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1. 发明授权

US06269866B1 Cooling device with heat pipe 失效
标题翻译：带热管的冷却装置
公开(公告)号：US06269866B1
公开(公告)日：2001-08-07
申请号：US09544313
申请日：2000-04-06
申请人： Masaaki Yamamoto , Jun Niekawa , Tatuhiko Ueki , Masami Ikeda , Ken Sasaki
发明人： Masaaki Yamamoto , Jun Niekawa , Tatuhiko Ueki , Masami Ikeda , Ken Sasaki
IPC分类号： F28D1500
CPC分类号： H01L23/3733 , F28D15/0233 , F28D15/046 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The invention provides a cooling device provided with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, and having a heat absorbing surface larger than that of the body to be cooled, a the heat transferring metal column, and a hollow portion in which the working fluid exists. An alternating embodiment of the cooling device with the heat pipe comprises a plate-like container made of heat transferring metal, a heat absorbing wall having a large heat absorbing surface, and a plurality of protrusion portions.
摘要翻译：本发明提供了一种具有热管的冷却装置，其能够有效地从诸如小型计算机的电子设备辐射热量。具有热管的冷却装置包括由用于容纳工作流体的传热金属制成的板状容器，并且具有比要冷却的物体更大的吸热表面，传热金属柱和中空部存在工作流体的部分。具有热管的冷却装置的交替实施例包括由传热金属制成的板状容器，具有大的吸热表面的吸热壁和多个突出部分。

2. 发明授权

US6082443A Cooling device with heat pipe 失效
标题翻译：带热管的冷却装置
公开(公告)号：US6082443A
公开(公告)日：2000-07-04
申请号：US23372
申请日：1998-02-13
申请人： Masaaki Yamamoto , Jun Niekawa , Tatuhiko Ueki , Masami Ikeda , Ken Sasaki
发明人： Masaaki Yamamoto , Jun Niekawa , Tatuhiko Ueki , Masami Ikeda , Ken Sasaki
IPC分类号： F28D15/02 , H01L23/367 , H01L23/373 , H01L23/427 , F28D15/00
CPC分类号： F28D15/0233 , F28D15/046 , H01L23/3672 , H01L23/3733 , H01L23/427 , H01L2924/0002
摘要： The invention provides a cooling device with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, and having a heat absorbing surface larger than that of the body to be cooled, a heat transferring metal column, and a hollow portion in which the working fluid exists. An alternating embodiment of the cooling device with the heat pipe comprises a plate-like container made of heat transferring metal, a heat absorbing wall having a large heat absorbing surface, and a plurality of protrusion portions.
摘要翻译：本发明提供了一种具有热管的冷却装置，其能够有效地从诸如小型计算机的电子设备辐射热量。具有热管的冷却装置包括由用于容纳工作流体的传热金属制成的板状容器，并且具有大于待冷却体的吸热表面的热吸收表面，传热金属柱和中空部分其中存在工作流体。具有热管的冷却装置的交替实施例包括由传热金属制成的板状容器，具有大的吸热表面的吸热壁和多个突出部分。

3. 发明授权

US06397935B1 Flat type heat pipe 失效
公开(公告)号：US06397935B1
公开(公告)日：2002-06-04
申请号：US08769505
申请日：1996-12-18
申请人： Masaaki Yamamoto , Jun Niekawa , Yuichi Kimura , Kenichi Namba
发明人： Masaaki Yamamoto , Jun Niekawa , Yuichi Kimura , Kenichi Namba
IPC分类号： F28D1500
CPC分类号： F28D15/0233 , F28F3/02 , H01L23/473 , H01L2924/0002 , H01L2924/13055 , H01L2924/00
摘要： A flat type heat pipe for mounting a heating power element, which is capable of forming an optionally shaped heat transferring path with high accuracy, which is of a thin type and to which fins are easily attached. The flat type heat pipe includes at least two aluminum plates substantially in parallel with each other and brazed to each other so as to form a heat transferring path therebetween. The flat type heat pipe also includes an operating liquid which fills the heat transferring path. Because the heat transferring path 25 is formed by means of press molding, punching, laser beam machining, or cutting various shapes of heat transferring paths can be formed finely and with high accuracy. The flexible flat type heat pipe can be made thin, which allows for a variety of uses. Grooves and wicks can be disposed in the heat transferring path, thereby improving the heat conductivity. Because the surface is flat, the fins can be easily attached thereto, thereby a satisfactory radiation effect can be obtained.

