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1. 发明授权

US07507148B2 Polishing apparatus, polishing head and polishing method 失效
标题翻译：抛光装置，抛光头和抛光方法
公开(公告)号：US07507148B2
公开(公告)日：2009-03-24
申请号：US10528287
申请日：2003-09-26
申请人： Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tamoaki Tajiri
发明人： Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tamoaki Tajiri
IPC分类号： B24B5/00
CPC分类号： B24B37/30
摘要： A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.
摘要翻译：抛光装置包括抛光板（24），附着在抛光板（24）的表面上的研磨布（25），用于将晶片（39）的一个表面保持并压靠在研磨布上的卡盘（19）（25）和同心地布置在卡盘（19）的周边上的圆形保持环（23）。保持环（23）可相对于卡盘（19）旋转并且可垂直移动，并且在研磨步骤期间被压靠在研磨布（25）上。在最后的抛光步骤期间，保持环（23）被向上提升，从而防止研磨颗粒进入最终抛光阶段。因此，可以使用相同的抛光头连续进行研磨和最终抛光。利用这种结构，可以实现装置的成本削减，因为使用相同的抛光头连续进行研磨和最终抛光，而不将用于研磨的研磨颗粒带入最后的抛光阶段。

2. 发明授权

US07654883B2 Polishing apparatus, polishing head and polishing method 失效
标题翻译：抛光装置，抛光头和抛光方法
公开(公告)号：US07654883B2
公开(公告)日：2010-02-02
申请号：US12371320
申请日：2009-02-13
申请人： Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tamoaki Tajiri
发明人： Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tamoaki Tajiri
IPC分类号： B24B1/00
CPC分类号： B24B37/30
摘要： A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.
摘要翻译：抛光装置包括抛光板（24），附着在抛光板（24）的表面上的研磨布（25），用于将晶片（39）的一个表面保持并压靠在研磨布上的卡盘（19）（25）和同心地布置在卡盘（19）的周边上的圆形保持环（23）。保持环（23）可相对于卡盘（19）旋转并且可垂直移动，并且在研磨步骤期间被压靠在研磨布（25）上。在最后的抛光步骤期间，保持环（23）被向上提升，从而防止研磨颗粒进入最终抛光阶段。因此，可以使用相同的抛光头连续进行研磨和最终抛光。利用这种结构，可以实现装置的成本削减，因为使用相同的抛光头连续进行研磨和最终抛光，而不将用于研磨的研磨颗粒带入最后的抛光阶段。

3. 发明申请

US20090156101A1 POLISHING APPARATUS, POLISHING HEAD AND POLISHING METHOD 失效
标题翻译：抛光装置，抛光头和抛光方法
公开(公告)号：US20090156101A1
公开(公告)日：2009-06-18
申请号：US12371320
申请日：2009-02-13
申请人： Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tomoaki Tajiri
发明人： Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tomoaki Tajiri
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B37/30
摘要： A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.
摘要翻译：抛光装置包括抛光板（24），附着在抛光板（24）的表面上的研磨布（25），用于将晶片（39）的一个表面保持并压靠在研磨布上的卡盘（19）（25）和同心地布置在卡盘（19）的周边上的圆形保持环（23）。保持环（23）可相对于卡盘（19）旋转并且可垂直移动，并且在研磨步骤期间被压靠在研磨布（25）上。在最后的抛光步骤期间，保持环（23）被向上提升，从而防止研磨颗粒进入最终抛光阶段。因此，可以使用相同的抛光头连续进行研磨和最终抛光。利用这种结构，可以实现装置的成本削减，因为使用相同的抛光头连续进行研磨和最终抛光，而不将用于研磨的研磨颗粒带入最后的抛光阶段。

4. 发明申请

US20060057942A1 Polishing apparatus, polishing head and polishing method 失效
标题翻译：抛光装置，抛光头和抛光方法
公开(公告)号：US20060057942A1
公开(公告)日：2006-03-16
申请号：US10528287
申请日：2003-09-26
申请人： Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tomoaki Tajiri
发明人： Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tomoaki Tajiri
IPC分类号： B24B1/00
CPC分类号： B24B37/30
摘要： A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.
摘要翻译：抛光装置包括抛光板（24），附着在抛光板（24）的表面上的研磨布（25），用于将晶片（39）的一个表面保持并压靠在研磨布上的卡盘（19）（25）和同心地布置在卡盘（19）的周边上的圆形保持环（23）。保持环（23）可相对于卡盘（19）旋转并且可垂直移动，并且在研磨步骤期间被压靠在研磨布（25）上。在最后的抛光步骤期间，保持环（23）被向上提升，从而防止研磨颗粒进入最终抛光阶段。因此，可以使用相同的抛光头连续进行研磨和最终抛光。利用这种结构，可以实现装置的成本削减，因为使用相同的抛光头连续进行研磨和最终抛光，而不将用于研磨的研磨颗粒带入最后的抛光阶段。

