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1. 发明申请

US20090078301A1 SOLAR CELL MODULE 审中-公开
标题翻译：太阳能电池模块
公开(公告)号：US20090078301A1
公开(公告)日：2009-03-26
申请号：US12236560
申请日：2008-09-24
申请人： Masaki SHIMA , Teruhiko Ienaga , Hiroyuki Kannou
发明人： Masaki SHIMA , Teruhiko Ienaga , Hiroyuki Kannou
IPC分类号： H01L31/042
CPC分类号： H01L31/0508 , H01L31/048 , Y02E10/50
摘要： According to a solar cell module 100 of the present invention, a wiring member (first wiring member 11, second wiring member 12m or fourth wiring member 14) includes contact portions 11a, 12a, and 14a which contacts with the main surface of the solar cell 10, and noncontact portions 11b, 12b, and 14b continuous with the contact-portions 11a, 12a, and 14a and extending outward from the main surface of the solar cell 10. The noncontact portion is arranged to leave a space from a boundary portion α between the main surface of the solar cell 10 and the side surface of the solar call 10.
摘要翻译：根据本发明的太阳能电池模块100，布线构件（第一布线构件11，第二布线构件12m或第四布线构件14）包括与太阳能电池的主表面接触的接触部分11a，12a和14a 10以及与接触部分11a，12a和14a连续并且从太阳能电池10的主表面向外延伸的非接触部分11b，12b和14b。非接触部分布置成从边界部分α 在太阳能电池10的主表面和太阳能电池10的侧表面之间。

2. 发明申请

US20080230115A1 METHOD FOR FRACTURING SEMICONDUCTOR SUBSTRATE, METHOD FOR FRACTURING SOLAR CELL, AND THE SOLAR CELL 有权
标题翻译：破碎半导体基板的方法，用于破碎太阳能电池的方法和太阳能电池
公开(公告)号：US20080230115A1
公开(公告)日：2008-09-25
申请号：US12046534
申请日：2008-03-12
申请人： Hiroyuki Kannou , Masaki Shima
发明人： Hiroyuki Kannou , Masaki Shima
IPC分类号： H01L31/04 , H01L21/78 , H01L31/18
CPC分类号： H01L31/1804 , B28D5/0011 , H01L31/0352 , H01L31/18
摘要： In accordance with the present invention, the dividing grooves 8 are formed so as not to be parallel to cleavage planes of the semiconductor substrate 1, and the semiconductor substrate 1 is bent along the dividing grooves 8, whereby the semiconductor substrate 1 is fractured along the dividing grooves 8.
摘要翻译：根据本发明，分隔槽8形成为不与半导体衬底1的解理面平行，并且半导体衬底1沿着分隔槽8弯曲，由此半导体衬底1沿着分隔槽8。

3. 发明申请

US20080230116A1 METHOD FOR MANUFACTURING SOLAR CELL, AND THE SOLAR CELL 审中-公开
标题翻译：制造太阳能电池和太阳能电池的方法
公开(公告)号：US20080230116A1
公开(公告)日：2008-09-25
申请号：US12046551
申请日：2008-03-12
申请人： Hiroyuki Kannou , Masaki Shima
发明人： Hiroyuki Kannou , Masaki Shima
IPC分类号： H01L31/04 , H01L31/18
CPC分类号： H01L31/035281 , B23K26/082 , B23K26/40 , B23K2103/50 , H01L31/0687 , H01L31/076 , Y02E10/544 , Y02E10/548 , Y02P70/521
摘要： In accordance with the present invention, the method for manufacturing the solar cell includes: forming a dividing groove 8a that reaches a n-type single crystal silicon substrate 1 in a thickness direction of a photoelectric conversion part 10; and fracturing the photoelectric conversion part 10 along the dividing groove 8a, wherein the dividing groove 8a is formed continuously in an inside of an outer circumference portion of the photoelectric conversion part 10.
摘要翻译：根据本发明，太阳能电池的制造方法包括：在光电转换部10的厚度方向上形成到达n型单晶硅基板1的分割槽8a; 并且沿着分割槽8a将光电转换部10断裂，其中分割槽8a在光电转换部10的外周部的内侧连续地形成。

4. 发明授权

US08389320B2 Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell 有权
$Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell$
标题翻译：破碎半导体衬底的方法，压裂太阳能电池的方法和太阳能电池
公开(公告)号：US08389320B2
公开(公告)日：2013-03-05
申请号：US12046534
申请日：2008-03-12
申请人： Hiroyuki Kannou , Masaki Shima
发明人： Hiroyuki Kannou , Masaki Shima
IPC分类号： H01L21/00 , H01L31/00
CPC分类号： H01L31/1804 , B28D5/0011 , H01L31/0352 , H01L31/18
摘要： In accordance with the present invention, the dividing grooves 8 are formed so as not to be parallel to cleavage planes of the semiconductor substrate 1, and the semiconductor substrate 1 is bent along the dividing grooves 8, whereby the semiconductor substrate 1 is fractured along the dividing grooves 8.
摘要翻译：根据本发明，分隔槽8形成为不与半导体衬底1的解理面平行，并且半导体衬底1沿着分隔槽8弯曲，由此半导体衬底1沿着分隔槽8。

