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1. 发明申请

US20080153282A1 METHOD FOR PREPARING A METAL FEATURE SURFACE 审中-公开
标题翻译：制备金属特征表面的方法
公开(公告)号：US20080153282A1
公开(公告)日：2008-06-26
申请号：US11614185
申请日：2006-12-21
申请人： Manoj K. Jain , Tae S. Kim , Stephan Grunow
发明人： Manoj K. Jain , Tae S. Kim , Stephan Grunow
IPC分类号： H01L21/02
CPC分类号： H01L23/53238 , H01L21/02063 , H01L21/02068 , H01L21/76814 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
摘要： Provided is a method for manufacturing an interconnect. The method for manufacturing the interconnect, in one embodiment, includes forming a first metal feature over or within a substrate, the first metal feature having an exposed surface. The method for manufacturing the interconnect may additionally include cleaning the exposed surface using a reactive system with a reducing agent, and subjecting the exposed surface to a plasma etch. The method for manufacturing the interconnect may further include contacting the first metal feature with a second metal feature.
摘要翻译：提供一种制造互连的方法。在一个实施例中，用于制造互连的方法包括在衬底上或衬底内形成第一金属特征，第一金属特征具有暴露表面。用于制造互连的方法可以另外包括使用具有还原剂的反应系统清洁暴露的表面，以及对暴露的表面进行等离子体蚀刻。用于制造互连的方法还可以包括使第一金属特征与第二金属特征接触。

2. 发明授权

US08779485B2 Hydrogen barrier for ferroelectric capacitors 有权
公开(公告)号：US08779485B2
公开(公告)日：2014-07-15
申请号：US13480044
申请日：2012-05-24
申请人： Kezhakkedath R. Udayakumar , Scott R. Summerfelt , Ted S. Moise , Manoj K. Jain
发明人： Kezhakkedath R. Udayakumar , Scott R. Summerfelt , Ted S. Moise , Manoj K. Jain
IPC分类号： H01L21/02 , H01L23/48 , H01L21/768 , H01L49/02 , H01L27/115
CPC分类号： H01L21/76843 , H01L27/11509 , H01L28/57
摘要： An integrated circuit containing a FeCap array. The FeCap array is at least partially surrounded on the sides by hydrogen barrier walls and on the top by a hydrogen barrier top plate. A method for at least partially enclosing a FeCap array with hydrogen barrier walls and a hydrogen barrier top plate.

3. 发明申请

US20120110123A1 ENABLING ROUTING OF DATA ON A NETWORK BASED ON A PORTION OF DATA ACCESSED FROM A NON-NETWORK ENABLED DEVICE 有权
标题翻译：基于从非网络启用的设备访问的数据部分，在网络上启用数据路由
公开(公告)号：US20120110123A1
公开(公告)日：2012-05-03
申请号：US13346225
申请日：2012-01-09
申请人： Manoj K. Jain , Srinivasulu Grandhi , Ananda Sarkar
发明人： Manoj K. Jain , Srinivasulu Grandhi , Ananda Sarkar
IPC分类号： G06F15/16
CPC分类号： H04L29/08846 , H04L45/04 , H04L67/28 , H04L67/327 , H04L69/08 , H04N1/00241 , H04N1/32112 , H04N2201/002
摘要： A system and method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device is disclosed. The technology includes a method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device. The method includes detecting a non-network enabled device locally coupled to a first computer system, the first computer system coupled to the network. The method further includes enabling routing of data through the non-network enabled device to a second computer system coupled to the network by using the first computer system as a communication interface between the non-network enabled device and the second computer system wherein the second computer system is automatically identified based on recognizing a portion of the data as a routing destination.
摘要翻译：公开了一种用于基于从非网络使能设备访问的一部分数据在网络上进行数据路由的系统和方法。该技术包括一种基于从非网络使能设备访问的数据的一部分来实现网络上的数据路由的方法。该方法包括检测本地耦合到第一计算机系统的非网络使能设备，第一计算机系统耦合到网络。该方法还包括通过使用第一计算机系统作为非网络启用设备和第二计算机系统之间的通信接口，使得能够通过非网络使能设备将数据路由到耦合到网络的第二计算机系统，其中第二计算机基于将一部分数据识别为路由目的地，自动识别系统。

