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1. 发明申请

US20070002010A1 Opto-electronic input device, method of manufacturing such a device and method of measuring the movement of an object by means of such a device 有权
标题翻译：光电输入装置，制造这种装置的方法以及通过这种装置测量物体运动的方法
公开(公告)号：US20070002010A1
公开(公告)日：2007-01-04
申请号：US10558719
申请日：2004-05-24
申请人： Marc De Samber , Roger Vranken , Johannus Weekamp
发明人： Marc De Samber , Roger Vranken , Johannus Weekamp
IPC分类号： G09G5/00
CPC分类号： G06F3/03547 , G06F3/0421
摘要： The invention relates to an opto-electronic input device (10), wherein the input is formed by detected movements of an object (M), which opto-electronic input device is provided with an optical module (11) comprising at least one laser (1) mounted on a carrier plate (4), which laser emits a radiation beam (S) that is guided to a plate (V) close to the object (M) and, after reflection therefrom, causes a change in the resonant cavity of the laser (1) which is representative of the movement of the object (M), and which is measured within the module (11). According to the invention, the plate (V) close to the object (M) comprises, within a projection of the object (M), a first portion (VI) through which the beam (S) can pass and which has a fixed position with respect to the carrier plate (4), and a second portion (V2) which is movable in a direction perpendicular to the carrier plate (4) and which comprises signal means which, when they are moved, provide a signal that is observable by a user of the device (10). In this way, the device (10) provides feedback to a human user through his tactile sense and preferably also through his auditory sense. The invention also comprises a method of manufacturing such a device and a method of inputting the movement of an object (M) using such a device.
摘要翻译：本发明涉及一种光电输入设备（10），其中通过物体（M）的检测到的移动来形成输入，该光电输入设备设置有包括至少一个激光器的光学模块（11） 1），其安装在载体板（4）上，该激光器发射被引导到靠近物体（M）的板（V）的辐射束（S），并且在其反射之后，谐振腔激光器（1），其代表物体（M）的移动，并且在模块（11）内测量。根据本发明，靠近物体（M）的板（V）在物体（M）的突出部内包括第一部分（VI），梁（S）可以穿过该第一部分（VI）并具有固定位置和相对于承载板（4）的第二部分（V 2），以及在垂直于载板（4）的方向上可移动的第二部分（V 2），并且包括信号装置，当它们被移动时，提供可观察的信号由设备（10）的用户。以这种方式，设备（10）通过他的触觉来优选地通过他的听觉来向人类用户提供反馈。本发明还包括制造这种装置的方法和使用这种装置输入物体（M）的运动的方法。

2. 发明申请

US20070052091A1 Electronic device and method of manufacturing same 审中-公开
标题翻译：电子装置及其制造方法
公开(公告)号：US20070052091A1
公开(公告)日：2007-03-08
申请号：US10539314
申请日：2003-12-15
申请人： Johannus Weekamp , Marc De Samber , Eric Van Grunsven
发明人： Johannus Weekamp , Marc De Samber , Eric Van Grunsven
IPC分类号： H01L23/34 , H01L21/00
CPC分类号： H01L21/568 , H01L21/563 , H01L21/6835 , H01L23/3107 , H01L23/49517 , H01L23/5389 , H01L23/552 , H01L24/36 , H01L24/40 , H01L24/81 , H01L24/84 , H01L2221/68345 , H01L2221/68377 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/16245 , H01L2224/73203 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/37099
摘要： The device of the invention comprises a semiconductor element, a first connection element, a first patterned electrically conductive layer and a second patterned electrically conductive layer. The device is further provided with an encapsulation that encapsulates all except the first conductive layer, which is part of the substrate. The device can be suitably made in that the second conductive layer is provided, in pre-patterned form, with a permeable isolating layer as a foil.
摘要翻译：本发明的器件包括半导体元件，第一连接元件，第一图案化导电层和第二图案化导电层。该器件还设置有封装，除了作为衬底的一部分的第一导电层之外的所有封装。该装置可以适当地制成，其中第二导电层以预先图案化形式设置有作为箔的可渗透隔离层。

