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1. 发明授权

US5104435A Method of making a plate microlens 失效
标题翻译：制作板微生物的方法
公开(公告)号：US5104435A
公开(公告)日：1992-04-14
申请号：US616734
申请日：1990-11-21
申请人： Masahiro Oikawa , Tetsuya Yamasaki , Kouji Tanaka , Eiji Okuda
发明人： Masahiro Oikawa , Tetsuya Yamasaki , Kouji Tanaka , Eiji Okuda
IPC分类号： G02B3/00
CPC分类号： C03C3/091 , C03C21/005 , C03C3/078 , C03C3/083 , C03C3/089 , G02B3/0087
摘要： In a plate microlens of the invention, wherein gradient index lenses each having an optical axis along a normal to a surface of a transparent base and a refractive index profile gradually changing along a direction of the optical axis and a direction perpendicular thereto are formed integrally in the transparent base; a ratio d/a (where d is a thickness of the gradient index lens on the optical axis and 2a is a diameter of the gradient index lens on a surface of the transparent base) falls within a range of 0.46 to 0.78. In a method for manufacturing a plate microlens of the invention, of forming integrally in a transparent base, gradient index lenses with a gradient index profile based on a concentration gradient of a substance for increasing the refractive index of the transparent base, by forming a diffusion preventive mask with predetermined apertures on a surface of the transparent base and diffusing the substance into the transparent base through the apertures; a ratio a/rm (where rm is a radius of the apertures and a is a radius of the gradient index lenses to be formed) satisfies a relation 1.75.ltoreq.a/rm.ltoreq.4.5.

2. 发明授权

US4952037A Plate microlens and method for manufacturing the same 失效
标题翻译：板微透镜及其制造方法
公开(公告)号：US4952037A
公开(公告)日：1990-08-28
申请号：US317079
申请日：1989-02-28
申请人： Masahiro Oikawa , Tetsuya Yamasaki , Kouji Tanaka , Eiji Okuda
发明人： Masahiro Oikawa , Tetsuya Yamasaki , Kouji Tanaka , Eiji Okuda
IPC分类号： G02B3/00
CPC分类号： C03C3/091 , C03C21/005 , C03C3/078 , C03C3/083 , C03C3/089 , G02B3/0087
摘要： In a plate microlens of the invention wherein gradient index lenses each having an optical axis along a normal to a surface of a transparent base and a refractive index profile gradually changing along a direction of the optical axis and a direction perpendicular thereto are formed integrally in the transparent base, a ratio d/a (where d is a thickness of the gradient index lens on the optical axis and 2a is a diameter of the gradient index lens on a surface of the transparent base) falls within a range of 0.46 to 0.78. In a method for manufacturing a plate microlens of the invention of forming integrally in a transparent base gradient index lenses with a gradient index profile based on a concentration gradient of a substance for increasing the refractive index of the transparent base, by forming a diffusion preventive mask with predetermined apertures on a surface of the transparent base and diffusing the substance into the transparent base through the apertures, a ratio a/rm (where rm is a radius of the apertures and a is a radius of the gradient index lenses to be formed) satisfies a relation 1.75.ltoreq.a/rm.ltoreq.4.5.
摘要翻译：在本发明的板微透镜中，其中具有沿着垂直于透明基底的法线的光轴和沿着光轴的方向和垂直于其的方向逐渐变化的折射率分布的梯度折射率透镜一体形成在透明基材，比率d / a（其中d是光轴上的梯度折射率透镜的厚度，2a是透明基材的表面上的梯度折射率透镜的直径）在0.46〜0.78的范围内。在本发明的板微透镜的制造方法中，通过形成扩散防止掩模，通过形成基于用于增加透明基材的折射率的物质的浓度梯度的梯度折射率分布的透明基底梯度折射率透镜，在透明基底的表面上具有预定的孔，并且通过孔将物质扩散到透明基底中，比率a / rm（其中rm是孔的半径，a是要形成的渐变折射率透镜的半径）满足关系1.75

