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1. 发明授权

US5225624A Disintegrating injector for primary and fuel enriched plasma 失效
标题翻译：用于初级和富燃料等离子体的分解喷射器
公开(公告)号：US5225624A
公开(公告)日：1993-07-06
申请号：US807482
申请日：1991-12-16
申请人： Mark E. Schneider , Steven R. Stricker , Michael R. Triviski , Chris S. Sorenson
发明人： Mark E. Schneider , Steven R. Stricker , Michael R. Triviski , Chris S. Sorenson
IPC分类号： F42B6/00 , F42C19/08
CPC分类号： F42C19/0811 , F42B6/006
摘要： The apparatus and method disclosed herein relates to the generation of primary and fuel-enriched plasma to provide ignition and delivery for large amounts of electrical and electrothermal power to a propellant mass. Particularly, the present invention enables the creation of zones of controlled combustion by initially incubating primary plasma in a capillary chamber and mixing the primary plasma with fuel in a fuel chamber thus creating a fuel-enriched plasma. The primary plasma and the fuel-enriched plasma are segregatively, collectively and substantially simultaneously injected into the propellant mass via outlet ports and nozzles. The capillary and fuel chambers, and the nozzles and outlet ports undergo staged disintegration at reaching predetermined pressures and temperatures and are thereby consumed in the combustion process.
摘要翻译：本文公开的装置和方法涉及产生初级和燃料富集的等离子体，以向推进剂物质提供大量电和电热功率的点火和输送。特别地，本发明能够通过初始孵育毛细管腔中的初级等离子体并将主要等离子体与燃料室中的燃料混合，从而产生富燃料等离子体，从而创建受控燃烧区域。主要等离子体和富燃料等离子体通过出口和喷嘴分离地，共同地并且基本上同时地喷射到推进剂物质中。毛细管和燃料室以及喷嘴和出口在达到预定的压力和温度下经历分级分解，从而在燃烧过程中消耗。

2. 发明授权

US5220126A High energy intermittent power connector 失效
标题翻译：高能间歇电源连接器
公开(公告)号：US5220126A
公开(公告)日：1993-06-15
申请号：US749040
申请日：1991-08-23
申请人： Dennis Borgwarth , Mark E. Schneider , Steven R. Stricker , Steven R. Zelenak
发明人： Dennis Borgwarth , Mark E. Schneider , Steven R. Stricker , Steven R. Zelenak
IPC分类号： F41A19/70
CPC分类号： F41A19/70
摘要： The apparatus and method disclosed herein relates to axially aligned electrical contacts which connect a high electrical power pulse forming network to an electrothermal ammunition integrated plasma injector in a combustion augmented plasma gun for launching projectiles thereof. The contacts transfer high energy, intermittent pulses without arcing because structure provides for axially preloading the contacts to reduce contact resistance, for axially stiffening the contacts to eliminate contact bounce and for providing complementary conical contact surfaces to facilitate a high current density transfer.
摘要翻译：本文公开的装置和方法涉及轴向对准的电触头，其将高功率脉冲形成网络连接到用于发射其射弹的燃烧增强等离子体枪中的电热弹药集成等离子体喷射器。触点传递高能量，间歇脉冲而没有电弧，因为结构提供轴向预加载触点以降低接触电阻，用于轴向加强触点以消除触点反弹并提供互补的圆锥形接触表面以促进高电流密度传输。

3. 发明授权

US5355764A Plasma actuated ignition and distribution pump 失效
标题翻译：等离子致动点火和分配泵
公开(公告)号：US5355764A
公开(公告)日：1994-10-18
申请号：US878350
申请日：1992-05-04
申请人： Charalampos D. Marinos , James P. Warren , Amir Chaboki , Chris S. Sorensen , Mark E. Schneider
发明人： Charalampos D. Marinos , James P. Warren , Amir Chaboki , Chris S. Sorensen , Mark E. Schneider
IPC分类号： F41B6/00
CPC分类号： F42C19/0811 , F41B6/00
摘要： The method and apparatus disclosed herein relates to harnessing plasma to ignite, pressurize and distribute plasma, plasma-ignited chemical fluid and fuel throughout a propellant mass. Particularly, the present invention enables the creation of a progressive burning surface whereby the propellant reaches maximum pressure controllably and losses pressure much more slowly thus creating high piezometric efficiency. More particularly, in gun-charge-projectile systems, by using radial perforations designed to provide a balanced plasma discharge through a capillary wall and by developing forward accelerating thrust components, induced by the plasma pressure on a plasma-ignited chemical fluid and fuel mixture, the propelling charge travels down the gun tube with the projectile thus exerting substantial uniform pressure throughout the tube length and yielding a high ballistic efficiency which results in the attainment of high muzzle velocities.
摘要翻译：本文公开的方法和装置涉及利用等离子体来点燃，加压和分配整个推进剂物质中的等离子体，等离子体点燃的化学流体和燃料。特别地，本发明能够产生逐步燃烧表面，由此推进剂可控地达到最大压力并且更慢地获得损失压力，从而产生高的压电效率。更具体地说，在枪装弹射系统中，通过使用设计成通过毛细管壁提供平衡等离子体放电并且通过等离子体点燃的化学流体和燃料混合物等离子体压力引起的向前加速推力分量的径向穿孔，推进装置用喷射器沿着喷枪管向下移动，从而在整个管道长度上施加相当大的均匀的压力并且产生高的弹道效率，这导致达到高的枪口速度。