3. 发明申请

US20060081572A1 Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this 有权
标题翻译：适用于将由载体支撑的部件转移到基板上的期望位置的方法，以及为此设计的装置
公开(公告)号：US20060081572A1
公开(公告)日：2006-04-20
申请号：US10515470
申请日：2003-05-08
申请人： Johannus Weekamp , Marc De Samber , Johan Bosman , Willem Hoving , Renatus Sanders
发明人： Johannus Weekamp , Marc De Samber , Johan Bosman , Willem Hoving , Renatus Sanders
IPC分类号： B23K26/00
CPC分类号： H05K13/0417 , H01L2221/68354 , H01L2224/95 , Y10T29/4913 , Y10T29/53174
摘要： Method suitable for transferring an electronic component (2′″) supported by a carrier (3) to a desired position on a substrate (1). The carrier supporting the component is moved relative to the substrate whilst the component is present on a side of the carrier facing towards the substrate, until the component is positioned opposite the desired position on teh substrate. Then a light beam (4) is directed at the carrier (3), at the location of the component (2′″), from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.
摘要翻译：适用于将由载体（3）支撑的电子部件（2“）传送到基板（1）上的期望位置的方法。支撑部件的载体相对于基板移动，同时部件存在于载体面向基板的一侧，直到部件被定位成与基板上的期望位置相对。然后，光束（4）从远离基板的一侧引导到载体（3），在部件（2“'）的位置处，由此，部件和载体之间的连接被破坏并且组分从载体转移到基底。

4. 发明申请

US20050117271A1 Electronic device and method of manufacturing same 失效
标题翻译：电子装置及其制造方法
公开(公告)号：US20050117271A1
公开(公告)日：2005-06-02
申请号：US10510304
申请日：2003-04-11
申请人： Marc De Samber , Johannus Weekamp
发明人： Marc De Samber , Johannus Weekamp
IPC分类号： H01L23/12 , B81B7/00 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/057 , H01L23/10 , H01L23/31 , H01L23/36 , H01L23/538 , H03H9/10 , H01G4/228
CPC分类号： H01L24/83 , B81B7/007 , H01L21/568 , H01L21/6835 , H01L23/057 , H01L23/10 , H01L23/3107 , H01L23/36 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/81 , H01L24/82 , H01L2221/68359 , H01L2221/68363 , H01L2224/04105 , H01L2224/05568 , H01L2224/05573 , H01L2224/12105 , H01L2224/13111 , H01L2224/13144 , H01L2224/24227 , H01L2224/29111 , H01L2224/2919 , H01L2224/37599 , H01L2224/73253 , H01L2224/73267 , H01L2224/81801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/15153 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/01007 , H01L2924/01031 , H01L2924/01015 , H01L2924/01049 , H01L2924/0105 , H01L2924/00 , H01L2224/37099
摘要： The electronic device (100) comprises a body (20) with a cavity (30) wherein a semiconductor element (10) and a thermally conductive layer (33) are present. The cavity (30) is filled with an encapsulation (35) of an electrically insulating material wherein contact faces (47, 48) are mechanically anchored.
摘要翻译：电子设备（100）包括具有空腔（30）的主体（20），其中存在半导体元件（10）和导热层（33）。空腔（30）填充有电绝缘材料的封装（35），其中机械地锚定接触面（47,48）。

5. 发明申请

US20050140000A1 Method of manufacturing a semiconductor device and semiconductor device 有权
标题翻译：制造半导体器件和半导体器件的方法
公开(公告)号：US20050140000A1
公开(公告)日：2005-06-30
申请号：US11065564
申请日：2005-02-24
申请人： Johannus Weekamp , Marc De Samber , Durandus Dijken
发明人： Johannus Weekamp , Marc De Samber , Durandus Dijken
IPC分类号： H01L23/28 , H01L21/48 , H01L21/56 , H01L23/051 , H01L23/12 , H01L23/29 , H01L23/31 , H01L23/538 , H01L23/66 , H01L25/065 , H01L21/50 , H01L23/34
CPC分类号： H01L23/3107 , H01L21/56 , H01L23/051 , H01L23/66 , H01L25/0652 , H01L2224/05001 , H01L2224/05022 , H01L2224/051 , H01L2224/05571 , H01L2224/056 , H01L2224/16 , H01L2924/01079 , H01L2924/1423 , H01L2924/00014
摘要： The invention relates to a method of manufacturing a semiconductor device (10), wherein a semiconductor element (1) provided with a number of connection regions (2) is fitted between a first, electroconductive plate (3) and a second plate (4), wherein two connection conductors (3A, 3B) are formed, from the first plate (3), for the two connection regions (2A, 2B) of the element (1), wherein a passivating encapsulation (5) is provided between the plates (3, 4) and around the element (1), and wherein the device (10) is formed by applying a mechanical separating technique in two mutually perpendicular directions (L, M). In a method according to the invention, the connection conductors (3A, 3B) are formed by providing a mask (6) on the first conducting plate (3) in such a manner that a part (3C) of the plate (3) situated between the connection regions (2A, 2B) remains exposed, which part is subsequently removed by etching. Such a method enables a very compact discrete or at least semi-discrete semiconductor device (10) to be readily obtained at low cost, while a high yield is achieved. In a preferred embodiment, also further parts (3D) of the conducting plate (3) situated at the location where the device (10) is to be sawn, cut or broken remain uncovered by the mask (6) and are removed during etching.
摘要翻译：本发明涉及一种制造半导体器件（10）的方法，其中在第一导电板（3）和第二板（4）之间安装设有多个连接区域（2）的半导体元件（1），其中，对于所述元件（1）的两个连接区域（2A，2B），从所述第一板（3）形成两个连接导体（3A，3B），其中钝化封装（5）为设置在板（3,4）之间并且围绕元件（1），并且其中通过在两个相互垂直的方向（L，M）上施加机械分离技术来形成装置（10）。在根据本发明的方法中，连接导体（3A，3B）通过在第一导电板（3）上设置掩模（6）而形成，使得板的部分（3C）位于连接区域（2A，2B）之间的3）保持暴露，随后通过蚀刻去除该部分。这种方法使得能够以低成本容易地获得非常紧凑的离散或至少半分立半导体器件（10），同时实现高产率。在优选实施例中，位于设备（10）将被锯，切割或断裂的位置处的导电板（3）的另外的部分（3D）保持未被掩模（6）覆盖，并且在蚀刻期间被移除。

