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    • 1. 发明申请
    • COMPOUND SEMICONDUCTOR DEVICE
    • 化合物半导体器件
    • US20110108853A1
    • 2011-05-12
    • US12835003
    • 2010-07-13
    • Masahiro ADACHIShinji TokuyamaKoji Katayama
    • Masahiro ADACHIShinji TokuyamaKoji Katayama
    • H01L29/24H01L29/20
    • H01L33/40H01L33/32H01L33/34
    • A compound semiconductor device having reduced contact resistance to an electrode is provided. The compound semiconductor device includes an n-substrate 3 comprising a hexagonal compound semiconductor GaN and having surfaces S1 and S2; an n-electrode 13 formed on the surface S1 of the n-substrate 3; a layered product having an n-cladding layer 5, an active layer 7, a p-cladding layer 9, and a contact layer 11 formed on the surface S2 of the n-substrate 3; and a p-electrode 15 formed on the p-cladding layer 9. The number of N atoms contained on the surface S1 of the n-substrate 3 is more than the number of Ga atoms contained on the surface S1. The electrode formed on the surface S1 is an n-electrode 13. The surface S1 has an oxygen concentration of not more than 5 atomic percent. The number of Ga atoms contained on the surface S3 of the contact layer 11 is more than the number of N atoms contained on the surface S3. The electrode formed on the surface S3 is a p-electrode 15. The surface S3 has an oxygen concentration of not more than 5 atomic percent.
    • 提供具有降低的与电极的接触电阻的化合物半导体器件。 该化合物半导体器件包括包含六方晶系化合物半导体GaN并具有表面S1和S2的n衬底3; 形成在n基板3的表面S1上的n电极13; 具有形成在n基板3的表面S2上的n包层5,有源层7,p包覆层9和接触层11的层叠体, 以及形成在p包覆层9上的p电极15.包含在n基板3的表面S1上的N原子的数量大于表面S1上包含的Ga原子的数量。 形成在表面S1上的电极是n电极13.表面S1的氧浓度不大于5原子%。 接触层11的表面S3上所含的Ga原子数多于表面S3所含的N原子数。 形成在表面S3上的电极是p电极15.表面S3的氧浓度不大于5原子%。
    • 5. 发明授权
    • Group-III nitride semiconductor laser device, and method of fabricating group-III nitride semiconductor laser device
    • III族氮化物半导体激光器件及III族氮化物半导体激光器件的制造方法
    • US08306082B2
    • 2012-11-06
    • US12846361
    • 2010-07-29
    • Yusuke YoshizumiYohei EnyaTakashi KyonoMasahiro AdachiKatsushi AkitaMasaki UenoTakamichi SumitomoShinji TokuyamaKoji KatayamaTakao NakamuraTakatoshi Ikegami
    • Yusuke YoshizumiYohei EnyaTakashi KyonoMasahiro AdachiKatsushi AkitaMasaki UenoTakamichi SumitomoShinji TokuyamaKoji KatayamaTakao NakamuraTakatoshi Ikegami
    • H01S5/00
    • H01S5/34333B82Y20/00H01L21/02389H01L21/02433H01S5/0014H01S5/0021H01S5/0202H01S5/2009H01S5/3202H01S5/3211
    • A group-III nitride semiconductor laser device comprises a laser structure including a support base and a semiconductor region, and an electrode provided on the semiconductor region of the laser structure. The support base comprises a hexagonal group-III nitride semiconductor and has a semipolar primary surface, and the semiconductor region is provided on the semipolar primary surface of the support base. The semiconductor region includes a first cladding layer of a first conductivity type gallium nitride-based semiconductor, a second cladding layer of a second conductivity type gallium nitride-based semiconductor, and an active layer. The first cladding layer, the second cladding layer, and the active layer are arranged along a normal axis to the semipolar primary surface. The active layer comprises a gallium nitride-based semiconductor layer. The c-axis of the hexagonal group-III nitride semiconductor of the support base tilts at a finite angle ALPHA with respect to a normal axis toward an a-axis of the hexagonal group-III nitride semiconductor. The laser structure includes first and second fractured faces intersecting with an a-n plane defined by the normal axis and the a-axis of the hexagonal group-III nitride semiconductor. The laser cavity of the group-III nitride semiconductor laser device includes the first and second fractured faces. The laser structure includes first and second surfaces and the first surface is opposite to the second surface, and each of the first and second fractured faces extends from an edge of the first surface to an edge of the second surface.
    • III族氮化物半导体激光器件包括具有支撑基极和半导体区域的激光器结构以及设置在激光器结构的半导体区域上的电极。 支撑基底包括六方晶III族氮化物半导体,并且具有半极性主表面,并且半导体区域设置在支撑基底的半极性主表面上。 半导体区域包括第一导电型氮化镓基半导体的第一包覆层,第二导电型氮化镓基半导体的第二包覆层和有源层。 第一包层,第二包覆层和有源层沿着正交轴线配置到半极性主表面。 有源层包括氮化镓基半导体层。 支撑基座的六角形III族氮化物半导体的c轴相对于六边形III族氮化物半导体的a轴的法线轴线以有限角度ALPHA倾斜。 激光结构包括与由六角形III族氮化物半导体的法线轴和a轴限定的a-n平面相交的第一和第二断裂面。 III族氮化物半导体激光器件的激光腔包括第一和第二断裂面。 激光结构包括第一表面和第二表面,并且第一表面与第二表面相对,并且第一和第二断裂面中的每一个从第一表面的边缘延伸到第二表面的边缘。
    • 7. 发明授权
    • Compound semiconductor device
    • 复合半导体器件
    • US08581296B2
    • 2013-11-12
    • US12835003
    • 2010-07-13
    • Masahiro AdachiShinji TokuyamaKoji Katayama
    • Masahiro AdachiShinji TokuyamaKoji Katayama
    • H01L33/00
    • H01L33/40H01L33/32H01L33/34
    • A compound semiconductor device having reduced contact resistance to an electrode is provided. The compound semiconductor device includes an n-substrate 3 comprising a hexagonal compound semiconductor GaN and having surfaces S1 and S2; an n-electrode 13 formed on the surface S1 of the n-substrate 3; a layered product having an n-cladding layer 5, an active layer 7, a p-cladding layer 9, and a contact layer 11 formed on the surface S2 of the n-substrate 3; and a p-electrode 15 formed on the p-cladding layer 9. The number of N atoms contained on the surface S1 of the n-substrate 3 is more than the number of Ga atoms contained on the surface S1. The electrode formed on the surface S1 is an n-electrode 13. The surface S1 has an oxygen concentration of not more than 5 atomic percent. The number of Ga atoms contained on the surface S3 of the contact layer 11 is more than the number of N atoms contained on the surface S3. The electrode formed on the surface S3 is a p-electrode 15. The surface S3 has an oxygen concentration of not more than 5 atomic percent.
    • 提供了具有降低的与电极的接触电阻的化合物半导体器件。 该化合物半导体器件包括包含六方晶系化合物半导体GaN并具有表面S1和S2的n衬底3; 形成在n基板3的表面S1上的n电极13; 具有形成在n基板3的表面S2上的n包层5,有源层7,p包覆层9和接触层11的层叠体, 以及形成在p包覆层9上的p电极15.包含在n基板3的表面S1上的N原子的数量大于表面S1上包含的Ga原子的数量。 形成在表面S1上的电极是n电极13.表面S1的氧浓度不大于5原子%。 接触层11的表面S3上所含的Ga原子数多于表面S3所含的N原子数。 形成在表面S3上的电极是p电极15.表面S3的氧浓度不大于5原子%。