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1. 发明授权

US06546622B2 Printed-wiring substrate and method for fabricating the same 有权
标题翻译：印刷布线基板及其制造方法
公开(公告)号：US06546622B2
公开(公告)日：2003-04-15
申请号：US09808980
申请日：2001-03-16
申请人： Masahiro Iba , Hisashi Wakako , Kazuhisa Sato , Haruhiko Murata , Kazuyuki Takahashi , Kenzo Kawaguchi
发明人： Masahiro Iba , Hisashi Wakako , Kazuhisa Sato , Haruhiko Murata , Kazuyuki Takahashi , Kenzo Kawaguchi
IPC分类号： H05K302
CPC分类号： H01L23/5383 , H01L2224/16225 , H05K1/0266 , H05K3/28 , H05K3/381 , H05K3/4602 , H05K3/4644 , H05K2203/107 , H05K2203/122 , H05K2203/161 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158
摘要： A printed-wiring substrate 1 includes internal dielectric resin layers 12 and 14. A main-surface-side external dielectric resin layer 13 is formed on the internal dielectric resin layer 12 such that the surface thereof serves as a substrate main-surface 1A. A back-surface-side external dielectric resin layer 15 is formed on the internal dielectric resin layer 14 such that the surface thereof serves as a substrate back-surface 1B. A surface 12A of the main-surface-side internal dielectric resin layer 12 and a surface 14A of the back-surface-side internal dielectric resin layer 14 are roughened. The substrate main-surface 1A and the substrate back-surface 1B are roughened such that surface roughness thereof is lower than that of the surfaces 12A and 14A.
摘要翻译：印刷布线基板1包括内部电介质树脂层12和14.主表面侧外部电介质树脂层13形成在内部电介质树脂层12上，使得其表面用作基板主表面1A。在内部电介质树脂层14上形成背面侧外部电介质树脂层15，使其表面作为基板背面1B。主表面侧内部电介质树脂层12的表面12A和背面侧内部电介质树脂层14的表面14A被粗糙化。基板主表面1A和基板背面1B被粗糙化，使得表面粗糙度低于表面12A和14A的表面粗糙度。

2. 发明授权

US06887512B2 Method for fabricating printed-wiring substrate 有权
标题翻译：印刷布线基板的制造方法
公开(公告)号：US06887512B2
公开(公告)日：2005-05-03
申请号：US10214727
申请日：2002-08-09
申请人： Hisashi Wakako , Masahiro Iba , Kazuhisa Sato , Kazuo Kimura
发明人： Hisashi Wakako , Masahiro Iba , Kazuhisa Sato , Kazuo Kimura
IPC分类号： H05K3/34 , H01L23/12 , H01L23/498 , H05K3/24 , B05D5/12
CPC分类号： H05K3/244 , H01L23/49811 , H01L2924/0002 , Y10T29/49128 , Y10T29/49147 , Y10T29/49156 , H01L2924/00
摘要： A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating layer on surfaces of back-face-side connection terminals of the component board; covering the first main-face-side Au plating layer with a protection layer; forming a second back-face-side Au plating layer on the first back-face-side Au plating layer; and removing the protection layer after completing the second Au plating step. Alternatively, the first back-face-side Au plating layer may be removed after completing the masking step. Displacement Au plating is used as the first and second Au plating.
摘要翻译：一种部件板的制造方法，其包括在背面侧连接面的主面侧连接端子和第一背面侧Au镀层的表面上形成第一主面侧Au镀层组件板端子; 用保护层覆盖第一主面Au镀层; 在所述第一背面侧Au镀层上形成第二背面侧Au镀层; 以及在完成第二Au镀层步骤之后去除保护层。或者，可以在完成掩模步骤之后去除第一背面侧Au镀层。使用位移Au电镀作为第一和第二Au镀层。

3. 发明授权

US06495211B2 Process for producing a substrate and plating apparatus 有权
标题翻译：制造基板和电镀装置的方法
公开(公告)号：US06495211B2
公开(公告)日：2002-12-17
申请号：US09882016
申请日：2001-06-18
申请人： Masahiro Iba , Hisashi Wakako , Kazuhisa Sato , Hiroyuki Hashimoto , Yasuo Doi
发明人： Masahiro Iba , Hisashi Wakako , Kazuhisa Sato , Hiroyuki Hashimoto , Yasuo Doi
IPC分类号： B05D310
CPC分类号： H05K3/187 , H01L21/288 , H01L21/67028 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/244 , H01L2924/00
摘要： A process for producing a substrate 1 having a base-metal plating layer, which includes an immersion step for immersing the substrate 1 in a plating solution contained in a plating tank 33, to thereby form a base-metal plating layer; a washing step for removing the substrate 1 from the plating tank 33, transferring the substrate 1 to a washing tank, and washing the substrate 1; and a cooling step for applying a cooling liquid to the substrate 1 during at least a portion of the period during which the substrate is transferred to a position where the washing step is carried out after completing the immersion step, to thereby cool the substrate 1. An apparatus for carrying out the above process is also disclosed.
摘要翻译：一种具有基底金属镀层的基板1的制造方法，其包括将基板1浸渍在镀槽33中所含的镀液中的浸渍工序，从而形成基底金属镀层; 洗涤步骤，用于从电镀槽33去除衬底1，将衬底1转移到洗涤槽中，并洗涤衬底1; 以及在完成浸渍步骤之后将衬底转移到进行洗涤步骤的位置的至少一部分时间内将冷却液施加到衬底1从而冷却衬底1的冷却步骤。还公开了一种用于执行上述过程的装置。

