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1. 发明授权

US08334210B2 Method and apparatus of manufacturing semiconductor device 失效
标题翻译：制造半导体器件的方法和装置
公开(公告)号：US08334210B2
公开(公告)日：2012-12-18
申请号：US11847124
申请日：2007-08-29
申请人： Masafumi Shiratani , Tomotake Morita
发明人： Masafumi Shiratani , Tomotake Morita
IPC分类号： H01L21/461
CPC分类号： B24B37/042 , H01L21/3212
摘要： A method of manufacturing a semiconductor device, includes: (a) obtaining a surface of a polishing target, wherein an insulating film and a metal film are exposed; and (b) polishing the surface having the exposed insulating film and the exposed metal film. The step (b) includes; (b1) polishing the surface in a condition with high frictional force, and (b2) polishing the surface in a condition with usual frictional force lower than the high frictional force after the step (b1).
摘要翻译：一种制造半导体器件的方法包括：（a）获得抛光对象的表面，其中暴露绝缘膜和金属膜; 和（b）抛光具有暴露的绝缘膜和暴露的金属膜的表面。步骤（b）包括：（b1）在高摩擦力的条件下研磨表面，（b2）在步骤（b1）之后的摩擦力低于摩擦力的摩擦力的情况下，研磨表面。

2. 发明申请

US20100273401A1 Polishing apparatus and polishing method 失效
标题翻译：抛光设备和抛光方法
公开(公告)号：US20100273401A1
公开(公告)日：2010-10-28
申请号：US12662340
申请日：2010-04-12
申请人： Masafumi Shiratani , Shigeyuki Yoshida , Osamu Ito
发明人： Masafumi Shiratani , Shigeyuki Yoshida , Osamu Ito
IPC分类号： B24B1/00 , B24B7/00
CPC分类号： B24B53/017
摘要： A polishing apparatus includes a polishing table with a polishing pad at an upper surface, and a conditioning disc carrying out conditioning of the polishing pad, and a moving mechanism (constructed, for example, from a swing arm) capable of moving the conditioning disc to a standby position above the polishing pad, and a spraying mechanism (constructed, for example, from a washing water nozzle) that sprays liquid to the conditioning disc positioned at the standby position so as to wash or wet the conditioning disc.
摘要翻译：抛光装置包括：在上表面具有抛光垫的抛光台和执行抛光垫调节的调节盘，以及能够将调节盘移动到的移动机构（例如由摆臂构成）抛光垫上方的待机位置，以及喷射机构（例如，从洗涤水喷嘴构成），其将液体喷射到位于待机位置的调理盘，以便洗涤或润湿调节盘。

3. 发明申请

US20070084482A1 Apparatus and method for cleaning semiconductor wafer 失效
标题翻译：用于清洁半导体晶片的装置和方法
公开(公告)号：US20070084482A1
公开(公告)日：2007-04-19
申请号：US11581461
申请日：2006-10-17
申请人： Masafumi Shiratani
发明人： Masafumi Shiratani
IPC分类号： C23G1/00 , B08B7/04 , B08B3/00 , B08B7/00
CPC分类号： H01L21/02087 , B08B3/02 , H01L21/67051
摘要： Method and apparatus for precisely removing dusts from a side edge of a wafer, improving a production yield of wafers, and reducing a manufacturing cost for semiconductor devices. The apparatus includes: a retaining table having a circular top plan view, capable of retaining the wafer disposed on the top surface, and being rotated in the wafer cleaning; a feeding unit for supplying a cleaning solution to a top surface of the wafer; a cup member for recovering the cleaning solution supplied to the wafer, the cup member surrounding a radially outer circumference and a bottom of the retaining table; and a guard member disposed inside the cup member so as to be spaced apart from the retaining table, which surrounds the radially outer circumference of the retaining table.
摘要翻译：从晶片的侧边缘精确地去除灰尘的方法和装置，提高晶圆的生产成本，降低半导体器件的制造成本。该装置包括：具有圆形顶视图的保持台，能够保持设置在顶表面上的晶片，并在晶片清洗中旋转; 供给单元，用于将清洗液供给到晶片的顶面; 用于回收提供给晶片的清洁溶液的杯构件，围绕径向外圆周的杯构件和保持台的底部; 以及保护构件，其设置在所述杯构件内部，以与围绕所述保持台的径向外周的所述保持台间隔开。