4. 发明授权

US06400571B1 Electronic equipment housing 有权
标题翻译：电子设备外壳
公开(公告)号：US06400571B1
公开(公告)日：2002-06-04
申请号：US09422245
申请日：1999-10-21
申请人： Naoki Kimura , Jun Niekawa
发明人： Naoki Kimura , Jun Niekawa
IPC分类号： H05K720
CPC分类号： G06F1/203 , G06F1/18 , G06F1/181
摘要： The present invention relates to an electronic equipment housing usable for various types of electronic equipment such as note-type personal computers, portable information instruments, portable acoustic instruments, and on-vehicle electric materials. The electronic equipment housing of the present invention is formed by bonding two or more plate-like members. These plate-like members are different in thickness from one another. These plate-like members are bonded together through an adhesive. The electronic equipment housing of the present invention can efficiently radiate heat from heating parts, can prevent air bubbles from occurring in an adhesive between plate-like members, can reduce time required to produce the electronic equipment housing and can properly control the heat conduction.
摘要翻译：本发明涉及可用于各种类型的电子设备的电子设备外壳，例如笔记型个人计算机，便携式信息仪器，便携式声学仪器和车载电气材料。本发明的电子设备外壳由键合两个或更多个板状构件。这些板状构件的厚度彼此不同。这些板状构件通过粘合剂粘合在一起。本发明的电子设备壳体可以有效地辐射加热部件的热量，可以防止板状构件之间的粘合剂中发生气泡，可以缩短制造电子设备外壳可以正确控制热传导。

5. 发明授权

US06211276B1 Heat-conductive rubber composition material and heat-conductive rubber sheet 失效
标题翻译：导热橡胶组合物和导热橡胶片
公开(公告)号：US06211276B1
公开(公告)日：2001-04-03
申请号：US09089564
申请日：1998-06-03
申请人： Toshio Miyahara , Naoki Kimura , Jun Niekawa
发明人： Toshio Miyahara , Naoki Kimura , Jun Niekawa
IPC分类号： C08K322
CPC分类号： C08L23/16 , C08K2003/222 , C08L23/22 , C08L33/06 , Y10S524/925 , Y10T428/256 , Y10T428/258 , Y10T428/28 , Y10T428/2804 , C08L2666/04
摘要： A heat-conductive rubber composition material, which comprises a rubber essentially consisting of an acrylic rubber, a butyl rubber, an ethylene propylene rubber or a blended rubber which comprises at least two of acrylic rubber, butyl rubber, and ethylene propylene rubber are blended, and 50 to 85 weight % of hydrophobic magnesium oxide powder, a heat-conductive rubber sheet prepared by forming the above thermal conductive rubber composition material, and a heat-conductive sheet, which comprises a soft metal sheet and a rubber layer formed on at least one surface of the soft metal sheet.
摘要翻译：将由丙烯酸橡胶，丁基橡胶，乙丙橡胶或含有丙烯酸橡胶，丁基橡胶，乙丙橡胶中的至少2种的混合橡胶构成的橡胶组成的导热性橡胶组合物材料，和50〜85重量％的疏水性氧化镁粉末，通过形成上述导热性橡胶组合物材料制成的导热性橡胶片，以及导热性片材，其包含软质金属片和至少形成的橡胶层软金属片的一个表面。