6. 发明申请

US20060202337A1 Electronic device and use thereof 有权
标题翻译：电子设备及其用途
公开(公告)号：US20060202337A1
公开(公告)日：2006-09-14
申请号：US10540182
申请日：2003-12-22
申请人： Mihai Rotaru , Johannus Weekamp
发明人： Mihai Rotaru , Johannus Weekamp
IPC分类号： H01G4/20
CPC分类号： H01L23/66 , H01L23/3107 , H01L23/4951 , H01L23/49541 , H01L2224/16245 , H01L2224/48245 , H01L2924/3025 , Y10T29/49171
摘要： The electronic device (100) comprises a semiconductor element (1) (e.g. a transistor), an encapsulation (5) and an electrically conductive layer (3) with a first and a second contact pad (11,12), used as signal pads, and a third contact pad (13) used as ground pads. Due to the shape of the contact pads (11,12,13), the spacing (200) is continuous, with a small entrance in between of the first and second contact pads (11,12). Consequently, the parasitic inductance is reduced and the device (100) is suitable for use at frequencies below and above 30 GHz, particularly up to 40 GHz.
摘要翻译：电子设备（100）包括半导体元件（1）（例如晶体管），封装（5）和具有第一和第二接触焊盘（11,12）的导电层（3），用作信号焊盘，以及用作接地焊盘的第三接触焊盘（13）。由于接触焊盘（11,12,13）的形状，间隔（200）是连续的，在第一和第二接触焊盘（11,12）之间具有小的入口。因此，寄生电感减小，并且器件（100）适用于低于和高于30GHz，特别是高达40GHz的频率。

7. 发明申请

US20050237424A1 Device for mobile image communication 审中-公开
标题翻译：移动图像通信设备
公开(公告)号：US20050237424A1
公开(公告)日：2005-10-27
申请号：US10523280
申请日：2003-07-01
申请人： Johannus Weekamp , Fransiscus Gerardus Verweg
发明人： Johannus Weekamp , Fransiscus Gerardus Verweg
IPC分类号： H04M1/00 , H04M1/02 , H04M1/04 , H04M1/21 , H04N5/225
CPC分类号： H04M1/0264 , H04M1/04 , H04N5/2251 , H04N5/2257 , H04N5/2258 , H04N2007/145
摘要： The device for mobile communication comprises a first and a second camera (41, 42), which are faced towards opposite sides of the device (2A, 2C). The cameras (41, 42) each comprise an optical lens (40) and a photosensitive semiconductor device (30). The lens (40) and the semiconductor device (30) are assembled together with a carrier body (2) which is provided with an aperture (20) between the lens (40) and the semiconductor device (30). The carrier body (2) is preferably provided with a pattern of conductive tracks (1) which extends from a first side (2A) to an opposite side (2C) of the body. The two cameras may have the same carrier body (2). The device for mobile communication further comprises a display, means for switching either one of the cameras and the projection of images thereof on the display on or off, as well as means for standing the device on a surface.
摘要翻译：用于移动通信的设备包括面向设备（2A，2C）的相对侧的第一和第二相机（41,42）。相机（41,42）各自包括光学透镜（40）和光敏半导体器件（30）。透镜（40）和半导体器件（30）与在透镜（40）和半导体器件（30）之间设置有孔（20）的载体（2）组装在一起。载体主体（2）优选地设置有从主体的第一侧（2A）延伸到相对侧（2C）的导电轨道（1）的图案。两个摄像机可以具有相同的载体（2）。用于移动通信的装置还包括显示器，用于切换照相机中的任一个的装置，以及在显示器上打开或关闭其图像的投影的装置以及用于在该表面上站立该装置的装置。

