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1. 发明授权

US5412002A Composition of glycidylated phenol/vinylcyclohexene or vinylnorbornene resin 失效
标题翻译：缩水甘油基苯酚/乙烯基环己烯或乙烯基降冰片烯树脂的组成
公开(公告)号：US5412002A
公开(公告)日：1995-05-02
申请号：US988225
申请日：1992-12-09
申请人： Masami Enomoto , Susumu Kubota , Hitoshi Yuasa , Fumiaki Oshimi , Yutaka Otsuki
发明人： Masami Enomoto , Susumu Kubota , Hitoshi Yuasa , Fumiaki Oshimi , Yutaka Otsuki
IPC分类号： B32B27/38 , C08G59/00 , C08G59/08 , C08G59/20 , C08G59/32 , C08K3/00 , C08L63/00 , C08L63/10 , G03F7/027 , G03F7/032 , G03F7/038 , H01L23/29 , H01L23/31 , H05K3/06 , H05K3/28 , C08K3/36 , C08G59/04
CPC分类号： C08L63/00 , C08G59/08 , C08G59/3218 , C08L63/10 , H05K3/285
摘要： An epoxy resin composition contains an epoxy resin represented by the formula (I) and a curing accelerator: ##STR1## wherein R.sup.1 stands for ##STR2## where G stands for a glycidyl group, R.sup.2 stands for an alkyl group having 1 to 4 carbon atoms, R.sup.3 and R.sup.4 stand for the same or different groups and each denote a hydrogen atom or a glycidyl group, m and x each denote an integer of 0 to 10, n denotes an integer of 0 to 2, provided that m.gtoreq.x and, if m=0, then x=0, in which case at least one of R.sup.3 and R.sup.4 denotes a glycidyl group on the condition that when m.gtoreq.1 and m>x, R.sup.1 may each stand for different groups.
摘要翻译：环氧树脂组合物含有式（I）表示的环氧树脂和固化促进剂：其中R1表示缩水甘油基，R2表示烷基的R1表示具有1至4个碳原子，R 3和R 4表示相同或不同的基团，并且各自表示氢原子或缩水甘油基，m和x各自表示0至10的整数，n表示0至2的整数，提供如果m = 0，那么x = 0，则在这种情况下，R 3和R 4中的至少一个表示缩水甘油基，条件是当m≥1且m> x时，R 1各自代表不同群体。

2. 发明授权

US5344899A Phenolic resin, method for producing the resin and epoxy resin composition for encapsulation 失效
标题翻译：酚醛树脂，树脂的制造方法和用于包封的环氧树脂组合物
公开(公告)号：US5344899A
公开(公告)日：1994-09-06
申请号：US18081
申请日：1993-02-16
申请人： Masami Enomoto , Susumu Kubota , Fumiaki Oshimi , Hitoshi Yuasa , Yutaka Otsuki
发明人： Masami Enomoto , Susumu Kubota , Fumiaki Oshimi , Hitoshi Yuasa , Yutaka Otsuki
IPC分类号： C08G59/62 , C08G59/00 , C08G61/00 , C08G61/02 , C08K3/36 , C08L63/00 , C08L65/00 , H01B3/30 , H01B3/40 , H01L23/29 , H01L23/31 , C08F283/00
CPC分类号： H01L23/293 , C08G61/02 , C08L63/00 , C08L65/00 , H01B3/30 , H01B3/40 , H01L2924/0002
摘要： A phenolic resin is represented by the formula (1) ##STR1## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m denotes an integer of from 0 to 10 and n denotes 0, 1 or 2. A method for producing the phenolic resin involves reacting in the presence of an acid catalyst 3a,4,7,7a-tetrahydroindene and a phenol represented by the formula (2) ##STR2## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms and n denotes 0, 1 or 2. An epoxy resin composition for encapsulation contains: (a) a curable epoxy resin, (b) the above phenolic resin, (c) a curing promotor, and (d) an inorganic filler.
摘要翻译：酚醛树脂由式（1）表示：其中R 1表示氢原子或具有1至4个碳原子的烷基，m表示0至10的整数，n表示0,1或 2.一种生产酚醛树脂的方法包括在酸催化剂3a，4,7,7a-四氢茚和由式（2）表示的苯酚（2）的存在下反应，其中R 1表示氢原子或具有1至4个碳原子的烷基，n表示0,1或2.用于封装的环氧树脂组合物包含：（a）可固化环氧树脂，（b）上述酚醛树脂，（c）固化促进剂和（d）无机填料。

3. 发明授权

US5432234A Resin, process for preparing the same and compositon comprising the same 失效
标题翻译：树脂，其制备方法和包含其的组合物
公开(公告)号：US5432234A
公开(公告)日：1995-07-11
申请号：US284927
申请日：1994-08-02
申请人： Masami Enomoto , Hitoshi Yuasa , Fumiaki Oshimi , Yutaka Otsuki
发明人： Masami Enomoto , Hitoshi Yuasa , Fumiaki Oshimi , Yutaka Otsuki
IPC分类号： C08C19/00 , C08L15/00 , C08L63/00 , H05K1/03 , C08F8/00 , C08L61/04
CPC分类号： C08L15/00 , C08C19/00 , C08L63/00 , C08K3/36 , H05K1/0326
摘要： A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.
摘要翻译：具有优异的热稳定性，耐候性和用作印刷电路板用树脂的电性能，用于密封半导体的树脂，绝缘材料等的新型羟基苯基树脂; 制备树脂的方法; 和包含其的可固化环氧组合物。具体地说，本发明提供含有多个酚羟基并具有高软化点且基本上不含双键的新型树脂; 和其制备方法，其中使用丁二烯低聚物和酚化合物作为原料; 以及包含适合于诸如密封材料的应用的可固化环氧树脂组合物。