6. 发明授权

US06745825B1 Plate type heat pipe 失效
标题翻译：板式热管
公开(公告)号：US06745825B1
公开(公告)日：2004-06-08
申请号：US09712582
申请日：2000-11-14
申请人： Yoshio Nakamura , Jun Niekawa , Hisao Enomoto , Yasushi Kojima , Naoya Yamazaki , Masahiro Mogi
发明人： Yoshio Nakamura , Jun Niekawa , Hisao Enomoto , Yasushi Kojima , Naoya Yamazaki , Masahiro Mogi
IPC分类号： F28D1500
CPC分类号： F28D15/0233 , F28D15/0275 , F28D15/046 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A sealed plate type metallic heat pipe is disclosed having multiple independent through holes which run through the inside of the heat pipe. All of the through holes are connected in fluid communication at each end. A working fluid is disposed in the through holes and a wire or a wire mesh is disposed in at least one of the through holes.
摘要翻译：公开了一种密封板式金属热管，其具有穿过热管内部的多个独立通孔。所有通孔在每一端连接成流体连通。工作流体设置在通孔中，并且线或丝网布置在至少一个通孔中。

7. 发明授权

US06567447B1 Semiconductor laser device and semiconductor laser module using the same 有权
标题翻译：半导体激光器件和半导体激光器模块使用相同
公开(公告)号：US06567447B1
公开(公告)日：2003-05-20
申请号：US09680153
申请日：2000-10-03
申请人： Junji Yoshida , Naoki Tsukiji , Akira Iketani , Naoki Kimura , Jun Niekawa , Toshio Kimura , Takeshi Aikiyo
发明人： Junji Yoshida , Naoki Tsukiji , Akira Iketani , Naoki Kimura , Jun Niekawa , Toshio Kimura , Takeshi Aikiyo
IPC分类号： H01S500
CPC分类号： H01S5/34 , B82Y20/00 , H01S5/02216 , H01S5/02284 , H01S5/02415 , H01S5/02492 , H01S5/028 , H01S5/1039 , H01S5/146 , H01S5/3403
摘要： In the semiconductor laser device of the present invention, a semiconductor stacked structure including an active layer comprising a strained multi-quantum well structure is formed on a substrate 1, a cavity length is larger than 1000 &mgr;m but equal to or smaller than 1800 &mgr;m, and a low-reflection film S1 having a reflectance of 3% or less is formed on one facet and a high-reflection film S2 having a reflectance of 90% or more is formed on the other facet. The semiconductor laser module has a structure in which the semiconductor laser device is set to a cooling device constituted by electrically alternately arranging 40 pairs or more of the Peltier elements and holding them by top and bottom ceramic plates and sealed in the package. A grating having a reflection bandwidth of 1.5 nm or less is formed on an optical fiber to be built in.
摘要翻译：在本发明的半导体激光装置中，在基板1上形成包括应变多量子阱结构的有源层的半导体层叠结构，空洞长度大于1000μm，但等于或小于1800μm，并且在一个面上形成反射率为3％以下的低反射膜S1，另一方面形成反射率为90％以上的高反射膜S2。半导体激光器模块具有这样的结构，其中半导体激光器件被设置为通过电气交替地布置40对或更多个珀耳帖元件并由顶部和底部陶瓷板保持并且密封在封装中的冷却装置。在内置的光纤上形成具有1.5nm以下的反射带宽的光栅。

8. 发明授权

US06487074B1 Cooling system for electronic device 有权
标题翻译：电子设备冷却系统
公开(公告)号：US06487074B1
公开(公告)日：2002-11-26
申请号：US09921796
申请日：2001-08-02
申请人： Naoki Kimura , Jun Niekawa , Hiroaki Maekawa
发明人： Naoki Kimura , Jun Niekawa , Hiroaki Maekawa
IPC分类号： H05K720
CPC分类号： G06F1/203 , G06F1/20
摘要： A cooling system for an electronic device including a heat generating component within a case, wherein the heat generating component is installed on a bottom plate of the case, the bottom plate has a ventilating hole for air passage formed therein, and a foot portion installed outer surface of the case for maintaining a prescribed vertically opened space below the lower surface of the case.
摘要翻译：一种用于电子设备的冷却系统，包括壳体内的发热部件，其中所述发热部件安装在所述壳体的底板上，所述底板具有形成在其中的用于通气的通风孔，壳体的表面，用于在壳体的下表面下方保持规定的垂直开口空间。

