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    • 1. 发明授权
    • Solder work material for forming solder-coated circuit board and circuit board
    • 用于形成焊接电路板和电路板的焊接工作材料
    • US06790293B2
    • 2004-09-14
    • US10147171
    • 2002-05-13
    • Masahiro NomuraToshiyuki OgaTakanobu GidoTakao OnoYoshiyuki TakahashiRika Sasaki
    • Masahiro NomuraToshiyuki OgaTakanobu GidoTakao OnoYoshiyuki TakahashiRika Sasaki
    • B23K35363
    • B23K35/025B23K35/0222B23K35/0227B23K35/0244B23K35/36B23K35/3613H05K3/3489
    • There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunction of circuit that may be caused to generate by voltage noises that tend to be generated by the volumetrical expansion of the flux residue in a soldered laminated ceramic capacitor, etc. even under the environments where temperatures fluctuate widely (for example, −40° C. to +85° C.), or that may be caused to generate by voltage noises to be generated by the fluctuation of parasitic capacity between circuits which may be caused to generate due to a flux residue. There is also provided a circuit board having a residual film of flux left thereon after the deposition of the solder work material. This solder work material is formed of a solder paste composition or a resin flux-cored solder, both comprising a flux containing, as a resin component, acrylic resin for preventing the generation of voltage noises in electronic devices. The circuit board is accompanied with a residual film of such a flux.
    • 提供了一种用于形成焊料涂覆的电路板的焊料加工材料,其能够防止由焊接层压体中的焊剂残留物的体积膨胀而倾向于产生的电压噪声产生的电路的故障 陶瓷电容器等,即使在温度波动较大的环境(例如-40℃至+ 85℃)下,或者可能由于电压噪声而产生的电压噪声将由寄生电容的波动产生, 可能由于助焊剂残留而产生的电路。 还提供了一种电路板,其在沉积焊料加工材料之后具有留在其上的残留的残余膜。 这种焊料加工材料由焊膏组合物或树脂药芯焊料形成,两者都包含含有作为树脂成分的助熔剂,用于防止在电子器件中产生电压噪声的丙烯酸树脂。 电路板伴随着这种焊剂的残留膜。