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1. 发明申请

US20050214552A1 Flexible metal foil-polyimide laminate and making method 审中-公开
标题翻译：柔性金属箔 - 聚酰亚胺层压板及其制造方法
公开(公告)号：US20050214552A1
公开(公告)日：2005-09-29
申请号：US11087687
申请日：2005-03-24
申请人： Masahiro Usuki , Michio Aizawa , Makoto Fujiwara , Shigehiro Hoshida , Tadashi Amano
发明人： Masahiro Usuki , Michio Aizawa , Makoto Fujiwara , Shigehiro Hoshida , Tadashi Amano
IPC分类号： B32B15/088 , B05D7/14 , B05D7/24 , B32B5/00 , B32B7/12 , B32B15/08 , C08G69/26 , H05K1/00 , H05K1/03 , H05K3/38
CPC分类号： B32B15/08 , B32B7/12 , B32B15/02 , B32B15/18 , B32B15/20 , B32B27/281 , B32B2307/306 , B32B2307/3065 , B32B2435/00 , C09J179/08 , H05K1/0346 , H05K1/0393 , H05K3/386 , Y10T428/31681
摘要： A flexible metal foil-polyimide laminate is prepared by applying a dimethylacetamide solution of polyamic acid onto a metal foil, drying the applied solution to form a semi-dry adhesive layer, laminating a polyimide film thereto on a hot roll press, and heat curing for solvent removal and imidization. The polyimide film has a dimethylacetamide gas permeability of at least 0.1 kg/m2·hr at 5 Torr and 200° C. In the heat curing step, the residual solvent and the water formed upon imidization in the adhesive layer are removed through the polyimide film.
摘要翻译：通过将聚酰胺酸的二甲基乙酰胺溶液涂布在金属箔上，干燥所得溶液以形成半干燥粘合剂层，在热辊压机上层压聚酰亚胺膜，并对其进行热固化，制备柔性金属箔 - 聚酰亚胺层压体溶剂去除和酰亚胺化。聚酰亚胺薄膜在5托和200℃下的二甲基乙酰胺气体渗透率为至少0.1kg / m 2·hr。在热固化步骤中，残留溶剂和在酰亚胺化中形成的水通过聚酰亚胺膜去除粘合剂层。

2. 发明申请

US20050181223A1 Flexible metal foil-polyimide laminate and making method 审中-公开
标题翻译：柔性金属箔 - 聚酰亚胺层压板及其制造方法
公开(公告)号：US20050181223A1
公开(公告)日：2005-08-18
申请号：US11046751
申请日：2005-02-01
申请人： Michio Aizawa , Masahiro Usuki , Tatsuya Fujimoto , Shigehiro Hoshida , Tadashi Amano
发明人： Michio Aizawa , Masahiro Usuki , Tatsuya Fujimoto , Shigehiro Hoshida , Tadashi Amano
IPC分类号： B32B15/088 , B32B15/08 , C08G69/26 , C09J179/08 , H05K1/03 , H05K3/38
CPC分类号： B32B7/12 , B32B15/08 , B32B15/20 , B32B27/06 , B32B27/281 , B32B27/34 , B32B2307/306 , B32B2307/74 , H05K1/0346 , H05K3/386 , H05K2201/0145 , H05K2201/0154 , H05K2201/0355 , Y10T428/31681
摘要： A flexible metal foil-polyimide laminate is prepared by joining a polyimide film to a metal foil via an intervening adhesive layer. The adhesive is a mixture of polyamic acids: (A) the reaction product of 3,4,3′,4′-biphenyltetracarboxylic anhydride with p-phenylenediamine, (B) the reaction product of 3,4,3′,4′-biphenyltetracarboxylic anhydride with 4,4′-diaminodiphenyl ether, and (C) the reaction product of pyromellitic dianhydride with 4,4′-diaminodiphenyl ether, in a weight ratio (A+B)/C between 75/25 and 25/75. The method is simple and inexpensive, and yields a flexible metal foil-polyimide laminate that is improved in peel strength and curling resistance while maintaining the heat resistance of polyimide.
摘要翻译：通过中间粘合剂层将聚酰亚胺膜与金属箔接合来制备柔性金属箔 - 聚酰亚胺层压体。粘合剂是聚酰胺酸的混合物：（A）3,4,3'，4'-联苯四羧酸酐与对苯二胺的反应产物，（B）3,4,3'，4'- 联苯四羧酸酐与4,4'-二氨基二苯醚，（C）均苯四酸二酐与4,4'-二氨基二苯醚的反应产物，重量比（A + B）/ C在75/25和25/75之间。该方法简单且便宜，并且产生柔软的金属箔 - 聚酰亚胺层压板，其在保持聚酰亚胺的耐热性的同时提高了剥离强度和抗卷曲性。