5. 外观设计

USD652375S1 Solar battery 有权
标题翻译：太阳能电池
公开(公告)号：USD652375S1
公开(公告)日：2012-01-17
申请号：US29398265
申请日：2011-07-28
申请人： Hiroyuki Kannou , Satoshi Tohoda
设计人： Hiroyuki Kannou , Satoshi Tohoda

6. 外观设计

USD694175S1 Solar battery module 有权
标题翻译：太阳能电池模块
公开(公告)号：USD694175S1
公开(公告)日：2013-11-26
申请号：US29379985
申请日：2010-11-29
申请人： Hiroyuki Kannou , Yousuke Ishii , Tomonori Tabe , Yu Maruyama , Kengo Matsune , Koutarou Sumitomo
设计人： Hiroyuki Kannou , Yousuke Ishii , Tomonori Tabe , Yu Maruyama , Kengo Matsune , Koutarou Sumitomo

7. 外观设计

USD670239S1 Solar battery 有权
公开(公告)号：USD670239S1
公开(公告)日：2012-11-06
申请号：US29379989
申请日：2010-11-29
申请人： Hiroyuki Kannou , Yousuke Ishii , Tomonori Tabe , Yu Maruyama , Kengo Matsune , Koutarou Sumitomo
设计人： Hiroyuki Kannou , Yousuke Ishii , Tomonori Tabe , Yu Maruyama , Kengo Matsune , Koutarou Sumitomo

8. 发明授权

US09608138B2 Solar cell module 有权
公开(公告)号：US09608138B2
公开(公告)日：2017-03-28
申请号：US13361007
申请日：2012-01-30
申请人： Shigeharu Taira , Yukihiro Yoshimine , Hiroyuki Kannou , Tomonori Tabe
发明人： Shigeharu Taira , Yukihiro Yoshimine , Hiroyuki Kannou , Tomonori Tabe
IPC分类号： H01L31/00 , H01L31/042 , H02N6/00 , H01L31/0224 , H01L31/02 , H01L31/05
CPC分类号： H01L31/022433 , H01L31/0201 , H01L31/02013 , H01L31/022425 , H01L31/022441 , H01L31/05 , H01L31/0504 , H01L31/0516 , Y02E10/50
摘要： In the solar cell module including a plurality of solar cells interconnected with wiring members, each of the solar cells includes a plurality of front-side finger electrodes that are disposed on a light-receiving surface of the solar cell and connected with tabs and a plurality of rear-side finger electrodes that are disposed on a rear surface of the solar cell and connected with tabs. Rear-side auxiliary electrode sections are arranged in regions, which is wider than the front-side finger electrodes, on the rear surface opposite to regions where the front-side finger electrodes are present.

9. 外观设计

USD696186S1 Solar battery module 有权
公开(公告)号：USD696186S1
公开(公告)日：2013-12-24
申请号：US29398263
申请日：2011-07-28
申请人： Hiroyuki Kannou , Satoshi Tohoda
设计人： Hiroyuki Kannou , Satoshi Tohoda

10. 发明授权

US08034653B2 Method and apparatus for breaking semiconductor substrate, method for breaking solar cell and method for fabrication of solar cell module 有权
标题翻译：用于破坏半导体衬底的方法和装置，用于破坏太阳能电池的方法和太阳能电池模块的制造方法
公开(公告)号：US08034653B2
公开(公告)日：2011-10-11
申请号：US11964405
申请日：2007-12-26
申请人： Hiroyuki Kannou
发明人： Hiroyuki Kannou
IPC分类号： H01L21/00 , B26F3/00 , B65H35/00
CPC分类号： H01L31/18 , B26F3/002 , H01L21/67092 , Y10T225/325 , Y10T225/371
摘要： A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the semiconductor substrate inside the predetermined area and a breaking blade being operable to move downward from a position above the semiconductor substrate placed on the table to thereby compress a portion of the semiconductor substrate outside the predetermined area so that the semiconductor substrate is broken along the split groove. The predetermined area of the semiconductor substrate has at least a neighboring pair of sides intersecting at an angle of less than 180 degrees, and the breaking blade has a projection which, when the semiconductor substrate is broken, compresses a portion of the semiconductor substrate outside the one side so that the one side is compressed ahead of the other side.
摘要翻译：一种用于沿着形成有分裂槽的预定区域断开半导体衬底的方法和装置。断开装置包括用于将半导体衬底的一部分放置在预定区域内的工作台，并且破坏刀片可操作以从放置在工作台上的半导体衬底上方的位置向下移动，从而将半导体衬底的一部分压缩在预定的使得半导体衬底沿着分割槽断开。半导体衬底的预定区域至少具有与小于180度的角度相交的相邻的一对侧面，并且所述断裂刀片具有突起，当所述半导体衬底断裂时，将所述半导体衬底的一部分压缩在所述半导体衬底的外部一侧使得一侧在另一侧之前被压缩。

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