8. 发明申请

US20050142917A1 Electrically insulating body, and electronic device 失效
标题翻译：电绝缘体和电子设备
公开(公告)号：US20050142917A1
公开(公告)日：2005-06-30
申请号：US10510302
申请日：2003-04-10
申请人： Fransiscus Gerardus Verweg , Johannus Weekamp
发明人： Fransiscus Gerardus Verweg , Johannus Weekamp
IPC分类号： B81B7/00 , H01L23/10 , H01L23/13 , H01L23/498 , H01L31/0203 , H01L31/0232 , H03H9/10 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/20 , H01R4/60
CPC分类号： B81B7/007 , H01L23/10 , H01L23/4985 , H01L27/14625 , H01L2924/0002 , H05K1/0274 , H05K1/0284 , H05K1/183 , H05K3/06 , H05K3/20 , H05K2201/09063 , H05K2201/09118 , H05K2203/0369 , H05K2203/0376 , H05K2203/302 , H01L2924/00
摘要： The invention relates to an electric insulating body (2) provided with a conductor pattern (1) and an electronic device (10) comprising such a body (2) and at least one electronic element (30). According to the invention, the body (2) has first and second faces (2A, 2B) in between of which an angle of less than 180 degrees is defined, wherein the conductor pattern (1) of the body (2) extends over both faces (2A, 2B), which body (2) carries both the conductor pattern (1) and the electronic element (30). The conductor pattern (1) comprises strip-shaped regions (1A) and regions (1B) with a larger width than the strip-shaped regions (1A), which regions (1B) are suitable for electrically contacting the electronic element (30). The electronic element (30) is, for example, a camera. The device (10) with such a camera is particularly suitable for use in a mobile communication apparatus.
摘要翻译：本发明涉及一种设置有导体图案（1）的电绝缘体（2）和包括这种主体（2）和至少一个电子元件（30）的电子设备（10）。根据本发明，主体（2）具有限定了小于180度的角度的第一和第二面（2A，2B），其中主体（2）的导体图案（1）延伸在两个面（2A，2B）上，该主体（2）承载导体图案（1）和电子元件（30）。导体图案（1）包括条形区域（1A）和宽度大于带状区域（1A）的区域（1B），该区域（1B）适合于电接触电子元件（30）。电子元件（30）例如是相机。具有这种相机的装置（10）特别适用于移动通信装置。

9. 发明申请

US20050117315A1 Method of manufacturing an electronic device 失效
标题翻译：制造电子装置的方法
公开(公告)号：US20050117315A1
公开(公告)日：2005-06-02
申请号：US10510298
申请日：2003-04-10
申请人： Johannus Weekamp
发明人： Johannus Weekamp
IPC分类号： H01L23/12 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/538 , H01L25/00 , H05K1/16 , H01L29/00
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/5389 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/19041
摘要： A semiconductor device (100) comprising a semiconductor substrate (20) and a functional element (31), such as a microstrip, an inductor, a coupler or the like, is provided. Herein the functional element (31) is—at least partially—present in a conductive patterned layer that is mechanically embedded in isolating material (40) and that is connected to the substrate (20) through connection means. In this way, electrical losses through the substrate (20) are substantially reduced. The device (100) is provided in that a foil comprising the patterned layer and a carrier layer is applied to the substrate (20), after which the space between them is filled with the isolating material (40) and the carrier layer is removed.
摘要翻译：提供了包括半导体衬底（20）和诸如微带线，电感器，耦合器等的功能元件（31）的半导体器件（100）。这里，功能元件（31）至少部分地存在于机械地嵌入隔离材料（40）中并且通过连接装置连接到基板（20）的导电图案层中。以这种方式，通过基板（20）的电损耗显着减小。设备（100）的特征在于，将包含图案化层和载体层的箔施加到基板（20）上，然后用隔离材料（40）填充它们之间的空间，并移除载体层。

10. 发明申请

US20070163876A1 Electrowetting cell and method of manufacturing an electrowetting cell 审中-公开
标题翻译：电润湿槽和电润湿槽的制造方法
公开(公告)号：US20070163876A1
公开(公告)日：2007-07-19
申请号：US11568734
申请日：2005-05-03
申请人： Johannus Weekamp
发明人： Johannus Weekamp
IPC分类号： C25C7/00
CPC分类号： G02B26/005 , G02B3/14
摘要： The electrowetting cell (15) comprises an outer wall (90) and an inner wall (80), said outer wall (90) being provided with extensions (85,86) extending on opposing sides of the inner wall (80). The cell (15) is further provided with a membrane (45) for volume expansion and is sealed through an electroplated layer (95).
摘要翻译：电润湿池（15）包括外壁（90）和内壁（80），所述外壁（90）设置有在内壁（80）的相对侧上延伸的延伸部（85,86）。电池（15）还具有用于体积膨胀的膜（45），并通过电镀层（95）密封。

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