5. 发明授权

US5965039A Plasma torch 失效
标题翻译：等离子火炬
公开(公告)号：US5965039A
公开(公告)日：1999-10-12
申请号：US875679
申请日：1997-08-04
申请人： Masamitsu Kitahashi , Hiroyuki Tokunaga
发明人： Masamitsu Kitahashi , Hiroyuki Tokunaga
IPC分类号： H05H1/28 , H05H1/34 , B23K10/00
CPC分类号： H05H1/3405 , H05H1/28 , H05H2001/3436 , H05H2001/3478
摘要： There is provided a plasma torch in which a plasma arc emanating from an electrode in a torch body (1) is pinched in a torch nozzle (3) and is then flushed therefrom, characterized in that an axis of said torch nozzle (3) is deviated in position from with a center line of said torch body (1).
摘要翻译： PCT No.PCT / JP96 / 00305 Sec。 371日期：1997年8月4日 102（e）日期1997年8月4日PCT提交1996年2月13日PCT公布。公开号WO96 / 25266 日期1996年8月22日提供了一种等离子体焰炬，其中从炬体（1）中的电极发出的等离子体电弧被夹在炬喷嘴（3）中，然后从其中冲洗，其特征在于，所述炬喷嘴（3）与所述割炬本体（1）的中心线偏离位置。

6. 发明授权

US5734144A Plasma arc welding method and apparatus in which a swirling flow is imparted to a plasma gas to stabilize a plasma arc 失效
标题翻译：等离子弧焊接方法和装置，其中使等离子体气体产生旋流以稳定等离子体电弧
公开(公告)号：US5734144A
公开(公告)日：1998-03-31
申请号：US525530
申请日：1995-09-12
申请人： Yoshihiro Yamaguchi , Iwao Kurokawa , Masamitsu Kitahashi , Mikio Minonishi
发明人： Yoshihiro Yamaguchi , Iwao Kurokawa , Masamitsu Kitahashi , Mikio Minonishi
IPC分类号： B23K10/02 , B23K10/00
CPC分类号： B23K10/02
摘要： There is provided a plasma arc welding method, characterized in that a portion of a front side workpiece material is heated and melted by a plasma arc to form a molten pool thereat, that the molten pool is held not to fall or drop under a surface tension acting thereto and is brought into contact with a portion of a rear side workpiece material under a pressure which is exerted by the plasma arc and/or a shielding gas, further that the portion of the said rear workpiece material is brought into a molten state by a thermal conduction thereto so that the two workpiece materials may be welded together, and that a swirling flow is imparted to a plasma gas of the plasma arc. There is also provided a plasma welding apparatus for using the above mentioned plasma arc welding method, characterized in that the apparatus comprises: a plasma torch which has a plasma flushing outlet for swirling and flushing a plasma gas of the plasma arc around an electrode therefor.
摘要翻译： PCT No.PCT / JP94 / 00484 Sec。 371 1995年9月12日第 102（e）日期1995年9月12日PCT 1994年3月25日PCT公布。公开号WO94 / 22630 PCT 日期：1994年10月13日提供了一种等离子体电弧焊接方法，其特征在于，前面工件材料的一部分被等离子体电弧加热熔化，形成熔池，熔池保持不下落，在作用于其上的表面张力下落下，并在由等离子弧和/或保护气体施加的压力下与后侧工件材料的一部分接触，此外，所述后工件材料的部分被带入通过其导热而进入熔融状态，使得两个工件材料可以焊接在一起，并且对等离子体电弧的等离子体气体赋予旋转流。还提供了一种使用上述等离子体电弧焊接方法的等离子体焊接装置，其特征在于，该装置包括：等离子体焰炬，其具有等离子体冲洗出口，用于在其电极周围旋转和冲洗等离子体电弧的等离子体气体。

7. 发明授权

US5726414A Plasma torch with swirling gas flow in a shielding gas passage 失效
标题翻译：等离子火炬与涡流气体在保护气体通道中流动
公开(公告)号：US5726414A
公开(公告)日：1998-03-10
申请号：US628666
申请日：1996-04-12
申请人： Masamitsu Kitahashi , Iwao Kurokawa , Mikio Tokunaga , Hiroyuki Tokynaya
发明人： Masamitsu Kitahashi , Iwao Kurokawa , Mikio Tokunaga , Hiroyuki Tokynaya
IPC分类号： B23K10/00 , B23K35/04 , B23K35/22 , H05H1/34
CPC分类号： H05H1/34 , H05H2001/3426 , H05H2001/3436 , H05H2001/3442 , H05H2001/3468 , H05H2001/3478
摘要： A plasma torch of swirling plasma gas flow type is disclosed in which there are provided an electrode body having a forward end thereof and a nozzle that is arranged to enclose said forward end portion of the electrode and that is spaced therefrom across a plasma gas flow passage, characterized in that at least a portion of the said electrode body at which a pilot arc can be ignited is composed of either of a material that is high in its melting point and a mixture of the said high melting point material with either of a substance that is low in its work function and an oxide of the said substance.
摘要翻译： PCT No.PCT / JP94 / 01854 Sec。 371日期：1996年4月12日 102（e）日期1996年4月12日PCT 1994年11月2日PCT公布。公开号WO95 / 12965 日期1995年5月11日公开了一种旋转等离子气体流动型等离子体焰炬，其中提供了具有其前端的电极体和布置成包围电极的前端部分并且与电极主体间隔开的喷嘴等离子体气体流动通道，其特征在于，所述电极体的至少一部分可以点燃的导电体由熔点高的材料和所述高熔点材料与任何一种功能低的物质和所述物质的氧化物。

