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    • 1. 发明授权
    • Bipolar transistor and method of producing the same
    • 双极晶体管及其制造方法
    • US4965650A
    • 1990-10-23
    • US420656
    • 1989-10-11
    • Masanori InadaKazuo EdaYorito OtaAtsushi NakagawaManabu Yanagihara
    • Masanori InadaKazuo EdaYorito OtaAtsushi NakagawaManabu Yanagihara
    • H01L21/331H01L29/08H01L29/417H01L29/737
    • H01L29/66318H01L29/0804H01L29/41708H01L29/7371Y10S148/01Y10S148/072
    • A dummy emitter (a dummy collector, in an inverted type) is formed in the portion corresponding to an emitter (a collector, in the inverted type) region, on a multiplayer structural material including layers for forming emitter, base and collector, and using it as mask, an external base region is exposed by etching, and a projection of the emitter (the collector, in the inverted type) region is formed, while the dummy emitter (the dummy collector, in the inverted type) is inverted into an emitter (a collector, in the inverted type) electrode, thereby forming an emitter (a collector, in the inverted type) electrode metal layer covering the whole upper surface of the emitter (the collector, in the inverted type). Using the thus formed emitter (the collector, in the inverted type) electrode metal layer, a base electrode metal layer is formed, by self-alignment, adjacent to the emitter (the collector, in the inverted type). In another method, on a multilayer structural material, impurities are introduced outside the portion corresponding to the base region of a bipolar transistor in order to insulate, at least, a portion of the layer forming the base, and if necessary a portion of the layer forming the emitter and a portion of the layer forming the collector. Further, an extension layers and the layer forming the collector, and an extension type dummy emitter (a dummy collector, in the inverted type) is formed which extends from the emitter (the collector, in the inverted type) on the base portion to the insulating region formed by transforming from the semiconductor material forming the base, and using it as mask, the external base region is exposed to form an emitter-including layer and the dummy emitter (the dummy collector, in the inverted type) is replaced by an emitter (a collector, in the inverted type) electrode metal layer covering the whole upper surface of the emitter-including layer.
    • 3. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US5037769A
    • 1991-08-06
    • US330956
    • 1989-03-28
    • Masanori InadaKazuo EdaYorito Ota
    • Masanori InadaKazuo EdaYorito Ota
    • H01L29/36H01L29/737
    • H01L29/36H01L29/7371Y10S148/01Y10S148/072
    • A semiconductor device of a multilayer structure comprising semiconductor materials of different properties manufactured by using at least a step of epitaxially forming a semiconductor material layer on a substrate and a passivation film layer thereover, a step of introducing impurities into specific portions of the epitaxially formed semiconductor material layer and a step of removing the passivation film layer formed directly above the epitaxially formed semiconductor material layer within an epitaxial device and then applying epitaxial growing. Impurities introduced additionally to specific portions of the layer inside are substantially eliminated at the boundary adjacent the layer above the region introduced with impurities and the properties of the thus-produced semiconductors vary abruptly at the boundary between the layer in which the impurities are introduced and the layer thereabove. The material used for the passivation film layer comprises one that can be epitaxially formed and easily removed at a temperature and in a atmosphere under which the epitaxially formed layer below the passivation film are not decomposed or evaporized.
    • 一种多层结构的半导体器件,包括通过至少在衬底上外延形成半导体材料层的步骤和其上的钝化膜层而制造的具有不同性质的半导体材料,将杂质引入外延形成的半导体的特定部分 材料层和去除在外延装置内的外延形成的半导体材料层正上方形成的钝化膜层,然后施加外延生长的步骤。 在与内部区域相邻的边界处附近引入的层的特定部分的杂质基本上消除,并且由此产生的半导体的性质在其中引入杂质的层与其之间的边界处突然变化 层以上。 用于钝化膜层的材料包括可以在外部形成的并且在钝化膜下面的外延形成层不分解或蒸发的温度和气氛中容易除去的材料。
    • 10. 发明授权
    • Terminal flow sensor
    • 端子流量传感器
    • US5024083A
    • 1991-06-18
    • US451058
    • 1989-12-15
    • Masanori InadaHichiro Ohtani
    • Masanori InadaHichiro Ohtani
    • G01F1/68G01F1/684G01F1/692
    • G01F1/684
    • A thermal flow sensor has a heat-sensitive resistor which is disposed at a predetermined angle relative to the line of stream of a fluid, and which has its heat-sensitive portion disposed on the surface portion of a substrate which is positioned downstream in the direction in which the fluid flows. Since the heat-sensitive resistor is already disposed at a predetermined angle relative to the line of stream of the fluid, this permits only slight influence on, hence, variation in detection characteristic to be caused by deviation in the disposition angle. Since the heat-sensitive portion is disposed on a surface portion positioned downstream in the direction of fluid flow, this restrains dust contained in air from directly depositing on the heat-sensitive portion, hence, from causing variation in detection characteristic.
    • 热流传感器具有热敏电阻器,该热敏电阻器相对于流体流线以预定角度设置,并且其热敏部分设置在基板的表面部分上,该基板位于沿着方向 其中流体流动。 由于热敏电阻器相对于流体流线已经以预定角度设置,所以这仅允许由于配置角度的偏差而导致的检测特性的变化的轻微影响。 由于热敏部分设置在位于流体流动方向下游的表面部分上,这就限制了空气中包含的灰尘直接沉积在热敏部分上,从而导致检测特性的变化。