3. 发明申请

US20060042750A1 Preparation of flexible copper foil/polyimide laminate 失效
标题翻译：柔性铜箔/聚酰亚胺层压板的制备
公开(公告)号：US20060042750A1
公开(公告)日：2006-03-02
申请号：US11194606
申请日：2005-08-02
申请人： Masahiro Usuki , Makoto Fujiwara , Shigehiro Hoshida , Michio Aizawa , Tadashi Amano
发明人： Masahiro Usuki , Makoto Fujiwara , Shigehiro Hoshida , Michio Aizawa , Tadashi Amano
IPC分类号： B32B37/00
CPC分类号： B32B7/12 , B32B15/08 , B32B15/20 , B32B27/281 , B32B37/12 , B32B2307/202 , B32B2307/3065 , B32B2309/105 , B32B2311/12 , B32B2379/08 , B32B2457/08 , H05K1/0346 , H05K3/025 , H05K3/386 , H05K2201/0154 , H05K2201/0358 , Y10T428/31681
摘要： A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.
摘要翻译：通过将聚酰胺酸清漆涂布到载体上的非常薄的铜箔上，半干燥清漆，使用热辊压机将聚酰亚胺膜层压到涂覆有漆膜的铜箔上，制备柔性金属箔/聚酰亚胺层压体在具有受控氧浓度的气氛中处理该层压板用于溶剂去除和酰亚胺化。由聚酰胺酸酰亚胺化得到的聚酰亚胺粘合剂层的厚度最高达6μm，聚酰亚胺膜和聚酰亚胺粘合剂层的厚度之和高达25μm。聚酰亚胺粘合剂层的Tg> 400℃

4. 发明申请

US20060191632A1 Method for producing flexible metal foil-polyimide laminate 审中-公开
标题翻译：柔性金属箔 - 聚酰亚胺层压板的制造方法
公开(公告)号：US20060191632A1
公开(公告)日：2006-08-31
申请号：US10545810
申请日：2004-06-16
申请人： Masahiro Usuki , Michio Aizawa , Shigehiro Hoshida , Tadashi Amano
发明人： Masahiro Usuki , Michio Aizawa , Shigehiro Hoshida , Tadashi Amano
IPC分类号： B32B37/00
CPC分类号： B32B15/20 , B32B7/12 , B32B15/08 , B32B27/281 , B32B27/34 , B32B37/1207 , B32B2250/40 , B32B2255/06 , B32B2255/26 , B32B2307/306 , B32B2307/3065 , B32B2307/714 , B32B2311/00 , B32B2379/08 , B32B2457/08 , C09J5/06 , C09J2400/163 , C09J2479/086 , H05K1/0346 , H05K3/227 , H05K3/386 , H05K2203/1105
摘要： A method for preparing a flexible metal foil/polyimide laminate is characterized by laminating a metal foil and a polyimide film, with a heat resistant adhesive interleaved therebetween, on a heating roll press, and heat treating the laminate for removing the residual solvent from the adhesive layer and heat curing the adhesive layer.
摘要翻译：制备柔性金属箔/聚酰亚胺层压体的方法的特征在于，在加热辊压机上层压金属箔和聚酰亚胺膜，其间插入有耐热粘合剂，并且对层压体进行热处理以从粘合剂中除去残留溶剂层和热固化粘合剂层。

5. 发明授权

US07060784B2 Polyimide precursor resin solution composition sheet 失效
标题翻译：聚酰亚胺前体树脂溶液组合物片
公开(公告)号：US07060784B2
公开(公告)日：2006-06-13
申请号：US10874715
申请日：2004-06-24
申请人： Shigehiro Hoshida , Masahiro Usuki , Michio Aizawa , Tadashi Amano
发明人： Shigehiro Hoshida , Masahiro Usuki , Michio Aizawa , Tadashi Amano
IPC分类号： C08G73/10 , B32B27/00 , B32B27/06 , B32B15/04
CPC分类号： B32B15/08 , B32B15/20 , B32B27/281 , B32B2038/0076 , B32B2307/306 , C08J5/128 , C08J5/18 , C08J2379/08 , C08L79/08 , H05K1/0346 , H05K3/386 , H05K2201/0154 , H05K2201/0358 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide precursor resin solution composition sheet having a solvent content of 1–50% by weight and a thickness of 1–10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.
摘要翻译：溶剂含量为1-50重量％且厚度为1-10微米的聚酰亚胺前体树脂溶液组合物片材具有改善的粘附性，当固化时形成耐热聚酰亚胺层，并且有利地用于将导体粘合到塑料电影。

