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1. 发明授权

US06259155B1 Polymer enhanced column grid array 有权
标题翻译：聚合物增强柱网格阵列
公开(公告)号：US06259155B1
公开(公告)日：2001-07-10
申请号：US09290311
申请日：1999-04-12
申请人： Mario John Interrante , Raymond Alan Jackson , Sudipta Kumar Ray , Paul A. Zucco , Scott R. Dwyer
发明人： Mario John Interrante , Raymond Alan Jackson , Sudipta Kumar Ray , Paul A. Zucco , Scott R. Dwyer
IPC分类号： H01L2348
CPC分类号： H05K3/3436 , H01L23/49811 , H01L23/49894 , H01L2224/16225 , H01L2224/73253 , H01L2924/01046 , H01L2924/01322 , H01L2924/12044 , H01L2924/15312 , H01L2924/16152 , H05K2201/10977 , H05K2203/0415 , H05K2203/176 , Y02P70/613
摘要： A ceramic column grid array package suitable for mounting application specific integrated circuits or microprocessor chips onto a printed circuit board employing polymer reinforced columns on the substrate module is described. The polymer enhancement is formed by coating a thin conformal film of a polymer, such as, a polyimide onto the substrate module after the formation of the ceramic column grids to mechanically enhance the column to substrate attachment of the column to the substrate prior to mounting on a printed circuit card. Upon curing of the polymer film at a temperature below the melting point of the solder bond attaching the column grid to the substrate, the columns will be mechanically reinforced in their attachment to the substrate. Upon removal of the substrate module from a printed circuit card during rework, the columns of the grid array will remain with the substrate module, leaving no columns on the printed circuit card.
摘要翻译：描述了一种适用于将专用集成电路或微处理器芯片安装在使用基板模块上的聚合物增强柱的印刷电路板上的陶瓷柱栅格阵列封装。在形成陶瓷柱网格之后，通过在形成陶瓷柱网格之后，将诸如聚酰亚胺等聚合物的薄的共形膜涂覆在基板组件上，以在安装到基板之前机械地增强柱与基板的连接，从而形成聚合物增强。印刷电路卡。当聚合物膜在低于焊接粘合点的温度下固化时，将柱格栅连接到基底上，柱将被附着到基底上机械地增强。在返工过程中从打印电路卡移除基板模块后，网格阵列将保留在基板模块上，在印刷电路板上不留列。

2. 发明授权

US6121539A Thermoelectric devices and methods for making the same 失效
标题翻译：热电器件及其制造方法
公开(公告)号：US6121539A
公开(公告)日：2000-09-19
申请号：US141481
申请日：1998-08-27
申请人： Gregory M. Johnson , Jon A. Casey , Scott R. Dwyer , David C. Long , Kevin M. Prettyman
发明人： Gregory M. Johnson , Jon A. Casey , Scott R. Dwyer , David C. Long , Kevin M. Prettyman
IPC分类号： H01L23/38 , H01L35/32 , H01L35/28
CPC分类号： H01L23/38 , H01L35/32 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/09701
摘要： Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods are employed for forming tunnels through lamination and etching. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste. Alternating semiconducting materials may also be patterned in linear or radial fanout patterns through screening techniques and lamination of wire structures. A liquid channel within the faceplate is used to enhance thermal energy transfer. Thermoelectric devices are physically incorporated within the IC package using MLC technology.
摘要翻译：具有增强的热特性的热电装置使用多层陶瓷（MLC）技术方法制造。具有嵌入式电连接的氮化铝面板为交替的不同的半导体材料提供了电气串联配置。嵌入式电气连接由面板中的通孔和线形成。采用层压法和蚀刻法形成隧道的方法。然后将不同材料的一部分在隧道内熔化以形成粘结。通过向一个表面添加电隔离的通孔，填充高导热性金属膏，增强了面板的导热性。在两个高导热材料面板之间也引入低导热材料。交替的半导体材料通过在预定导热率的孔内冲压通孔并填充n型和p型浆料而在不同的导热层内引入。交替的半导体材料还可以通过屏蔽技术和线结构的层叠来以线性或径向扇出图案图案化。面板内的液体通道用于增强热能传递。使用MLC技术将热电器件物理地并入IC封装。

3. 发明授权

US06262357B1 Thermoelectric devices and methods for making the same 失效
标题翻译：热电器件及其制造方法
公开(公告)号：US06262357B1
公开(公告)日：2001-07-17
申请号：US09543269
申请日：2000-04-05
申请人： Gregory M. Johnson , Jon A. Casey , Scott R. Dwyer , David C. Long , Kevin M. Prettyman
发明人： Gregory M. Johnson , Jon A. Casey , Scott R. Dwyer , David C. Long , Kevin M. Prettyman
IPC分类号： H01L3528
CPC分类号： H01L23/38 , H01L35/32 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/09701 , H01L2224/0401
摘要： Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods for forming tunnels through lamination and etching are employed. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste. Alternating semiconducting materials may also be patterned in linear or radial fanout patterns through screening techniques and lamination of wire structures. A liquid channel within the faceplate is used to enhance thermal energy transfer. Thermoelectric devices are physically incorporated within the IC package using MLC technology.
摘要翻译：具有增强的热特性的热电装置使用多层陶瓷（MLC）技术方法制造。具有嵌入式电连接的氮化铝面板为交替的不同的半导体材料提供了电气串联配置。嵌入式电气连接由面板中的通孔和线形成。采用通过层压和蚀刻形成隧道的方法。然后将不同材料的一部分在隧道内熔化以形成粘结。通过向一个表面添加电隔离的通孔，填充高导热性金属膏，增强了面板的导热性。在两个高导热材料面板之间还引入低导热材料。通过在预定导热率的孔内冲压通孔并填充n型和p型浆料，将不同的导热层引入异构半导体材料。交替的半导体材料还可以通过屏蔽技术和线结构的层叠来以线性或径向扇出图案图案化。面板内的液体通道用于增强热能传递。热电器件使用MLC技术物理地并入IC封装内。

4. 发明授权

US06278049B1 Thermoelectric devices and methods for making the same 失效
标题翻译：热电器件及其制造方法
公开(公告)号：US06278049B1
公开(公告)日：2001-08-21
申请号：US09543689
申请日：2000-04-05
申请人： Gregory M. Johnson , Jon A. Casey , Scott R. Dwyer , David C. Long , Kevin M. Prettyman
发明人： Gregory M. Johnson , Jon A. Casey , Scott R. Dwyer , David C. Long , Kevin M. Prettyman
IPC分类号： H01L3534
CPC分类号： H01L23/38 , H01L35/32 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/09701 , H01L2224/0401
摘要： Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste or may also be patterned in linear or radial fanout patterns through screening techniques and lamination of wire structures. a liquid channel within the faceplate is used to enhance thermal energy transfer. Thermoelectric devices are physically incorporated within the IC package using MLC technology.
摘要翻译：具有增强的热特性的热电装置使用多层陶瓷（MLC）技术方法制造。具有嵌入式电连接的氮化铝面板为交替的不同的半导体材料提供了电气串联配置。嵌入式电气连接由面板中的通孔和线形成。然后将不同材料的一部分在隧道内熔化以形成粘结。通过向一个表面添加电隔离的通孔，填充高导热性金属膏，增强了面板的导热性。在两个高导热材料面板之间也引入低导热材料。交替的半导体材料通过在预定导热率的孔内冲压通孔并填充n型和p型浆料而引入到变化的导热层内，或者还可以通过筛选技术和线结构的层压线性或径向扇出图案。面板内的液体通道用于增强热能传递。使用MLC技术将热电器件物理地并入IC封装。

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