4. 发明申请

US20110079925A1 Flip Chip Interconnect Method and Design For GaAs MMIC Applications 有权
标题翻译：用于GaAs MMIC应用的倒装芯片互连方法和设计
公开(公告)号：US20110079925A1
公开(公告)日：2011-04-07
申请号：US12572476
申请日：2009-10-02
申请人： Peter A. Stenger , Mark E. Schneider , Thomas A. Andersen
发明人： Peter A. Stenger , Mark E. Schneider , Thomas A. Andersen
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/12 , H01L23/552 , H01L23/66 , H01L24/11 , H01L24/15 , H01L24/16 , H01L2224/1134 , H01L2224/11822 , H01L2224/13021 , H01L2224/13099 , H01L2224/13144 , H01L2224/16235 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01042 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/3011 , H01L2924/00
摘要： A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.
摘要翻译：通过用抑制金属电镀材料沉积的介电涂层（例如苯并环丁烯（BCB））涂覆芯片的有源侧来形成单片微波集成电路（MMIC）倒装芯片互连。去除电介质涂层的一部分以暴露芯片的有源侧上的焊盘，柱形突起结合到接合焊盘，然后用活性侧镀有第一和第二连续的金属电镀材料，例如镍和金，分别不粘附于电介质涂层。然后将芯片定向成使得芯片的有源侧上的电镀突起凸起接合衬底上的焊盘，并且芯片上的柱状凸起接合到衬底上的接合焊盘。

5. 发明授权

US5886290A Annular plasma injector 失效
标题翻译：环形等离子体注入器
公开(公告)号：US5886290A
公开(公告)日：1999-03-23
申请号：US903258
申请日：1997-07-25
申请人： John S. Lindblom , Steven R. Zelenak , Steven M. French , Mark E. Schneider
发明人： John S. Lindblom , Steven R. Zelenak , Steven M. French , Mark E. Schneider
IPC分类号： F41B6/00 , F42B5/08 , F42B6/00
CPC分类号： F42B5/08 , F41B6/00 , F42B6/006
摘要： This disclosure relates to a plasma generation device particularly adapted to an electrothermal-chemical propulsion system. The device comprises a membranous conductive substance having structural compositions which enable the formation of a continuous and volumetrically distributed, segmentally varied plasma arc. The membranous substance is versatile and operates, inter alia, as a fuse wire, plasma incubator, plasma container, plasma distributor, plasma infusion and permeation media as well as a fuel container.
摘要翻译：本公开涉及一种特别适用于电热化学推进系统的等离子体产生装置。该装置包括具有结构组成的膜状导电物质，其能够形成连续和体积分布的，分段变化的等离子弧。膜物质是通用的，尤其是作为保险丝，等离子体培养箱，等离子体容器，等离子体分配器，等离子体输注和渗透介质以及燃料容器。