6. 发明授权

US07459047B2 Preparation of flexible copper foil/polyimide laminate 失效
标题翻译：柔性铜箔/聚酰亚胺层压板的制备
公开(公告)号：US07459047B2
公开(公告)日：2008-12-02
申请号：US11194606
申请日：2005-08-02
申请人： Masahiro Usuki , Makoto Fujiwara , Shigehiro Hoshida , Michio Aizawa , Tadashi Amano
发明人： Masahiro Usuki , Makoto Fujiwara , Shigehiro Hoshida , Michio Aizawa , Tadashi Amano
IPC分类号： B29C65/52 , B32B15/08
CPC分类号： B32B7/12 , B32B15/08 , B32B15/20 , B32B27/281 , B32B37/12 , B32B2307/202 , B32B2307/3065 , B32B2309/105 , B32B2311/12 , B32B2379/08 , B32B2457/08 , H05K1/0346 , H05K3/025 , H05K3/386 , H05K2201/0154 , H05K2201/0358 , Y10T428/31681
摘要： A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.
摘要翻译：通过将聚酰胺酸清漆涂布到载体上的非常薄的铜箔上，半干燥清漆，使用热辊压机将聚酰亚胺膜层压到涂覆有漆膜的铜箔上，制备柔性金属箔/聚酰亚胺层压体在具有受控氧浓度的气氛中处理该层压板用于溶剂去除和酰亚胺化。由聚酰胺酸酰亚胺化得到的聚酰亚胺粘合剂层的厚度最高达6μm，聚酰亚胺膜和聚酰亚胺粘合剂层的厚度之和高达25μm。聚酰亚胺粘合剂层的Tg> 400℃

7. 发明申请

US20060134443A1 Flexible metal foil-polyimide laminate 审中-公开
标题翻译：柔性金属箔 - 聚酰亚胺层压板
公开(公告)号：US20060134443A1
公开(公告)日：2006-06-22
申请号：US10544346
申请日：2004-06-16
申请人： Michio Aizawa , Masahiro Usuki , Shigehiro Hoshida , Tadashi Amano
发明人： Michio Aizawa , Masahiro Usuki , Shigehiro Hoshida , Tadashi Amano
IPC分类号： B32B27/00
CPC分类号： B32B27/281 , B32B15/08 , B32B15/20 , B32B2250/03 , B32B2274/00 , B32B2307/306 , B32B2307/546 , B32B2307/714 , B32B2307/734 , B32B2457/00 , B32B2457/08 , H05K1/0346 , H05K1/036 , H05K2201/0154 , Y10T428/31721
摘要： A flexible metal foil/polyimide laminate consists of all three layers, a polyimide film, a metal foil, and a polyimide resin layer disposed between the polyimide film and the metal foil.
摘要翻译：柔性金属箔/聚酰亚胺层叠体由聚酰亚胺膜，金属箔和设置在聚酰亚胺膜和金属箔之间的聚酰亚胺树脂层构成的全部三层组成。

