASHITA
    • Masaru TANABEHideaki MITSUINaoki NISHIDASatoshi IWASHITA
    • G03F1/84G03F7/20
    • G03F1/84G03F1/70G03F1/72
    • An internal defect or the like of a transfer mask is detected using transmitted light quantity distribution data of an inspection apparatus. Using a die-to-die comparison inspection method, inspection light is irradiated to a first region of a thin film to obtain a first transmitted light quantity distribution, the inspection light is also irradiated to a second region of the thin film to obtain a second transmitted light quantity distribution, a predetermined-range difference distribution is produced by plotting coordinates at which difference light quantity values calculated from a comparison between the first transmitted light quantity distribution and the second transmitted light quantity distribution are each not less than a first threshold value and less than a second threshold value, and a selection is made of a transfer mask in which a region with high density of plotting is not detected in the predetermined-range difference distribution.
    • 使用检查装置的透射光量分布数据检测转印掩模的内部缺陷等。 使用管芯间的比较检查方法,将检查光照射到薄膜的第一区域以获得第一透射光量分布,也将检查光照射到薄膜的第二区域,以获得第二透射光 通过绘制从第一透射光量分布和第二透射光量分布之间的比较计算出的差光量值分别不小于第一阈值的坐标,并产生预定范围的差分布, 小于第二阈值,并且选择在预定范围差分布中未检测到具有高密度绘图密度的区域的转印掩模。