3. 发明授权

US4693544A Optical branching device with internal waveguide 失效
标题翻译：具有内部波导的光分路器
公开(公告)号：US4693544A
公开(公告)日：1987-09-15
申请号：US558507
申请日：1983-12-06
申请人： Tetsuya Yamasaki , Eiji Okuda
发明人： Tetsuya Yamasaki , Eiji Okuda
IPC分类号： G02B6/34 , G02B6/28
CPC分类号： G02B6/2938 , G02B6/29364 , G02B6/29367
摘要： An optical waveguide device of the invention has an optical waveguide which is a region formed in a transparent substrate and has a refractive index higher than that of the transparent substrate. The optical waveguide consists of first and second optical waveguide elements each having one end exposed to a surface of the transparent substrate and the other end connected in the vinicity of the surface of the transparent substrate, such that the connecting portion thereof is exposed to the surface of the transparent substrate.
摘要翻译：本发明的光波导装置具有形成在透明基板中的折射率高于透明基板的折射率的光波导。光波导由第一和第二光波导元件组成，每个光波导元件的一端暴露于透明基板的表面，另一端以透明基板的表面的连续部分连接，使得其连接部分暴露于表面的透明基板。

4. 发明授权

US4509824A Plate lens and a method for manufacturing the same 失效
标题翻译：平板透镜及其制造方法
公开(公告)号：US4509824A
公开(公告)日：1985-04-09
申请号：US462146
申请日：1983-01-31
申请人： Tetsuya Yamasaki , Eiji Okuda , Noboru Yamamoto
发明人： Tetsuya Yamasaki , Eiji Okuda , Noboru Yamamoto
IPC分类号： G02B3/00 , G09F9/30 , H01J29/89 , G02B27/00 , B05D5/06
CPC分类号： G02B3/005 , G02B3/0056 , G02B3/0062 , G09F9/30 , H01J29/89 , H01J2229/893
摘要： A plate lens comprising a transparent base having two flat surfaces and having a plano-convex lens portion which is formed integrally with the transparent base, which has a refractive index greater than that of the transparent base and which has a substantially semicircular or circular section in a direction perpendicular to the flat surfaces of the transparent base. The plate lens has a light-shielding layer on one surface of the transparent base, as needed. The light-shielding layer covers one surface of the transparent base such that a transparent portion may be formed in the vicinity of a position opposing the central point or line of the plano-convex lens portion. The plate lens provides a clear and bright image and is therefore applicable to faceplates for various types of display devices, CRTs and the like. The plate lens may be mass-produced at low cost.
摘要翻译：一种平板透镜，包括具有两个平坦表面的透明基底，并且具有与透明基底一体形成的平凸透镜部分，其具有大于透明基底的折射率的折射率，并且具有基本上半圆形或圆形的部分垂直于透明基底的平坦表面的方向。根据需要，平板透镜在透明基底的一个表面上具有遮光层。遮光层覆盖透明基底的一个表面，使得透明部分可以形成在与平凸透镜部分的中心点相对的位置附近。平板透镜提供清晰明亮的图像，因此适用于各种显示装置，CRT等的面板。板状透镜可以以低成本批量生产。

5. 发明授权

US08899650B2 Board conveying hand and board conveying device provided with the same 有权
标题翻译：纸板输送手提板输送装置
公开(公告)号：US08899650B2
公开(公告)日：2014-12-02
申请号：US13283647
申请日：2011-10-28
申请人： Makoto Furuta , Toru Nakako , Tetsuya Yamasaki
发明人： Makoto Furuta , Toru Nakako , Tetsuya Yamasaki
IPC分类号： H01L21/68 , B65G49/07 , G02F1/13 , H01L21/683 , B65G47/91 , B25J15/06 , H01L21/677 , H01L21/687
CPC分类号： H01L21/6838 , B25J15/0616 , B65G47/918 , H01L21/67742 , H01L21/67748 , H01L21/6875
摘要： An adsorbent in a board conveying hand includes: a pad for adsorbing a board in contact with the board; and an elastic member interposed between the fork and the pad and provided with an adsorption passage for allowing an adsorbing fluid to pass between the fork and the pad, wherein a part of the elastic member is deformed, thus arbitrarily varying a projection amount of the pad from the fork.
摘要翻译：板传送手中的吸附剂包括：用于吸附与板接触的板的焊盘; 以及插入在所述叉和所述垫之间并且设置有用于允许吸附流体在所述叉和所述垫之间通过的吸附通道的弹性构件，其中所述弹性构件的一部分变形，从而任意地改变所述垫的投影量从叉子。