8. 发明申请

US20060003173A1 Flexible metal foil/polyimide laminate and making method 审中-公开
标题翻译：柔性金属箔/聚酰亚胺层压板及其制造方法
公开(公告)号：US20060003173A1
公开(公告)日：2006-01-05
申请号：US11171198
申请日：2005-07-01
申请人： Masahiro Usuki , Makoto Fujiwara , Shigehiro Hoshida , Michio Aizawa , Tadashi Amano
发明人： Masahiro Usuki , Makoto Fujiwara , Shigehiro Hoshida , Michio Aizawa , Tadashi Amano
IPC分类号： B32B15/08
CPC分类号： B32B15/20 , B32B7/12 , B32B15/08 , B32B27/281 , B32B27/34 , B32B2250/02 , B32B2255/06 , B32B2255/26 , B32B2307/202 , B32B2307/306 , H05K1/0346 , H05K3/386 , H05K2201/0154 , H05K2201/0358 , Y10T428/31681
摘要： In a flexible metal foil/polyimide laminate comprising in sequence, a heat resistant polyimide film, an adhesive layer, and a metal foil, the adhesive layer is a polyimide adhesive layer with a Tg of at least 400° C., obtained by heat imidization of a polyamic acid varnish containing 5-200 ppm of a leveling agent, typically polyether-modified silicone. This laminate of the all polyimide type takes full advantage of the properties of heat resistant polyimide film, includes the adhesive layer having a smooth surface, and is free of thickness variations.
摘要翻译：在依次包含耐热聚酰亚胺膜，粘合剂层和金属箔的柔性金属箔/聚酰亚胺层压体中，粘合剂层是Tg为至少400℃的聚酰亚胺粘合剂层，通过酰亚胺化获得的聚酰胺酸清漆，其含有5-200ppm的流平剂，通常为聚醚改性的硅氧烷。所有聚酰亚胺类型的这种层压体充分利用了耐热聚酰亚胺膜的性质，包括具有光滑表面的粘合剂层，并且没有厚度变化。

9. 发明申请

US20080113184A1 ADHESIVE SHEET 审中-公开
标题翻译：粘合片
公开(公告)号：US20080113184A1
公开(公告)日：2008-05-15
申请号：US11939973
申请日：2007-11-14
申请人： Shinichiro YOSHIDA , Masahiro Usuki , Tadashi Amano
发明人： Shinichiro YOSHIDA , Masahiro Usuki , Tadashi Amano
IPC分类号： B32B7/12
CPC分类号： H05K3/386 , C09J7/35 , C09J163/00 , C09J2463/00 , C09J2475/00 , H05K1/0393 , H05K2201/0145 , H05K2201/0209 , Y10T428/26
摘要： An adhesive sheet including a releasable base material, and an adhesive layer formed on one surface of the base material is provided. The adhesive layer includes an adhesive composition including (A) 100 parts by mass of a carboxyl group-containing urethane-modified polyester resin, (B) an epoxy resin, (C) a curing agent, and (D) an inorganic filler, and has a thickness within a range from 40 to 100 μm. The adhesive sheet has a high degree of adhesiveness and excellent anti-migration properties, and is also effective as an interlayer insulating material.
摘要翻译：提供了包括可释放基材的粘合片和形成在基材的一个表面上的粘合剂层。粘合剂层包括粘合剂组合物，其包含（A）100质量份含羧基的氨基甲酸酯改性聚酯树脂，（B）环氧树脂，（C）固化剂和（D）无机填料，以及具有40至100μm的范围内的厚度。粘合片具有高粘合性和优异的抗迁移性，并且也作为层间绝缘材料是有效的。

10. 发明授权

US06965002B2 Process for producing vinyl chloride-based polymer 失效
标题翻译：生产氯乙烯基聚合物的方法
公开(公告)号：US06965002B2
公开(公告)日：2005-11-15
申请号：US10754567
申请日：2004-01-12
申请人： Masahiro Usuki , Tadashi Amano
发明人： Masahiro Usuki , Tadashi Amano
IPC分类号： C08F2/00 , C08F14/06 , C08F114/06
CPC分类号： C08F14/06 , C08F2/16
摘要： A process is provided for producing a vinyl chloride-based polymer by polymerization of vinyl chloride or a monomer mixture containing it in a reaction vessel. Heat generated during polymerization is removed using a reflux condenser. When the polymerization rate is within a range from 30% to 50%, a copolymeric polyether, with a weight average molecular weight of 1,500,000 to 2,000,000, and an ethylene oxide to propylene oxide molar ratio within a range from 78/22 to 82/18, is added to the reaction mass. Foaming of the polymer slurry due to the use of the reflux condenser beyond the point where the polymerization rate reaches 60% is suppressed, and the polymer can be produced with no deleterious effects on the quality of the product polymer.
摘要翻译：提供了通过在反应容器中聚合氯乙烯或含有它的单体混合物来生产氯乙烯基聚合物的方法。使用回流冷凝器除去聚合期间产生的热量。当聚合速率在30％至50％的范围内时，共聚聚醚的重均分子量为1,500,000至2,000,000，环氧乙烷与环氧丙烷的摩尔比在78/22至82/18的范围内，加入到反应物料中。由于使用了回流冷凝器以上聚合速度达到60％以上的聚合物浆料的发泡被抑制，可以制造聚合物而对产品聚合物的质量没有有害的影响。

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