6. 发明授权

US08476757B2 Flip chip interconnect method and design for GaAs MMIC applications 有权
标题翻译：用于GaAs MMIC应用的倒装芯片互连方法和设计
公开(公告)号：US08476757B2
公开(公告)日：2013-07-02
申请号：US12572476
申请日：2009-10-02
申请人： Peter A. Stenger , Mark E. Schneider , Thomas A. Andersen
发明人： Peter A. Stenger , Mark E. Schneider , Thomas A. Andersen
IPC分类号： H01L23/34
CPC分类号： H01L24/12 , H01L23/552 , H01L23/66 , H01L24/11 , H01L24/15 , H01L24/16 , H01L2224/1134 , H01L2224/11822 , H01L2224/13021 , H01L2224/13099 , H01L2224/13144 , H01L2224/16235 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01042 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/3011 , H01L2924/00
摘要： A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.
摘要翻译：通过用抑制金属电镀材料沉积的介电涂层（例如苯并环丁烯（BCB））涂覆芯片的有源侧来形成单片微波集成电路（MMIC）倒装芯片互连。去除电介质涂层的一部分以暴露芯片的有源侧上的焊盘，柱形突起结合到接合焊盘，然后用活性侧镀有第一和第二连续的金属电镀材料，例如镍和金，分别不粘附于电介质涂层。然后将芯片定向成使得芯片的有源侧上的电镀突起凸起接合衬底上的焊盘，并且芯片上的柱状凸起接合到衬底上的接合焊盘。

7. 发明授权

US5767439A Annular plasma injector 失效
公开(公告)号：US5767439A
公开(公告)日：1998-06-16
申请号：US473156
申请日：1995-06-07
申请人： John S. Lindblom , Steven R. Zelenak , Steven M. French , Mark E. Schneider
发明人： John S. Lindblom , Steven R. Zelenak , Steven M. French , Mark E. Schneider
IPC分类号： F41B6/00 , F42B5/08 , F42B6/00
CPC分类号： F42B5/08 , F41B6/00 , F42B6/006
摘要： This disclosure relates to a plasma generation device particularly adapted to an electrothermal-chemical propulsion system. The device comprises a membranous conductive substance having structural compositions which enable the formation of a continuous and volumetrically distributed plasma arc. The membranous substance is versatile and operates, inter alia, as a fuse wire, plasma incubator, plasma container, plasma distributor, plasma infusion and permeation media as well as a fuel container.

8. 发明授权

US5503081A Annular plasma injector 失效
标题翻译：环形等离子体注入器
公开(公告)号：US5503081A
公开(公告)日：1996-04-02
申请号：US155675
申请日：1993-11-22
申请人： John S. Lindblom , Steven R. Zelenak , Steven M. French , Mark E. Schneider
发明人： John S. Lindblom , Steven R. Zelenak , Steven M. French , Mark E. Schneider
IPC分类号： F41B6/00 , F42B5/08 , F42B6/00
CPC分类号： F42B5/08 , F41B6/00 , F42B6/006
摘要： This disclosure relates to a plasma generation device particularly adapted to an electrothermal-chemical propulsion system. The device comprises a membranous conductive substance having structural compositions which enable the formation of a continuous and volumetrically distributed plasma arc. The membranous substance is versatile and operates, inter alia, as a fuse wire, plasma incubator, plasma container, plasma distributor, plasma infusion and permeation media as well as a fuel container.
摘要翻译：本公开涉及一种特别适用于电热化学推进系统的等离子体产生装置。该装置包括具有能够形成连续和体积分布的等离子弧的结构组成的膜状导电物质。膜物质是通用的，尤其是作为保险丝，等离子体培养箱，等离子体容器，等离子体分配器，等离子体输注和渗透介质以及燃料容器。

9. 发明授权

US4774555A Power hemt structure 失效
标题翻译：电源结构
公开(公告)号：US4774555A
公开(公告)日：1988-09-27
申请号：US83751
申请日：1987-08-07
申请人： Erhard Kohn , Mark E. Schneider , Chia-Jen Wu
发明人： Erhard Kohn , Mark E. Schneider , Chia-Jen Wu
IPC分类号： H01L29/812 , H01L21/285 , H01L21/306 , H01L21/335 , H01L21/338 , H01L29/423 , H01L29/778 , H01L29/80 , H01L29/56
CPC分类号： H01L29/66462 , H01L21/28587 , H01L21/30621 , H01L29/42316 , H01L29/7787
摘要： A modulation-doped field effect transistor comprises a gate recess through a top insulating layer, having a cross-section in a semiconductor layer increasing down to an interface with a further semiconductor layer and thereafter having a cross-section in the further semiconductor layer decreasing down to the bottom of the recess in the further semiconductor layer. A gate electrode is formed in the recess.
摘要翻译：调制掺杂场效应晶体管包括通过顶部绝缘层的栅极凹槽，其在半导体层中的横截面增加到与另外的半导体层的界面，然后在另外的半导体层中具有减小的横截面到另一半导体层中的凹部的底部。在凹部中形成栅电极。

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