4. 发明授权

US06472609B2 Printed-wiring substrate and method for fabricating the printed-wiring substrate 有权
标题翻译：印刷布线基板和印刷布线基板的制造方法
公开(公告)号：US06472609B2
公开(公告)日：2002-10-29
申请号：US09866999
申请日：2001-05-25
申请人： Hisashi Wakako , Masahiro Iba , Kazuhisa Sato , Kazuo Kimura
发明人： Hisashi Wakako , Masahiro Iba , Kazuhisa Sato , Kazuo Kimura
IPC分类号： H05K103
CPC分类号： H05K3/244 , H01L23/49811 , H01L2924/0002 , Y10T29/49128 , Y10T29/49147 , Y10T29/49156 , H01L2924/00
摘要： A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1A thereof and back-face-side connection terminals 41 for connecting, through mechanical contact, to connection terminals 93 of a motherboard 91 on a back face 1B thereof. The surface of each of the main-face-side connection terminals 33 is covered with a main-face-side displacement Au plating layer 45 having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals 41 is covered with a back-face-side displacement Au plating layer 55, which is thicker than the main-face-side displacement Au plating layer 45 and has a thickness of 0.2 &mgr;m or greater.
摘要翻译：印刷布线基板1具有用于焊接到其主面1A上的IC芯片81的连接端子83的主面侧连接端子33和用于通过机械接触连接的背面侧连接端子41，连接到母板91的背面1B上的连接端子93。每个主面侧连接端子33的表面被厚度为0.03至0.12μm的主面侧位移Au镀层45覆盖，并且每个背面侧连接端子41覆盖有比主面侧位移Au镀层45厚的厚度为0.2μm以上的背面侧位移Au镀层55。

5. 发明授权

US5798566A Ceramic IC package base and ceramic cover 失效
标题翻译：陶瓷IC封装基座和陶瓷盖
公开(公告)号：US5798566A
公开(公告)日：1998-08-25
申请号：US976501
申请日：1997-11-24
申请人： Kazuhisa Sato , Masanori Kitou , Hisashi Wakako , Kazuo Kimura
发明人： Kazuhisa Sato , Masanori Kitou , Hisashi Wakako , Kazuo Kimura
IPC分类号： H01L23/367 , H01L23/373 , H01L23/34 , H01L23/06 , H01L23/10 , H01L23/15
CPC分类号： H01L23/3735 , H01L23/367 , H01L23/3672 , H01L2224/16225 , H01L2224/73253 , H01L2924/09701 , H01L2924/15174
摘要： In accordance with the present invention, there is provided a ceramic IC package base which comprises a ceramic substrate, and a heat radiating member adhered to a side surface of the ceramic substrate and made of copper or copper alloy. The heat radiating member has an adhering portion at which it is adhered to the ceramic substrate. The adhering portion, when the heat radiating member is observed in a plan view, has one side which is equal to or larger than 8 mm. The adhering portion is of the thickness within the range from 0.25 mm to 0.76 mm. A ceramic IC package cover is also provided.
摘要翻译：根据本发明，提供了一种陶瓷IC封装基座，其包括陶瓷基板和粘附到陶瓷基板的侧表面并由铜或铜合金制成的散热构件。散热构件具有粘附到陶瓷基板上的粘附部分。当在平面图中观察散热构件时，粘附部分具有等于或大于8mm的一侧。粘合部分的厚度在0.25mm至0.76mm的范围内。还提供陶瓷IC封装盖。

6. 发明授权

US07067918B2 Wiring board 失效
标题翻译：接线板
公开(公告)号：US07067918B2
公开(公告)日：2006-06-27
申请号：US10802885
申请日：2004-03-18
申请人： Haruhiko Murata , Kazuhisa Sato , Tomonori Matsuura
发明人： Haruhiko Murata , Kazuhisa Sato , Tomonori Matsuura
IPC分类号： H01L23/48
CPC分类号： H05K3/244 , H01L23/498 , H01L2924/0002 , H01L2924/00
摘要： A wiring board comprising: a wiring laminate portion including dielectric layers containing polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers; and a plurality of metal terminal pads disposed on said first main surface; wherein: each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an electroless Ni-plated layer having a P content not higher than 3% by weight is disposed as a barrier metal layer between said Cu-plated layer and said Au-plated layer.
摘要翻译：一种布线板，包括：布线层叠部，其包括含有聚合材料的电介质层和交替层叠的导体层，以形成所述电介质层之一中的第一主表面; 以及设置在所述第一主表面上的多个金属端子垫; 其中：每个所述金属端子焊盘具有其中在所述第一主表面的侧面上设置有镀Cu层的结构，并且在所述金属端子焊盘的最外表面层部分设置镀金层，而在所述Cu镀层和所述镀Au层之间设置P含量不高于3重量％的无电镀Ni层作为阻挡金属层。

