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    • 1. 发明申请
    • ELECTRONIC COMPONENT WITH LEAD WIRE
    • 带导线的电子元件
    • US20100066482A1
    • 2010-03-18
    • US12540444
    • 2009-08-13
    • Masamichi SHIKOShingo OKUYAMAYuichi SHINOMIYAHideyuki SHIRAKIKazuo MIYAKE
    • Masamichi SHIKOShingo OKUYAMAYuichi SHINOMIYAHideyuki SHIRAKIKazuo MIYAKE
    • H01C7/00
    • G01K7/223H01C1/144H01C7/008H01C7/18H01G4/232
    • In an electronic component, first and second lead wires include coated portions and first and second metal wire exposed portions. The coated portions include metal wires that are coated with insulating members. Each of the first and second metal wire exposed portions have a flat shape. The first lead wire and the second lead wire are arranged parallel or substantially parallel to each other. The second lead wire is shorter than the first lead wire. The first metal wire exposed portion is soldered to the side surface folded portion of the terminal electrode. The second metal wire exposed portion is soldered to the side surface folded portion of the terminal electrode. The first and second metal wire exposed portions are located substantially in the same plane. A solder fillet is provided not only on the side surface folded portions, but also on end surface portions and in a gap.
    • 在电子部件中,第一和第二引线包括涂覆部分和第一和第二金属丝暴露部分。 涂覆部分包括涂有绝缘构件的金属线。 第一和第二金属线暴露部分中的每一个具有平坦的形状。 第一引线和第二引线彼此平行或基本平行地布置。 第二引线比第一引线短。 将第一金属线暴露部分焊接到端子电极的侧表面折叠部分。 第二金属线暴露部分焊接到端子电极的侧表面折叠部分。 第一和第二金属线暴露部分基本上位于相同的平面中。 焊接圆角不仅在侧面折叠部分上,而且还设置在端面部分和间隙中。