4. 发明授权

US08562392B2 Polishing apparatus and polishing method 失效
标题翻译：抛光设备和抛光方法
公开(公告)号：US08562392B2
公开(公告)日：2013-10-22
申请号：US12662340
申请日：2010-04-12
申请人： Masafumi Shiratani , Shigeyuki Yoshida , Osamu Ito
发明人： Masafumi Shiratani , Shigeyuki Yoshida , Osamu Ito
IPC分类号： B24B1/00
CPC分类号： B24B53/017
摘要： A polishing apparatus includes a polishing table with a polishing pad at an upper surface, and a conditioning disc carrying out conditioning of the polishing pad, and a moving mechanism (constructed, for example, from a swing arm) capable of moving the conditioning disc to a standby position above the polishing pad, and a spraying mechanism (constructed, for example, from a washing water nozzle) that sprays liquid to the conditioning disc positioned at the standby position so as to wash or wet the conditioning disc.
摘要翻译：抛光装置包括：在上表面具有抛光垫的抛光台和执行抛光垫调节的调节盘，以及能够将调节盘移动到的移动机构（例如由摆臂构成）抛光垫上方的待机位置，以及喷射机构（例如，从洗涤水喷嘴构成），其将液体喷射到位于待机位置的调理盘，以便洗涤或润湿调节盘。

5. 发明授权

US07779848B2 Apparatus and method for cleaning semiconductor wafer 失效
标题翻译：用于清洁半导体晶片的装置和方法
公开(公告)号：US07779848B2
公开(公告)日：2010-08-24
申请号：US11581461
申请日：2006-10-17
申请人： Masafumi Shiratani
发明人： Masafumi Shiratani
IPC分类号： B08B3/00
CPC分类号： H01L21/02087 , B08B3/02 , H01L21/67051
摘要： Method and apparatus for precisely removing dusts from a side edge of a wafer, improving a production yield of wafers, and reducing a manufacturing cost for semiconductor devices. The apparatus includes: a retaining table having a circular top plan view, capable of retaining the wafer disposed on the top surface, and being rotated in the wafer cleaning; a feeding unit for supplying a cleaning solution to a top surface of the wafer; a cup member for recovering the cleaning solution supplied to the wafer, the cup member surrounding a radially outer circumference and a bottom of the retaining table; and a guard member disposed inside the cup member so as to be spaced apart from the retaining table, which surrounds the radially outer circumference of the retaining table.
摘要翻译：从晶片的侧边缘精确地去除灰尘的方法和装置，提高晶圆的生产成本，降低半导体器件的制造成本。该装置包括：具有圆形顶视图的保持台，能够保持设置在顶表面上的晶片，并在晶片清洗中旋转; 供给单元，用于将清洗液供给到晶片的顶面; 用于回收提供给晶片的清洁溶液的杯构件，围绕径向外圆周的杯构件和保持台的底部; 以及保护构件，其设置在所述杯构件内部，以与围绕所述保持台的径向外周的所述保持台间隔开。

6. 发明申请

US20070224923A1 Polishing pad, chemical mechanical polishing apparatus and method for manufacturing polishing pad 审中-公开
标题翻译：抛光垫，化学机械抛光装置及抛光垫的制造方法
公开(公告)号：US20070224923A1
公开(公告)日：2007-09-27
申请号：US11727300
申请日：2007-03-26
申请人： Masafumi Shiratani
发明人： Masafumi Shiratani
IPC分类号： B24B1/00 , B24B29/00 , B24D11/00
CPC分类号： B24B37/26 , B24D11/001
摘要： A polishing pad with reduced cost and easy manufacturability without waste is provided. A disc-shaped polishing layer 31 having a plurality of through holes 34 formed therein, an adhesive layer 33 provided only in a position in a back surface of the polishing layer 31 where no through hole 34 is formed and a disc-shaped support plate 32 having a flat surface, which is joined to the back surface of the polishing layer 31 by the adhesive layer 33 are provided. Since an adhesive layer 33 is not exposed to bottoms of the through holes 34 of the polishing layer 31, acting the slurry over the adhesive layer 33 to strip the polishing layer 31 from the support plate 32 is inhibited. Since the through holes 34 formed in the polishing layer 31 do not extend to the support plate 32, a decrease in the mechanical strength is not caused.
摘要翻译：提供了一种抛光垫，其成本低廉且易于制造，而没有浪费。其中形成有多个通孔34的圆盘形抛光层31，仅在没有形成通孔34的抛光层31的后表面中的位置设置的粘合剂层33和盘形支撑板32 具有通过粘合剂层33与抛光层31的后表面接合的平坦表面。由于粘合剂层33没有暴露于抛光层31的通孔34的底部，因此将浆料作用在粘合剂层33上以从支撑板32剥离抛光层31。由于形成在研磨层31中的通孔34不延伸到支撑板32，因此不会引起机械强度的降低。

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