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    • 1. 发明申请
    • SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 半导体器件及制造半导体器件的方法
    • US20120025294A1
    • 2012-02-02
    • US13208454
    • 2011-08-12
    • Masao SHINGUAkira TakashimaKoichi Muraoka
    • Masao SHINGUAkira TakashimaKoichi Muraoka
    • H01L29/788H01L21/336
    • H01L29/788H01L21/28273H01L21/28282H01L27/11521H01L27/11568H01L29/42324H01L29/4234H01L29/513H01L29/66825
    • There is provided a semiconductor device in which degradation of reliability originating in the interface between an upper insulating layer and an element isolation insulating layer is suppressed. The semiconductor device includes: a semiconductor region; a plurality of stacked structures each of which is disposed on the semiconductor region and has a tunnel insulating film, a charge storage layer, an upper insulating layer, and a control electrode stacked sequentially; an element isolation insulating layer disposed on side faces of the plurality of stacked structures; and a source-drain region disposed on the semiconductor region and among the plurality of stacked structures. The element isolation insulating layer includes at least one of SiO2, SiN, and SiON, the upper insulating layer is an oxide containing at least one metal M selected from the group consisting of a rare earth metal, Y, Zr, and Hf, and Si, and respective lengths Lcharge, Ltop, and Lgate of the charge storage layer, the upper insulating layer, and the control electrode in a channel length direction satisfy the relation “Lcharge
    • 提供一种半导体器件,其中抑制源于上绝缘层和元件隔离绝缘层之间的界面的可靠性的劣化。 半导体器件包括:半导体区域; 多个堆叠结构,其各自设置在所述半导体区域上,并且具有依次堆叠的隧道绝缘膜,电荷存储层,上绝缘层和控制电极; 设置在所述多个堆叠结构的侧面上的元件隔离绝缘层; 以及设置在半导体区域和多个堆叠结构中的源极 - 漏极区域。 元件隔离绝缘层包括SiO 2,SiN和SiON中的至少一种,上绝缘层是含有选自稀土金属,Y,Zr和Hf中的至少一种金属M的氧化物,Si ,并且沟道长度方向上的电荷存储层,上绝缘层和控制电极的各自的长度Lcharge,Ltop和Lgate满足关系“Lcharge
    • 6. 发明授权
    • Semiconductor device, and method for manufacturing semiconductor device
    • 半导体装置及半导体装置的制造方法
    • US08558301B2
    • 2013-10-15
    • US13208454
    • 2011-08-12
    • Masao ShinguAkira TakashimaKoichi Muraoka
    • Masao ShinguAkira TakashimaKoichi Muraoka
    • H01L29/76
    • H01L29/788H01L21/28273H01L21/28282H01L27/11521H01L27/11568H01L29/42324H01L29/4234H01L29/513H01L29/66825
    • There is provided a semiconductor device in which degradation of reliability originating in the interface between an upper insulating layer and an element isolation insulating layer is suppressed. The semiconductor device includes: a semiconductor region; a plurality of stacked structures each of which is disposed on the semiconductor region and has a tunnel insulating film, a charge storage layer, an upper insulating layer, and a control electrode stacked sequentially; an element isolation insulating layer disposed on side faces of the plurality of stacked structures; and a source-drain region disposed on the semiconductor region and among the plurality of stacked structures. The element isolation insulating layer includes at least one of SiO2, SiN, and SiON, the upper insulating layer is an oxide containing at least one metal M selected from the group consisting of a rare earth metal, Y, Zr, and Hf, and Si, and respective lengths Lcharge, Ltop, and Lgate of the charge storage layer, the upper insulating layer, and the control electrode in a channel length direction satisfy the relation “Lcharge
    • 提供一种半导体器件,其中抑制源于上绝缘层和元件隔离绝缘层之间的界面的可靠性的劣化。 半导体器件包括:半导体区域; 多个堆叠结构,其各自设置在所述半导体区域上,并且具有依次堆叠的隧道绝缘膜,电荷存储层,上绝缘层和控制电极; 设置在所述多个堆叠结构的侧面上的元件隔离绝缘层; 以及设置在半导体区域和多个堆叠结构中的源极 - 漏极区域。 元件隔离绝缘层包括SiO 2,SiN和SiON中的至少一种,上绝缘层是含有选自稀土金属,Y,Zr和Hf中的至少一种金属M的氧化物,Si ,并且沟道长度方向上的电荷存储层,上绝缘层和控制电极的各自的长度Lcharge,Ltop和Lgate满足关系“Lcharge