9. 发明授权

US06338898B1 Heat-conductive rubber composition material and heat-conductive rubber sheet 有权
标题翻译：导热橡胶组合物和导热橡胶片
公开(公告)号：US06338898B1
公开(公告)日：2002-01-15
申请号：US09597037
申请日：2000-06-20
申请人： Toshio Miyahara , Naoki Kimura , Jun Niekawa
发明人： Toshio Miyahara , Naoki Kimura , Jun Niekawa
IPC分类号： B32B516
CPC分类号： C08L23/16 , C08K2003/222 , C08L23/22 , C08L33/06 , Y10S524/925 , Y10T428/256 , Y10T428/258 , Y10T428/28 , Y10T428/2804 , C08L2666/04
摘要： A heat-conductive rubber composition material, which comprises a rubber essentially consisting of an acrylic rubber, a butyl rubber, an ethylene propylene rubber or a blended rubber which comprises at least two of acrylic rubber, butyl rubber, and ethylene propylene rubber are blended, and 50 to 85 weight % of hydrophobic magnesium oxide powder, a heat-conductive rubber sheet prepared by forming the above thermal conductive rubber composition material, and a heat-conductive sheet, which comprises a soft metal sheet and a rubber layer formed on at least one surface of the soft metal sheet.
摘要翻译：将由丙烯酸橡胶，丁基橡胶，乙丙橡胶或含有丙烯酸橡胶，丁基橡胶，乙丙橡胶中的至少2种的配合橡胶构成的橡胶组成的导热性橡胶组合物材料，和50〜85重量％的疏水性氧化镁粉末，通过形成上述导热性橡胶组合物材料制成的导热性橡胶片，以及导热性片材，其包含软质金属片和至少形成的橡胶层软金属片的一个表面。

10. 发明授权

US6085833A Heat sink 失效
标题翻译：散热器
公开(公告)号：US6085833A
公开(公告)日：2000-07-11
申请号：US871150
申请日：1997-06-09
申请人： Naoki Kimura , Jun Niekawa , Osamu Kodachi
发明人： Naoki Kimura , Jun Niekawa , Osamu Kodachi
IPC分类号： F28D15/02 , F28F3/02 , H01L23/373 , H05K7/20
CPC分类号： H01L23/3735 , F28D15/02 , F28F3/02 , H01L23/3736 , H01L2924/0002
摘要： There is provided a heat sink having excellent heat dissipation characteristics and mechanical reliability, which is used for motors for electric vehicles, control circuits therefor, internal combustion engines, general power control units, general motors, general semiconductors (CPUs, power modules, etc.), optical semiconductors and various electronic components, etc. The heat sink is configured so that an aluminum alloy layer is formed on at least one side or on both sides of a metallic plate shaped body and fins are formed on the aluminum alloy layer. Because the fins are formed on the aluminum alloy layer provided on the metallic plate shaped body, satisfactory thermal diffusion is effected in the metallic plate shaped body, and the thermal resistance between the metallic plate shaped body and the fin is low, so that the heat radiating effect is high, and the heat sink can be made small. Also, excellent and stable heat dissipation can be achieved for a long period of time.
摘要翻译：提供具有优异的散热特性和机械可靠性的散热器，其用于电动车辆的电动机，其控制电路，内燃机，通用电力控制单元，通用电动机，通用半导体（CPU，电源模块等）），光半导体和各种电子部件等。散热器配置为在金属板状体的至少一侧或两侧形成铝合金层，并且在铝合金层上形成翅片。由于翅片形成在设置在金属板状体上的铝合金层上，因此在金属板状体中进行良好的热扩散，金属板状体与翅片之间的热阻低，散热效果高，散热器可小。此外，可以长时间实现优异且稳定的散热。

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