6. 发明申请

US20060202296A1 Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties 审中-公开
标题翻译：封装光接收和处理具有增强的屏蔽和接地性能的半导体模块
公开(公告)号：US20060202296A1
公开(公告)日：2006-09-14
申请号：US11431330
申请日：2006-05-10
申请人： Shinji Yano , Naoki Kumura , Tetsuya Yamasaki
发明人： Shinji Yano , Naoki Kumura , Tetsuya Yamasaki
IPC分类号： H01L31/0203
CPC分类号： H01L31/0203 , H01L31/02164 , H01L31/02325 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/49175 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a resin package, a conductive film formed on the resin package, and a lead partially covered by the resin package. The lead includes an inner portion covered by the resin package, and an outer portion projecting from the resin package. A semiconductor element is mounted to the inner portion of the lead. The inner portion of the lead includes a plurality of extensions for grounding, and each of the extensions has a front end held in contact with the conductive film.
摘要翻译：半导体模块包括树脂封装，形成在树脂封装上的导电膜和部分被树脂封装覆盖的引线。引线包括由树脂封装覆盖的内部部分和从树脂封装体突出的外部部分。半导体元件安装在引线的内部。引线的内部包括多个用于接地的延伸部，每个延伸部具有与导电膜保持接触的前端。

7. 发明授权

US07071523B2 Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties 有权
标题翻译：封装光接收和处理具有增强的屏蔽和接地性能的半导体模块
公开(公告)号：US07071523B2
公开(公告)日：2006-07-04
申请号：US10901006
申请日：2004-07-27
申请人： Shinji Yano , Naoki Kumura , Tetsuya Yamasaki
发明人： Shinji Yano , Naoki Kumura , Tetsuya Yamasaki
IPC分类号： H01L31/0203 , H01L31/0216 , H01L31/0224 , H01L31/0232
CPC分类号： H01L31/0203 , H01L31/02164 , H01L31/02325 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/49175 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module that includes a resin package having a first surface and a second surface which is different from the first surface. A lead includes an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package. A semiconductor element is mounted to the inner portion of the lead and is covered by the resin package. A conductive film, provided separately from the lead, covers at least the second surface of the resin package, with the conductive film provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package. The inner portion of the lead includes an extension extending toward the second surface of the resin package the extension being held in contact with the conductive film at the second surface of the resin package.
摘要翻译：一种半导体模块，包括具有第一表面和与第一表面不同的第二表面的树脂封装。引线包括由树脂封装覆盖的内部部分和从树脂封装的第一表面突出的外部部分。半导体元件安装在引线的内部并被树脂封装覆盖。与引线分开设置的导电膜至少覆盖树脂封装的第二表面，导电膜设置有在树脂封装的第一表面处与引线的外部部分保持接触的连接部分。引线的内部包括延伸到树脂封装的第二表面的延伸部，该延伸部在树脂封装的第二表面处与导电膜保持接触。

8. 外观设计

USD366665S Camera remote controller 失效
公开(公告)号：USD366665S
公开(公告)日：1996-01-30
申请号：US14385
申请日：1993-10-20
申请人： Hiroshi Morohoshi , Tetsuya Yamasaki
设计人： Hiroshi Morohoshi , Tetsuya Yamasaki

9. 发明申请

US20050073018A1 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US20050073018A1
公开(公告)日：2005-04-07
申请号：US10901006
申请日：2004-07-27
申请人： Shinji Yano , Naoki Kumura , Tetsuya Yamasaki
发明人： Shinji Yano , Naoki Kumura , Tetsuya Yamasaki
IPC分类号： G01J1/02 , H01L27/14 , H01L31/02 , H01L31/0203 , H01L31/0216 , H01L31/0232
CPC分类号： H01L31/0203 , H01L31/02164 , H01L31/02325 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/49175 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a resin package, a conductive film formed on the resin package, and a lead partially covered by the resin package. The lead includes an inner portion covered by the resin package, and an outer portion projecting from the resin package. A semiconductor element is mounted to the inner portion of the lead. The inner portion of the lead includes a plurality of extensions for grounding, and each of the extensions has a front end held in contact with the conductive film.
摘要翻译：半导体模块包括树脂封装，形成在树脂封装上的导电膜和部分被树脂封装覆盖的引线。引线包括由树脂封装覆盖的内部部分和从树脂封装体突出的外部部分。半导体元件安装在引线的内部。引线的内部包括多个用于接地的延伸部，每个延伸部具有与导电膜保持接触的前端。

10. 外观设计

USD374450S Holder for a camera remote controller 失效
公开(公告)号：USD374450S
公开(公告)日：1996-10-08
申请号：US39977
申请日：1995-06-07
申请人： Hiroshi Morohoshi , Tetsuya Yamasaki
设计人： Hiroshi Morohoshi , Tetsuya Yamasaki

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