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    • 4. 发明授权
    • Fiber-reinforced prepreg and composite material obtained from the same
    • 纤维增强预浸料和由其获得的复合材料
    • US08034442B2
    • 2011-10-11
    • US12526705
    • 2008-01-24
    • Toru KanekoShusuke Sanai
    • Toru KanekoShusuke Sanai
    • D04H1/00B32B25/10
    • C08J5/24C08J2379/08Y10T428/249924Y10T428/249933
    • The present invention provides a prepreg made by impregnating a resin composition into a fiber reinforcing material, the resin composition comprising 50 to 60 parts by weight of an aromatic bismaleimide (A), 30 to 40 parts by weight of an alkenylphenol ether compound (B) expressed by a specific general formula, 5 to 15 parts by weight of an alkenyl aromatic comonomer (C), and 1 to 10% by weight of a thermoplastic resin (D) soluble in (B) or (C) based on the total amount of (A), (B) and (C), the aromatic bismaleimide (A) including 90% by weight or more of bismaleimide diphenylmethane, and a composite material having a glass transition temperature of 260 to 350° C. obtained by heat-curing the prepreg. The invention also provides a prepreg for obtaining a fiber-reinforced composite material excellent in solvent resistance, thermal oxidation resistance and the like while maintaining thermal resistance inherent in an aromatic bismaleimide resin used as a matrix resin and a fiber-reinforced composite material obtained from the prepreg.
    • 本发明提供一种通过将树脂组合物浸渍到纤维增强材料中制成的预浸料,该树脂组合物包含50至60重量份的芳族双马来酰亚胺(A),30至40重量份的链烯基酚醚化合物(B) 通过具体的通式表示,5〜15重量份的链烯基芳族共聚单体(C)和1〜10重量%的可溶于(B)或(C)的热塑性树脂(D),基于总量 的(A),(B)和(C)的芳香族双马来酰亚胺(A),包含90重量%以上的双马来酰亚胺二苯基甲烷的芳族双马来酰亚胺(A)和玻璃化转变温度为260〜 固化预浸料。 本发明还提供了一种用于获得耐溶剂性,耐热氧化性等优异的纤维增强复合材料的预浸料,同时保持用作基质树脂的芳族双马来酰亚胺树脂中固有的热阻和由该树脂获得的纤维增强复合材料 预浸料
    • 6. 发明申请
    • Flow soldering apparatus
    • 流动焊接设备
    • US20060191976A1
    • 2006-08-31
    • US10542626
    • 2003-10-29
    • Toru Kaneko
    • Toru Kaneko
    • B23K1/08
    • B23K3/0653
    • A compact soldering apparatus capable of increasing reliability of products by reducing occurrence of dross and using lead-free solder, wherein a primary jet nozzle 1, a secondary jet nozzle 2, and a pump (not shown) forming jet waves 24, 25 are installed in a solder tank 6 reservoiring molten solder S. Guide plates 4, 5 are installed between the jet nozzles 1, 2 above a solder face F of the molten solder S on a position where the molten solder is dropped. The guide plates 4, 5 formed into a V-shape are provided with solder guide portions crossing each other so as to drop the molten solder S at different positions on the solder face F of the solder tank 6. Molten solder dropped onto upper portions of the guide plates 4, 5 passes through the solder guide portions and is made to fall on a nozzle side different to a nozzle side where the solder is flowed.
    • 一种紧凑的焊接装置,其能够通过减少浮渣的发生和使用无铅焊料来提高产品的可靠性,其中安装有主喷嘴1,次喷嘴2和形成喷射波24,25的泵(未示出) 在储存熔融焊料S的焊料槽6中。在熔融焊料落下的位置上,在熔融焊料S的焊料面F上方的喷嘴1,2之间安装引导板4,5。 形成为V形的引导板4,5设置有彼此相交的焊料引导部,以将熔融焊料S落在焊料槽6的焊接面F上的不同位置。 下降到引导板4,5的上部的熔融焊料通过焊料引导部,并使其落在不同于焊料流动的喷嘴侧的喷嘴侧上。
    • 8. 发明授权
    • Structure of soldering iron tip
    • 烙铁头结构
    • US06681980B2
    • 2004-01-27
    • US10125361
    • 2002-04-19
    • Toru Kaneko
    • Toru Kaneko
    • B23K1002
    • B23K3/025
    • A tip of a soldering iron is provided which separates any solder bridge, sucks up excess solder, and performs normal soldering operation. The tip has a cutter blade-like portion with its edge inclined. Grooves are formed on both side surfaces of the cutter blade-like portion. Solder guides extend along the grooves, and cylindrical through-holes penetrating the tip are formed at the ends of the grooves closer to an iron handle. When the cutter blade-like portion is applied to a solder bridge, solder is melted, and sucked up from the solder guides through the grooves by capillary action. Excess melted solder is collected to be stored by its surface tension.
    • 提供烙铁的尖端,其分离任何焊接桥,吸收多余的焊料,并进行正常的焊接操作。 尖端具有倾斜的边缘的切割刀片状部分。 沟槽形成在切割刀片状部分的两个侧表面上。 焊接引导件沿着凹槽延伸,并且穿过尖端的圆柱形通孔形成在更靠近铁柄的凹槽的端部。 当切割刀片状部分被施加到焊接桥时,焊料熔化,并且通过毛细管作用从焊料引导件通过沟槽吸出。 收集过量熔化的焊料以通过其表面张力储存。