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    • 4. 发明申请
    • Nonvolatile integrated semiconductor memory
    • 非易失性集成半导体存储器
    • US20050067634A1
    • 2005-03-31
    • US10950477
    • 2004-09-28
    • Cay-Uwe PinnowMartin GutscheHarald SeidlThomas Happ
    • Cay-Uwe PinnowMartin GutscheHarald SeidlThomas Happ
    • G03G15/02H01L21/28H01L27/115H01L29/423H01L29/788
    • H01L21/28282H01L29/42332H01L29/7881Y10S438/954
    • A nonvolatile integrated semiconductor memory has an arrangement of layers with a tunnel barrier layer and a charge-storing level. The charge-storing level has a dielectric material which stores scattered in charge carriers in a spatially fixed position. The tunnel barrier layer has a material through which high-energy charge carriers can tunnel. At least one interface surface of the charge-storing level has a greater microscopic roughness than the interface surface of the tunnel barrier layer, which is remote from the charge-storing level. The charge-storing level has a greater layer thickness in first regions than in second regions. This produces a relatively identical distribution and localization of positive and negative charge carriers in the lateral direction. The charge carriers which are scattered into the charge-storing level, therefore, recombine completely, so that the risk of unforeseen data loss during long-term operation of nonvolatile memories is reduced.
    • 非易失性集成半导体存储器具有具有隧道势垒层和电荷存储电平的层的排列。 电荷储存电平具有在空间固定位置中分散存储在电荷载体中的电介质材料。 隧道势垒层具有高能电荷载流子穿过的材料。 电荷存储水平的至少一个界面表面具有比远离电荷存储水平的隧道势垒层的界面更大的微观粗糙度。 电荷存储水平在第一区域中具有比在第二区域中更大的层厚度。 这在横向方向产生正电荷载体和负电荷载体的相对相同的分布和定位。 因此,分散到电荷存储电平的电荷载体完全复合,从而降低了在非易失性存储器的长期操作期间不可预见的数据丢失的风险。
    • 6. 发明授权
    • Nonvolatile integrated semiconductor memory
    • 非易失性集成半导体存储器
    • US07084454B2
    • 2006-08-01
    • US10950477
    • 2004-09-28
    • Cay-Uwe PinnowMartin GutscheHarald SeidlThomas Happ
    • Cay-Uwe PinnowMartin GutscheHarald SeidlThomas Happ
    • H01L29/76
    • H01L21/28282H01L29/42332H01L29/7881Y10S438/954
    • A nonvolatile integrated semiconductor memory has an arrangement of layers with a tunnel barrier layer and a charge-storing level. The charge-storing level has a dielectric material which stores scattered in charge carriers in a spatially fixed position. The tunnel barrier layer has a material through which high-energy charge carriers can tunnel. At least one interface surface of the charge-storing level has a greater microscopic roughness than the interface surface of the tunnel barrier layer, which is remote from the charge-storing level. The charge-storing level has a greater layer thickness in first regions than in second regions. This produces a relatively identical distribution and localization of positive and negative charge carriers in the lateral direction. The charge carriers which are scattered into the charge-storing level, therefore, recombine completely, so that the risk of unforeseen data loss during long-term operation of nonvolatile memories is reduced.
    • 非易失性集成半导体存储器具有具有隧道势垒层和电荷存储电平的层的排列。 电荷储存电平具有在空间固定位置中分散存储在电荷载体中的电介质材料。 隧道势垒层具有高能电荷载流子穿过的材料。 电荷存储水平的至少一个界面表面具有比远离电荷存储水平的隧道势垒层的界面更大的微观粗糙度。 电荷存储水平在第一区域中具有比在第二区域中更大的层厚度。 这在横向方向产生正电荷载体和负电荷载体的相对相同的分布和定位。 因此,分散到电荷存储电平的电荷载体完全复合,从而降低了在非易失性存储器的长期操作期间不可预见的数据丢失的风险。
    • 10. 发明申请
    • PROCESS FOR PRODUCING SUBLITHOGRAPHIC STRUCTURES
    • 生产分层结构的方法
    • US20100006983A1
    • 2010-01-14
    • US12548723
    • 2009-08-27
    • Martin GutscheHarald Seidl
    • Martin GutscheHarald Seidl
    • H01L29/00
    • H01L21/0337H01L21/0338H01L21/30604
    • A layer structure and process for providing sublithographic structures are provided. A first auxiliary layer is formed over a surface of a carrier layer. A lithographically patterned second auxiliary layer structure is formed on a surface of the first auxiliary layer. The first auxiliary layer is anisotropically etched using the patterned second auxiliary layer structure as mask to form an anisotropically patterned first auxiliary layer structure. The anisotropically patterned first auxiliary layer structure is isotropically etched back using the patterned second auxiliary layer structure to remove subsections below the second auxiliary layer structure and to form an isotropically patterned first auxiliary layer structure. A mask layer is formed over the carrier layer including the subsections beneath the second auxiliary layer structure and is anisotropically etched down to the carrier layer to form the sublithographic structures. The first and second auxiliary layer structures are removed to uncover the sublithographic structures
    • 提供了用于提供亚光刻结构的层结构和工艺。 在载体层的表面上形成第一辅助层。 在第一辅助层的表面上形成光刻图案化的第二辅助层结构。 使用图案化的第二辅助层结构作为掩模对第一辅助层进行各向异性蚀刻,以形成各向异性图案化的第一辅助层结构。 各向异性图案化的第一辅助层结构使用图案化的第二辅助层结构进行各向同性地回蚀,以除去第二辅助层结构之下的部分并形成各向同性图案化的第一辅助层结构。 掩模层形成在载体层上,包括第二辅助层结构下面的子部分,并且各向异性地向下蚀刻到载体层以形成亚光刻结构。 去除第一和第二辅助层结构以露出​​亚光刻结构