7. 外观设计

USD689387S1 Mass analyzer 有权
标题翻译：质量分析仪
公开(公告)号：USD689387S1
公开(公告)日：2013-09-10
申请号：US29426374
申请日：2012-07-05
申请人： Hiroshi Muraoka , Kazuhisa Sato
设计人： Hiroshi Muraoka , Kazuhisa Sato

8. 发明申请

US20050155789A1 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel 失效
公开(公告)号：US20050155789A1
公开(公告)日：2005-07-21
申请号：US11078063
申请日：2005-03-11
申请人： Tomoe Suzuki , Shinji Yuri , Kazuhisa Sato , Kozo Yamasaki
发明人： Tomoe Suzuki , Shinji Yuri , Kazuhisa Sato , Kozo Yamasaki
IPC分类号： B32B15/08 , B32B27/38 , H05K1/05 , H05K3/00 , H05K3/44 , H05K1/03 , H05K1/11
CPC分类号： H05K1/056 , B32B15/08 , B32B27/38 , H05K3/0052 , H05K3/44 , H05K3/445 , H05K2201/0909 , H05K2201/09709 , H05K2201/09745 , H05K2203/0369 , H05K2203/1572 , Y10S428/901 , Y10T29/49126 , Y10T29/49135 , Y10T29/49165 , Y10T83/0333 , Y10T83/0341 , Y10T83/0581 , Y10T428/12 , Y10T428/12361 , Y10T428/15 , Y10T428/24298 , Y10T428/24314 , Y10T428/24917
摘要： The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.

9. 发明授权

US06872436B2 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel 失效
公开(公告)号：US06872436B2
公开(公告)日：2005-03-29
申请号：US10340031
申请日：2003-01-10
申请人： Tomoe Suzuki , Shinji Yuri , Kazuhisa Sato , Kozo Yamasaki
发明人： Tomoe Suzuki , Shinji Yuri , Kazuhisa Sato , Kozo Yamasaki
IPC分类号： B32B15/08 , B32B27/38 , H05K1/05 , H05K3/00 , H05K3/44 , B23B3/10
CPC分类号： H05K1/056 , B32B15/08 , B32B27/38 , H05K3/0052 , H05K3/44 , H05K3/445 , H05K2201/0909 , H05K2201/09709 , H05K2201/09745 , H05K2203/0369 , H05K2203/1572 , Y10S428/901 , Y10T29/49126 , Y10T29/49135 , Y10T29/49165 , Y10T83/0333 , Y10T83/0341 , Y10T83/0581 , Y10T428/12 , Y10T428/12361 , Y10T428/15 , Y10T428/24298 , Y10T428/24314 , Y10T428/24917
摘要： The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.

10. 发明授权

US06216739B1 Integrated gas control device 有权
标题翻译：综合气体控制装置
公开(公告)号：US06216739B1
公开(公告)日：2001-04-17
申请号：US09556434
申请日：2000-04-24
申请人： Yoshitomo Fukushima , Kazuhisa Sato
发明人： Yoshitomo Fukushima , Kazuhisa Sato
IPC分类号： F16K1110
CPC分类号： F16K27/003 , F17D1/04 , Y10T137/87885 , Y10T137/87917
摘要： A plurality of connecting blocks are mounted on a base plate. Each block has a base body and a vertical cylindrical portion formed on the base body, and has a vertical hole. The base body has a horizontal hole opened at both sides thereof and communicated with the vertical hole in the cylindrical portion. A plurality of intermediate blocks, each having a fixed portion and a pair of horizontal cylindrical inserting portions formed on both sides of the fixed portion are mounted on the base plate. The intermediate block has a horizontal gas passage having a pair of openings opened at upper surfaces on both sides of the fixed portion. The horizontal hole of each of the connecting blocks is engaged with the corresponding inserting portion of the intermediate block. A cylindrical connecting member having an inlet gas passage and an outlet gas passage is secured in the vertical hole of each connecting block. The outlet gas passage of the inlet side connecting member is communicated with the inlet gas passage of the outlet side connecting member. A gas control unit is secured to the connecting member.
摘要翻译：多个连接块安装在基板上。每个块体具有形成在基体上的基体和垂直圆筒部，并且具有垂直孔。基体具有在其两侧开口的水平孔，并与圆筒部的垂直孔连通。在基板上安装有多个中间块，每个中间块具有形成在固定部的两侧上的固定部分和一对水平圆柱形插入部分。中间块具有水平的气体通道，其具有在固定部的两侧的上表面开口的一对开口。每个连接块的水平孔与中间块的相应的插入部分接合。具有入口气体通道和出口气体通道的圆柱形连接构件固定在每个连接块的垂直孔中。入口侧连接构件的出口气体通道与出口侧连接构件的入口气体通道连通。气体控制单元固定到连接构件。

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