会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Re-treatment for ophthalmic correction of refraction
    • 重新治疗眼科矫正矫正
    • US08623038B2
    • 2014-01-07
    • US12109921
    • 2008-04-25
    • Mark BischoffDirk MuehlhoffGregor Stobrawa
    • Mark BischoffDirk MuehlhoffGregor Stobrawa
    • A61F9/008
    • A61F9/00827A61F9/008A61F9/00836A61F2009/00872A61F2009/0088A61K9/0048A61K9/0051
    • A planning device generating control data for a treatment apparatus for refraction-correcting ophthalmic surgery is provided, said apparatus using a laser device to separate a corneal volume, which is to be removed for correction, from the surrounding cornea by at least one cut surface in the cornea of an eye, said planning device comprising an interface for receiving corneal data including information on pre-operative cuts which were generated in a previous ophthalmic operation, and computing means for defining a corneal cut surface which confines the corneal volume to be removed, said computing means defining the corneal cut surface on the basis of the corneal data and generating a control dataset for the corneal cut surface for control of the laser device.
    • 提供了一种用于产生用于折射校正眼科手术的治疗装置的控制数据的计划装置,所述装置使用激光装置将要被去除的矫正角膜体积从周围角膜分开至少一个切割面 眼睛的角膜,所述规划装置包括用于接收角膜数据的界面,所述角膜数据包括在以前的眼科手术中产生的关于术前切口的信息,以及用于限定限定要去除的角膜体积的角膜切割表面的计算装置, 所述计算装置基于角膜数据来定义角膜切割表面,并且产生用于角膜切割表面的控制数据集,用于控制激光装置。
    • 4. 发明授权
    • Device and method for material processing by means of laser radiation
    • 通过激光辐射进行材料加工的装置和方法
    • US08553735B2
    • 2013-10-08
    • US11786421
    • 2007-04-11
    • Mark BischoffDirk MuehlhoffGregor Stobrawa
    • Mark BischoffDirk MuehlhoffGregor Stobrawa
    • H01S3/10A61B18/18
    • B23K26/0876A61F9/00827A61F9/00836A61F2009/00872B23K26/0624
    • In a device for material processing by means of laser radiation, said device comprising a source of laser radiation emitting pulsed laser radiation for interaction with the material; optics focusing the pulsed processing laser radiation to a center of interaction in the material; a scanning unit shifting the positions of the center of interaction within the material, wherein each processing laser pulse interacts with the material in a zone surrounding the center of interaction assigned to said laser pulse so that material is separated in the zones of interaction; and a control unit which controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction, it is envisaged that the control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ≦10 μm from each other.
    • 在用于通过激光辐射进行材料处理的装置中,所述装置包括用于与材料相互作用的发射脉冲激光辐射的激光辐射源; 将脉冲处理激光辐射聚焦到材料中的相互作用中心; 扫描单元移动材料内的相互作用中心的位置,其中每个处理激光脉冲与分配给所述激光脉冲的相互作用中心的区域中的材料相互作用,使得材料在相互作用区域中分离; 以及控制单元,其控制扫描单元和激光辐射源,使得通过相互作用区域的顺序布置在材料中产生切割表面,设想控制单元控制激光辐射源和扫描单元 使得相邻的相互中心位于彼此相距10微米的空间距离。
    • 7. 发明申请
    • Device and method for material processing by means of laser radiation
    • 通过激光辐射进行材料加工的装置和方法
    • US20080212623A1
    • 2008-09-04
    • US11786421
    • 2007-04-11
    • Mark BischoffDirk MuehlhoffGregor Stobrawa
    • Mark BischoffDirk MuehlhoffGregor Stobrawa
    • H01S3/10B23K26/38A61B18/18
    • B23K26/0876A61F9/00827A61F9/00836A61F2009/00872B23K26/0624
    • In a device for material processing by means of laser radiation, said device comprising a source of laser radiation emitting pulsed laser radiation for interaction with the material; optics focusing the pulsed processing laser radiation to a center of interaction in the material; a scanning unit shifting the positions of the center of interaction within the material, wherein each processing laser pulse interacts with the material in a zone surrounding the center of interaction assigned to said laser pulse so that material is separated in the zones of interaction; and a control unit which controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction, it is envisaged that the control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a≦10 μm from each other.
    • 在用于通过激光辐射进行材料处理的装置中,所述装置包括用于与材料相互作用的发射脉冲激光辐射的激光辐射源; 将脉冲处理激光辐射聚焦到材料中的相互作用中心; 扫描单元移动材料内的相互作用中心的位置,其中每个处理激光脉冲与分配给所述激光脉冲的相互作用中心的区域中的材料相互作用,使得材料在相互作用区域中分离; 以及控制单元,其控制扫描单元和激光辐射源,使得通过相互作用区域的顺序布置在材料中产生切割表面,设想控制单元控制激光辐射源和扫描单元 使得相邻的相互中心位于彼此之间的空间距离a <= 10mum。
    • 8. 发明申请
    • DEVICE AND METHOD FOR MATERIAL PROCESSING BY MEANS OF LASER RADIATION
    • 通过激光辐射进行材料加工的装置和方法
    • US20070088409A1
    • 2007-04-19
    • US11549472
    • 2006-10-13
    • Mark BischoffDirk MuehlhoffGregor Stobrawa
    • Mark BischoffDirk MuehlhoffGregor Stobrawa
    • B23K26/00A61N5/06
    • B23K26/02A61F9/00827A61F2009/00872A61F2009/00897B23K26/035B23K26/0624B23K26/0876
    • In a device for material processing by laser radiation, including a source of laser radiation emitting pulsed laser radiation for interaction with the material; optics focusing the pulsed processing laser radiation to a center of interaction in the material and a scanning unit shifting the positions of the center of interaction within the material. Each processing laser pulse interacts with the material in a zone surrounding the center of interaction assigned to the laser pulse so that material is separated in the zones of interaction. A control unit controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction. The control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ≦10 μm from each other.
    • 在用于通过激光辐射进行材料处理的装置中,包括用于与材料相互作用的发射脉冲激光辐射的激光辐射源; 将脉冲处理激光辐射聚焦到材料中的相互作用中心的光学器件和扫描单元移动材料内的相互作用中心的位置。 每个处理激光脉冲与分配给激光脉冲的相互作用中心区域中的材料相互作用,使得材料在相互作用区域中分离。 控制单元控制扫描单元和激光辐射源,使得通过相互作用区域的顺序布置在材料中产生切割表面。 控制单元控制激光辐射源和扫描单元,使得相邻的相互中心位于彼此之间的空间距离a <= 10mum。