8. 发明授权

US5925267A Plasma torch having a bypass unit 失效
标题翻译：等离子火炬具有旁路单元
公开(公告)号：US5925267A
公开(公告)日：1999-07-20
申请号：US973753
申请日：1997-12-23
申请人： Masamitsu Kitahashi
发明人： Masamitsu Kitahashi
IPC分类号： H05H1/26 , B23K10/00 , H05H1/34 , H05H1/36
CPC分类号： H05H1/34 , H05H1/36 , H05H2001/3478
摘要： There is disclosed a plasma torch for performing a working operation with respect to a workpiece (8) by flushing out of a torch nozzle (2), a plasma arc drawn from an electrode (1) together with a working gas that is introduced from a periphery of the electrode while holding a portion of the plasma torch substantially in contact with the workpiece, in which at least that portion of said plasma torch which may make a contact with the workpiece is composed of a non-insulating member and in which a high frequency current bypassing unit (12) is disposed between a site of the plasma torch that is equal in electric potential to the torch nozzle and a site of the plasma torch that is equal in electric potential to the workpiece.
摘要翻译： PCT No.PCT / JP96 / 01961 Sec。 371 1997年12月23日第 102（e）日期1997年12月23日PCT提交1996年7月12日PCT公布。出版物WO97 / 02919 日期1997年1月30日公开了一种等离子体焰炬，用于通过从喷枪（2）中冲洗，从电极（1）中抽出的等离子弧与工作气体（8）一起工作（8）进行工作操作其从电极的周边引入，同时保持等离子体焰炬的基本上与工件接触的部分，其中等于可以与工件接触的等离子体焰炬的至少一部分由非绝缘构件并且其中高频电流旁路单元（12）设置在等离子体焰炬的与割炬喷嘴的电位相等的位置和与工件的电位相等的等离子体焰炬的位置之间。

9. 发明授权

US5728991A Plasma arc welding apparatus and welding method using the same 失效
标题翻译：等离子弧焊设备及其焊接方法
公开(公告)号：US5728991A
公开(公告)日：1998-03-17
申请号：US537913
申请日：1995-10-31
申请人： Hiroshi Takada , Masamitsu Kitahashi , Kunio Horiai , Iwao Kurokawa , Mikio Minonishi
发明人： Hiroshi Takada , Masamitsu Kitahashi , Kunio Horiai , Iwao Kurokawa , Mikio Minonishi
IPC分类号： B23K10/02 , B23K10/00
CPC分类号： B23K10/02
摘要： There is provided a plasma arc welding apparatus which comprises a plasma torch and a spacing retention member which is securely fixed to the plasma torch and whose frontal end is located between a frontal end of the plasma torch and a weld workpiece and is adapted to be pressed against the workpiece while the latter is being welded. There is also provided a plasma arc welding method which makes use of a plasma arc welding apparatus that comprises a plasma torch and a spacing retention member which is securely fixed to a base of the plasma torch and whose frontal end is located between a frontal end of the plasma torch and a welding workpiece, in which method the frontal end of the spacing retention member is pressed against the workpiece while the latter is being welded.
摘要翻译： PCT No.PCT / JP94 / 00745 Sec。 371日期1995年10月31日 102（e）日期1995年10月31日PCT 1994年5月6日PCT PCT。公开号WO94 / 26456 日期1994年11月24日提供了一种等离子弧焊接装置，其包括等离子体焰炬和间隔保持构件，该等离子体焰炬和间隔保持构件牢固地固定到等离子体焰炬上，其前端位于等离子体焰炬的前端和焊接工件之间，适于在被焊接时被压靠在工件上。还提供了一种使用等离子体电弧焊接装置的等离子体电弧焊接方法，该等离子体电弧焊接装置包括等离子体焰炬和间隔保持构件，其固定地固定到等离子体焰炬的基部，并且其前端位于等离子体焰炬和焊接工件，其中间隔保持构件的前端在被焊接时被压靠在工件上。

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