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    • 3. 发明授权
    • Semiconductor processing device
    • 半导体处理装置
    • US07020764B2
    • 2006-03-28
    • US10621330
    • 2003-07-18
    • Hideo KubotaTakanaga Yamazaki
    • Hideo KubotaTakanaga Yamazaki
    • H03K19/173G06F15/76
    • G06F15/7867G06F15/7814G11C7/20
    • A useful semiconductor processing device (LSI) is capable of implementing the precise setting of signals at the final stage of user system development and enabling the user to build a logic circuit in the device in a very short time. The LSI includes a CPU, a flash memory which is a nonvolatile memory, a programmable logic which is a SRAM-type field programmable gate array, and a configuration circuit which implements the logic circuit configuration operation. At the event of power-on reset, logic building data stored in the flash memory is transferred to the programmable logic to establish a logic circuit in it under control of the configuration circuit, so that the logic circuit built in the programmable logic can be used immediately after the power-on reset of the device.
    • 有用的半导体处理设备(LSI)能够在用户系统开发的最后阶段实现信号的精确设置,并且使用户能够在非常短的时间内在设备中构建逻辑电路。 LSI包括CPU,作为非易失性存储器的闪存,作为SRAM型现场可编程门阵列的可编程逻辑,以及实现逻辑电路配置操作的配置电路。 在上电复位的情况下,存储在闪速存储器中的逻辑建立数据被传送到可编程逻辑以在配置电路的控制下建立逻辑电路,从而可以使用内置在可编程逻辑中的逻辑电路 在设备上电复位后立即进行。
    • 4. 发明授权
    • Fiber reinforced polyester resin having a low surface profile
    • 具有低表面轮廓的纤维增强聚酯树脂
    • US3969311A
    • 1976-07-13
    • US564713
    • 1975-04-03
    • Hideo Kubota
    • Hideo Kubota
    • C08F299/04C08K13/04C08L67/06
    • C08F299/0478C08K13/04C08K3/26C08K3/40
    • In accordance with a preferred embodiment of this invention, a fiber reinforced polyester article having a low surface profile is produced from a material which may be used either as a bulk molding or as a sheet molding compound. Preferably, this composition is produced from a formulation comprising about equal proportions of (1) an unsaturated polyester condensation product dissolved in (2) a copolymerizable reactive diluent solution of from proportionally 11/2 to 2 parts by weight of tertiary butyl styrene per each part of styrene. This formulation will of course also contain a filler such as a particulate calcium carbonate and reinforcing glass fibers. It is the specific combination of styrene and tertiary butyl styrene which promotes the low profile surface in the final molded article.
    • 根据本发明的一个优选实施例,具有低表面轮廓的纤维增强聚酯制品由可以作为大块模塑或片状模塑料使用的材料制成。 优选地,该组合物由包含大约相等比例的(1)溶解在(2)可共聚的反应性稀释液中的不饱和聚酯缩合产物的制剂制备,所述不饱和聚酯缩合产物每个部分按比例为11/2至2重量份的叔丁基苯乙烯 的苯乙烯。 该制剂当然也将含有填料如碳酸钙颗粒和增强玻璃纤维。 苯乙烯和叔丁基苯乙烯的特殊组合促进了最终成型制品中的低轮廓表面。