4. 发明授权

US5336752A Method for producing phenolic resin 失效
标题翻译：生产酚醛树脂的方法
公开(公告)号：US5336752A
公开(公告)日：1994-08-09
申请号：US10603
申请日：1993-01-28
申请人： Fumiaki Oshimi , Susumu Kubota , Masami Enomoto , Yutaka Otsuki
发明人： Fumiaki Oshimi , Susumu Kubota , Masami Enomoto , Yutaka Otsuki
IPC分类号： C08G8/08 , C08G8/00 , C08G59/08 , C08G61/00 , C08G61/02 , H01L23/29 , H01L23/31 , H05K1/03 , C08G63/78 , C08G63/87
CPC分类号： C08G61/00 , H05K1/0373
摘要： A method is provided for producing a phenolic resin represented by the formula (I) ##STR1## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R.sup.2 is a divalent cyclic hydrocarbon residue having 5 to 18 carbon atoms, p is a number of from 0 to 10 and q is a number of 1 or 2. The method involves reacting a phenol with an unsaturated cyclic hydrocarbon compound having two or more carbon-carbon double bonding in the presence of an acid catalyst; and processing a resulting reaction product by a hydrotalcite compound represented by the formula (II)M.sub.1-x.sup.2+ M.sub.x.sup.3+ (OH).sub.2+x-ny A.sub.y.sup.n-.m(H.sub.2 O)(II)where M.sup.2+ is a divalent, magnesium ion, a divalent zinc ion, a divalent calcium ion, a divalent nickel ion, a divalent cobalt ion, a divalent manganese ion or a divalent copper ion, M.sup.3+ is a trivalent aluminum ion, a trivalent iron ion or a trivalent chromium ion, A.sup.n- is HCO.sub.3.sup.-, CO.sub.3.sup.2- or OH.sup.-, and x, y and m each are 0.1
摘要翻译：提供了一种制备由式（I）表示的酚醛树脂的方法，其中R1是氢原子或具有1-4个碳原子的烷基，R2是具有5至18个碳原子的二价环状烃残基碳原子，p为0至10的数，q为1或2的数。该方法包括在酸催化剂存在下使苯酚与具有两个或更多个碳 - 碳双键的不饱和环烃化合物反应 ; 和由式（II）表示的水滑石化合物M1-x2 + Mx3 +（OH）2 + x-nYAyn-m（H2O）（Ⅱ）处理得到的反应产物，其中M2 +是二价的镁离子，二价锌离子，二价钙离子，二价镍离子，二价钴离子，二价锰离子或二价铜离子，M3 +为三价铝离子，三价铁离子或三价铬离子，An-为HCO 3 - ，CO32-或OH-，x，y和m分别为0.1

5. 发明授权

US5360870A Resin, process for preparing the same, and composition comprising the same 失效
标题翻译：树脂，其制备方法和包含其的组合物
公开(公告)号：US5360870A
公开(公告)日：1994-11-01
申请号：US743367
申请日：1991-08-19
申请人： Masami Enomoto , Hitoshi Yuasa , Fumiaki Oshimi , Yutaka Otsuki
发明人： Masami Enomoto , Hitoshi Yuasa , Fumiaki Oshimi , Yutaka Otsuki
IPC分类号： C08C19/00 , C08L15/00 , C08L63/00 , H05K1/03 , C08F8/00 , C08L61/04
CPC分类号： C08L15/00 , C08C19/00 , C08L63/00 , C08K3/36 , H05K1/0326
摘要： A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.
摘要翻译： PCT No.PCT / JP90 / 01666 Sec。 371日期1991年8月19日 102（e）日期1991年8月19日PCT 1990年12月20日PCT PCT。第WO91 / 09062号公报日期：1991年6月27日。具有优异的热稳定性，耐候性和用作印刷电路板用树脂的电性能，用于密封半导体的树脂，绝缘材料等的新型羟基苯基树脂; 制备树脂的方法; 和包含其的可固化环氧组合物。具体地说，本发明提供含有多个酚羟基并具有高软化点且基本上不含双键的新型树脂; 和其制备方法，其中使用丁二烯低聚物和酚化合物作为原料; 以及包含适合于诸如密封材料的应用的可固化环氧树脂组合物。

6. 发明授权

US4639503A Thermosetting resin composition 失效
标题翻译：热固性树脂组合物
公开(公告)号：US4639503A
公开(公告)日：1987-01-27
申请号：US798426
申请日：1985-11-15
申请人： Hajime Hara , Shingo Orii , Kazuho Aoyama , Masami Enomoto
发明人： Hajime Hara , Shingo Orii , Kazuho Aoyama , Masami Enomoto
IPC分类号： C08L7/00 , C08G59/00 , C08L9/00 , C08L15/00 , C08L21/00 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/62
CPC分类号： H01B3/40 , C08L15/00 , C08L63/00
摘要： A thermosetting resin composition having an improved crack resistance comprising 100 weight parts of a curable epoxy resin and 30 to 300 weight parts of a phenol compound-added conjugated diolefin polymer, which is prepared in the presence of aluminum phenoxide as the catalyst. The composition is suitable for resin encapsulation of electronic components.
摘要翻译：具有改进的抗裂性的热固性树脂组合物，其包含100重量份可固化环氧树脂和30至300重量份在苯酚氧化铝作为催化剂存在下制备的苯酚化合物加合的共轭二烯烃聚合物。该组合物适用于电子元件的树脂封装。

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