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1. 发明授权

US09100755B2 Sound reproducing apparatus for sound reproduction using an ultrasonic transducer via mode-coupled vibration 有权
标题翻译：用于通过模式耦合振动使用超声波换能器进行声音再现的声音再现装置
公开(公告)号：US09100755B2
公开(公告)日：2015-08-04
申请号：US13061762
申请日：2009-09-17
申请人： Katsu Takeda , Masaki Tada , Masashi Minakuchi , Fumiyasu Konno
发明人： Katsu Takeda , Masaki Tada , Masashi Minakuchi , Fumiyasu Konno
IPC分类号： H04B3/00 , H04R25/00 , H04R17/10
CPC分类号： H04R17/10 , H04R2217/03
摘要： In a sound reproducing apparatus, part of a frequency band where mode-coupled vibration can be excited is regarded as a carrier frequency. A frequency of mode coupling, with a low rate of change in vibration displacement with respect to the frequency, is regarded as a carrier signal so that a signal in an audible band which is outputted from an audible band signal source can be demodulated and reproduced with stable sound pressure in a broad frequency band.
摘要翻译：在声音再现装置中，可以激励模式耦合振动的频带的一部分被认为是载波频率。将振动位移相对于频率的低变化率的模式耦合的频率视为载波信号，使得从可听频带信号源输出的可听频带中的信号可以被解调和再现，在宽频带内稳定的声压。

2. 发明申请

US20110170712A1 SOUND REPRODUCING APPARATUS 有权
标题翻译：声音再现设备
公开(公告)号：US20110170712A1
公开(公告)日：2011-07-14
申请号：US13061762
申请日：2009-09-17
申请人： Katsu Takeda , Masaki Tada , Masashi Minakuchi , Fumiyasu Konno
发明人： Katsu Takeda , Masaki Tada , Masashi Minakuchi , Fumiyasu Konno
IPC分类号： H03G5/00
CPC分类号： H04R17/10 , H04R2217/03
摘要： In a sound reproducing apparatus, part of a frequency band where mode-coupled vibration can be excited is regarded as a carrier frequency. A frequency of mode coupling, with a low rate of change in vibration displacement with respect to the frequency, is regarded as a carrier signal so that a signal in an audible band which is outputted from an audible band signal source can be demodulated and reproduced with stable sound pressure in a broad frequency band.
摘要翻译：在声音再现装置中，可以激励模式耦合振动的频带的一部分被认为是载波频率。将振动位移相对于频率的低变化率的模式耦合的频率视为载波信号，使得从可听频带信号源输出的可听频带中的信号可以被解调和再现，在宽频带内稳定的声压。

3. 发明申请

US20110188672A1 ACOUSTIC REPRODUCTION DEVICE 审中-公开
标题翻译：声音再现设备
公开(公告)号：US20110188672A1
公开(公告)日：2011-08-04
申请号：US13058060
申请日：2009-10-02
申请人： Masaki Tada , Katsu Takeda , Masashi Minakuchi , Fumiyasu Konno
发明人： Masaki Tada , Katsu Takeda , Masashi Minakuchi , Fumiyasu Konno
IPC分类号： H03G5/00
CPC分类号： H04R17/00
摘要： A sound reproduction apparatus reproduces a sound wave at a listening position. The sound reproduction apparatus includes a compensation processing unit for compensating an audible band signal having an audible band frequency, a carrier signal oscillator for generating a carrier signal, a modulator for outputting a modulated signal obtained by modulating the carrier signal based on the audible band signal compensated by the compensation processing unit, and a sound emission unit for outputting a sound wave depending on the modulated signal output from the modulator. The compensation processing unit compensates the audible band signal based on a distance from the sound emission unit to the listening position. This sound reproduction apparatus can reproduce the original audible band signal with a high fidelity regardless of the listening position.
摘要翻译：声音再现装置在收听位置再现声波。声音再现装置包括用于补偿具有可听频带频率的可听频带信号的补偿处理单元，用于产生载波信号的载波信号振荡器，用于输出基于可听频带信号调制载波信号而获得的调制信号的调制器由补偿处理单元补偿，以及声音发射单元，用于根据从调制器输出的调制信号输出声波。补偿处理单元基于从声音发射单元到收听位置的距离补偿可听频带信号。这种声音再现装置可以以高保真度再现原始可听频带信号，而不管收听位置如何。

4. 发明授权

US09005504B2 Method of manufacturing resin molded electronic component 有权
标题翻译：制造树脂模制电子部件的方法
公开(公告)号：US09005504B2
公开(公告)日：2015-04-14
申请号：US13056702
申请日：2010-06-17
申请人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
发明人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
IPC分类号： B29C43/18 , B29C39/00 , B29C39/10 , B29C39/38 , B29C39/40 , H01G9/012 , H01G9/10 , H01G9/15 , H01G13/00 , H01G4/224 , B29C70/70 , B29C70/72 , B29K23/00 , B29K105/00
CPC分类号： B29C43/18 , B29C39/006 , B29C39/10 , B29C39/38 , B29C39/405 , B29C70/70 , B29C70/72 , B29C2043/181 , B29C2043/182 , B29K2023/38 , B29K2105/0002 , H01G9/012 , H01G9/10 , H01G9/15 , H01G13/003
摘要： A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.
摘要翻译：使用具有开口顶面的空腔的第一模具和与顶部的第一模具结合的第二模具的树脂模制电子部件的制造方法包括以下步骤：（A）将电子部件的元件和液体树脂前体进入第一模具的空腔，液体树脂前体在40℃下的粘度为10Pa·s以下。（B）在所述工序（A）之后，将所述第二模具配置成使得所述元件和所述树脂前体被夹持; 和（C）在第一模具和第二模具之间挤压元件和树脂前体，并且在步骤（B）之后，通过来自第二模具的热量使树脂前体固化。将第二模具的温度设定为高于第一模具的温度。

5. 发明申请

US20110127694A1 METHOD OF MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT (AS AMENDED) 有权
标题翻译：制造树脂模制电子元件的方法（如修订版）
公开(公告)号：US20110127694A1
公开(公告)日：2011-06-02
申请号：US13056702
申请日：2010-06-17
申请人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
发明人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
IPC分类号： H01G4/224
CPC分类号： B29C43/18 , B29C39/006 , B29C39/10 , B29C39/38 , B29C39/405 , B29C70/70 , B29C70/72 , B29C2043/181 , B29C2043/182 , B29K2023/38 , B29K2105/0002 , H01G9/012 , H01G9/10 , H01G9/15 , H01G13/003
摘要： A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.
摘要翻译：使用具有开口顶面的空腔的第一模具和与顶部的第一模具结合的第二模具的树脂模制电子部件的制造方法包括以下步骤：（A）将电子部件的元件和液体树脂前体进入第一模具的空腔，液体树脂前体在40℃下的粘度为10Pa·s以下。（B）在所述工序（A）之后，将所述第二模具配置成使得所述元件和所述树脂前体被夹持; 和（C）在第一模具和第二模具之间挤压元件和树脂前体，并且在步骤（B）之后，通过来自第二模具的热量使树脂前体固化。将第二模具的温度设定为高于第一模具的温度。

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