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    • 1. 发明授权
    • Multi-stage alignment guidepin
    • 多级对准导轨
    • US07684201B2
    • 2010-03-23
    • US11757172
    • 2007-06-01
    • Mark M. BaileyLawrence A. Kyle
    • Mark M. BaileyLawrence A. Kyle
    • H05K1/14
    • H05K7/1454
    • An alignment guidepin comprises a pre-alignment portion, an alignment portion, and a release portion. The pre-alignment portion provides gross alignment for a connection between a connecting module of a server and a connector of a computer server chassis. The alignment portion is connected to the pre-alignment portion having a first diameter to allow a high precision alignment for the connection between the connecting module and the connector. The release portion is connected to the alignment portion having a second diameter different than the first diameter to allow the connecting module and the connector to guide the connection.
    • 对准导轨包括预对准部分,对准部分和释放部分。 预对准部分为服务器的连接模块和计算机服务器机箱的连接器之间的连接提供总体对准。 对准部分连接到具有第一直径的预对准部分,以允许连接模块和连接器之间的连接的高精度对准。 释放部分连接到具有不同于第一直径的第二直径的对准部分,以允许连接模块和连接器引导连接。
    • 2. 发明申请
    • Multi-stage alignment guidepin
    • 多级对准导轨
    • US20080298004A1
    • 2008-12-04
    • US11757172
    • 2007-06-01
    • Mark M. BaileyLawrence A. Kyle
    • Mark M. BaileyLawrence A. Kyle
    • H05K5/02
    • H05K7/1454
    • An alignment guidepin comprises a pre-alignment portion, an alignment portion, and a release portion. The pre-alignment portion provides gross alignment for a connection between a connecting module of a server and a connector of a computer server chassis. The alignment portion is connected to the pre-alignment portion having a first diameter to allow a high precision alignment for the connection between the connecting module and the connector. The release portion is connected to the alignment portion having a second diameter different than the first diameter to allow the connecting module and the connector to guide the connection.
    • 对准导轨包括预对准部分,对准部分和释放部分。 预对准部分提供用于服务器的连接模块和计算机服务器机箱的连接器之间的连接的总体对准。 对准部分连接到具有第一直径的预对准部分,以允许连接模块和连接器之间的连接的高精度对准。 释放部分连接到具有不同于第一直径的第二直径的对准部分,以允许连接模块和连接器引导连接。
    • 4. 发明授权
    • Computer board support and heat sink retention apparatus
    • 电脑板支架和散热片固定装置
    • US06424527B1
    • 2002-07-23
    • US09951367
    • 2001-09-11
    • Mark M. BaileyTy R. Schmitt
    • Mark M. BaileyTy R. Schmitt
    • H05K720
    • H04N3/22G06F1/183G06F1/20H01L23/4093H01L2924/0002H01L2924/00
    • A computer board support apparatus includes an elongated one-piece body having opposite terminal ends attached to a first side of a computer board. The bracket includes a plurality of spaced apart arms extending between the terminal ends and a plurality of locking support feet extending from the body adjacent the arms. A plurality of spaced apart brackets are mounted on a second side of the board opposite the first side. A plurality of fasteners extend through the terminal ends of the body, through the board and engage the brackets for securing the apparatus to the board. A microprocess is mounted on the board between the brackets. A heatsink is mounted on the brackets and in contact with the microprocessor for transferring heat from the microprocessor.
    • 计算机板支撑装置包括细长的一体式主体,其具有连接到计算机板的第一侧的相对的终端。 支架包括在终端之间延伸的多个间隔开的臂和从身体邻近臂延伸的多个锁定支撑脚。 多个间隔开的支架安装在板的与第一侧相对的第二侧上。 多个紧固件穿过主体的终端延伸穿过该板并与托架接合,以将设备固定到板上。 微处理器安装在支架之间的板上。 散热器安装在支架上并与微处理器接触,用于传递来自微处理器的热量。
    • 7. 发明授权
    • System and method for a modular fluid handling system with modes in a modular data center
    • 具有模块化数据中心模式的模块化流体处理系统的系统和方法
    • US08462496B2
    • 2013-06-11
    • US13033451
    • 2011-02-23
    • Ty SchmittMark M. BaileyTyler Duncan
    • Ty SchmittMark M. BaileyTyler Duncan
    • G06F1/20F28F13/00H05K7/20
    • G06F1/20H05K7/1497H05K7/20754
    • In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure.
    • 根据本公开,提出了一种具有模块化数据中心中的模式的模块化流体处理系统的系统和方法。 根据本申请,模块化数据中心可以包括模块化主要结构。 模块化主要结构可以包括布置在其内的机架中的多个信息处理系统。 模块化数据中心还可以包括模块化流体处理系统,该系统至少部分地通过模块化主要结构循环流体到多个模式。 模块化流体处理系统可以设计成适应模块化数据中心将运行的环境条件以及模块化主要结构的使用要求。