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1. 发明申请

US20110199167A1 MEMS RESONATOR ARRAY STRUCTURE AND METHOD OF OPERATING AND USING SAME 有权
标题翻译： MEMS谐振器阵列结构及其操作和使用方法
公开(公告)号：US20110199167A1
公开(公告)日：2011-08-18
申请号：US13040757
申请日：2011-03-04
申请人： Markus LUTZ , Zhiyu PAN , Aaron PARTRIDGE
发明人： Markus LUTZ , Zhiyu PAN , Aaron PARTRIDGE
IPC分类号： H03H9/15
CPC分类号： H03B5/30 , H03H9/02259 , H03H9/02338 , H03H9/2405 , H03H9/2447 , H03H9/505 , H03H2009/0233 , H03H2009/02385 , H03H2009/0244 , H03H2009/02503
摘要： Each one of resonators arranged in an N×M MEMS array structure includes substantially straight elongated beam sections connected by curved/rounded sections and is mechanically coupled to at least one adjacent resonator of the array via a coupling section, each elongated beam section connected to another elongated beam section at a distal end via the curved/rounded sections forming a geometric shape (e.g., a rounded square), and the coupling sections disposed between elongated beam sections of adjacent resonators. The resonators, when induced, oscillate at substantially the same frequency, in combined elongating/breathing and bending modes, i.e., beam sections exhibiting elongating/breathing-like and bending-like motions. One or more of the array structure's resonators may include one or more nodal points (i.e., that are substantially stationary and/or experience little movement), which are suitable and/or preferable locations to anchor the resonator/array to the substrate, in one or more areas of the structure's curved sections.
摘要翻译：布置在N×M MEMS阵列结构中的每个谐振器包括通过弯曲/圆形部分连接的基本上直的细长梁段，并且经由耦合部分机械耦合到阵列的至少一个相邻谐振器，每个细长梁部分连接到另一个通过形成几何形状（例如，圆形方形）的弯曲/圆形部分的远端处的细长梁部分，以及设置在相邻谐振器的细长梁部分之间的耦合部分。谐振器在被诱导时以组合的延长/呼吸和弯曲模式即基本上相同的频率振荡，即表现出延长/呼吸状和弯曲状运动的梁部分。一个或多个阵列结构的谐振器可以包括一个或多个节点（即基本上静止的和/或经历少量运动），这些点是合适的和/或优选的将谐振器/阵列锚定到衬底的位置，一个或更多的结构的弯曲部分的区域。

2. 发明申请

US20130280842A1 MICROELECTROMECHANICAL DEVICE INCLUDING AN ENCAPSULATION LAYER OF WHICH A PORTION IS REMOVED TO EXPOSE A SUBSTANTIALLY PLANAR SURFACE HAVING A PORTION THAT IS DISPOSED OUTSIDE AND ABOVE A CHAMBER AND INCLUDING A FIELD REGION ON WHICH INTEGRATED CIRCUITS ARE FORMED, AND METHODS FOR FABRICATING SAME 有权
标题翻译：微电子装置，其中包括一部分的封装层，其中所述掩蔽层被移除以暴露出具有外部并在室外排出的部分的主要平面表面，并且包括形成集成电路的场区域及其制造方法
公开(公告)号：US20130280842A1
公开(公告)日：2013-10-24
申请号：US13829393
申请日：2013-03-14
申请人： Aaron PARTRIDGE , Markus LUTZ , Silvia Kronmueller
发明人： Aaron PARTRIDGE , Markus LUTZ , Silvia Kronmueller
IPC分类号： B81C1/00
CPC分类号： B81C1/00261 , B81B2207/015 , B81C1/00333 , B81C2201/0176 , B81C2203/0136 , H01L2924/0002 , H01L2924/00
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
摘要翻译：这里描述和说明了许多发明。在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。

3. 发明申请

US20110033967A1 Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same 有权
标题翻译：用于在微机电系统中捕获电荷的方法和使用其的微机电系统
公开(公告)号：US20110033967A1
公开(公告)日：2011-02-10
申请号：US12908506
申请日：2010-10-20
申请人： Markus LUTZ , Aaron Partridge , Brian H. Stark
发明人： Markus LUTZ , Aaron Partridge , Brian H. Stark
IPC分类号： H01L21/02 , H01L21/768
CPC分类号： H01H85/04 , B81B3/0021 , B81B3/0086
摘要： Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplying, storing and/or trapping charge on the mechanical structure. In some aspects, a breakable link, a thermionic electron source and/or a movable mechanical structure are employed. The breakable link may comprise a fuse. In one embodiment, the movable mechanical structure is driven to resonate. In some aspects, the electrical charge enables a transducer to convert vibrational energy to electrical energy, which may be used to power circuit(s), device(s) and/or other purpose(s). In some aspects, the electrical charge is employed in changing the resonant frequency of a mechanical structure and/or generating an electrostatic force, which may be repulsive.
摘要翻译：许多发明被公开。一些方面涉及用于和/或制造MEMS的MEMS，和/或用于在设置在室中的机械结构上提供，存储和/或捕获电荷的方法。各种结构可以设置在室中并用于在机械结构上供应，储存和/或捕集电荷。在一些方面，采用易碎连接件，热离子电子源和/或可移动机械结构。可破坏的连接件可以包括保险丝。在一个实施例中，可移动机械结构被驱动以共振。在一些方面，电荷使得换能器将振动能量转换成电能，其可用于为电路，设备和/或其他目的供电。在一些方面，电荷用于改变机械结构的谐振频率和/或产生可能是排斥性的静电力。

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