4. 发明申请

US20100155949A1 LOW COST PROCESS FLOW FOR FABRICATION OF METAL CAPPING LAYER OVER COPPER INTERCONNECTS 审中-公开
标题翻译：低成本工艺流程用于铜箔互连制造金属覆盖层
公开(公告)号：US20100155949A1
公开(公告)日：2010-06-24
申请号：US12343915
申请日：2008-12-24
申请人： Manoj K. Jain
发明人： Manoj K. Jain
IPC分类号： H01L23/52 , H01L21/4763
CPC分类号： H01L24/03 , H01L21/76838 , H01L23/53238 , H01L24/05 , H01L2224/02166 , H01L2224/04042 , H01L2224/05006 , H01L2224/05546 , H01L2224/05556 , H01L2224/05599 , H01L2224/45144 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/10329 , H01L2924/14 , H01L2924/19041 , H01L2224/48
摘要： Semiconductor devices and methods are disclosed for improving electrical connections to integrated circuits. A process flow and device with a dual/single damascene interconnect structure overlying an existing interconnect structure in a semiconductor wafer is provided. A capping layer is formed thereon that comprises nickel/palladium layers within a bond pad opening. The layers are polished using a chemical mechanical polishing (CMP) technique so that the capping layers are within the opening.
摘要翻译：公开了用于改善与集成电路的电连接的半导体器件和方法。提供了具有覆盖半导体晶片中的现有互连结构的双/单镶嵌互连结构的工艺流程和器件。在其上形成包覆层，其在接合焊盘开口内包含镍/钯层。使用化学机械抛光（CMP）技术对层进行抛光，使得封盖层在开口内。

5. 发明申请

US20120112343A1 ELECTROPLATED POSTS WITH REDUCED TOPOGRAPHY AND STRESS 有权
标题翻译：具有减少的地形和应力的电镀位置
公开(公告)号：US20120112343A1
公开(公告)日：2012-05-10
申请号：US13288161
申请日：2011-11-03
申请人： Manoj K. Jain , Sreenivasan Koduri
发明人： Manoj K. Jain , Sreenivasan Koduri
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02163 , H01L2224/0401 , H01L2224/05541 , H01L2224/05552 , H01L2224/05567 , H01L2224/11462 , H01L2224/1147 , H01L2224/13147 , H01L2924/00013 , H01L2924/01029 , H01L2924/14 , H01L2924/00014 , H01L2924/00012 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three sides of the planarizing dielectric structures. The planarizing dielectric structures can be used on integrated circuits having bond pads of different sizes to electroplate metal posts having the same height.
摘要翻译：集成电路上的接合焊盘设置有平坦化电介质结构，以允许具有平坦顶表面的金属柱的电镀。金属柱与平坦化电介质结构的至少三面接触。平面化电介质结构可以用于具有不同尺寸的接合焊盘的集成电路以电镀具有相同高度的金属柱。

6. 发明授权

US08107469B2 Enabling routing of data on a network based on a portion of data accessed from a non-network enabled device 有权
标题翻译：基于从非网络启用的设备访问的数据的一部分，启用网络上的数据路由
公开(公告)号：US08107469B2
公开(公告)日：2012-01-31
申请号：US11724383
申请日：2007-03-15
申请人： Manoj K. Jain , Srinivasulu Grandhi , Ananda Sarkar
发明人： Manoj K. Jain , Srinivasulu Grandhi , Ananda Sarkar
IPC分类号： H04L12/18 , H04L12/56
CPC分类号： H04L29/08846 , H04L45/04 , H04L67/28 , H04L67/327 , H04L69/08 , H04N1/00241 , H04N1/32112 , H04N2201/002
摘要： A system and method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device is disclosed. The technology includes a method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device. The method includes detecting a non-network enabled device locally coupled to a first computer system, the first computer system coupled to the network. The method further includes enabling routing of data through the non-network enabled device to a second computer system coupled to the network by using the first computer system as a communication interface between the non-network enabled device and the second computer system wherein the second computer system is automatically identified based on recognizing a portion of the data as a routing destination.
摘要翻译：公开了一种用于基于从非网络使能设备访问的一部分数据在网络上进行数据路由的系统和方法。该技术包括一种基于从非网络使能设备访问的数据的一部分来实现网络上的数据路由的方法。该方法包括检测本地耦合到第一计算机系统的非网络使能设备，第一计算机系统耦合到网络。该方法还包括通过使用第一计算机系统作为非网络启用设备和第二计算机系统之间的通信接口，使得能够通过非网络使能设备将数据路由到耦合到网络的第二计算机系统，其中第二计算机基于将一部分数据识别为路由目的地，自动识别系统。

7. 发明申请

US20110072520A1 System And Method For Protecting Files Stored On An Electronic Device 有权
标题翻译：用于保护存储在电子设备上的文件的系统和方法
公开(公告)号：US20110072520A1
公开(公告)日：2011-03-24
申请号：US12903045
申请日：2010-10-12
申请人： Apurva M. Bhansali , Manoj K. Jain , Shradha Dube , Gayathri Krishnamurthy Iyer , Mehul R. Patel , Rayesh K. Raikar , Kamal M. Dhanani , Ranjit Kapila , Elza A. Varghese , Thomas D. Tucker
发明人： Apurva M. Bhansali , Manoj K. Jain , Shradha Dube , Gayathri Krishnamurthy Iyer , Mehul R. Patel , Rayesh K. Raikar , Kamal M. Dhanani , Ranjit Kapila , Elza A. Varghese , Thomas D. Tucker
IPC分类号： G06F21/00
CPC分类号： G06F21/88 , G06F21/305 , G06F21/31 , G06F21/572 , G06F21/602 , G06F21/6218 , G06F2221/2143 , G06F2221/2149
摘要： An electronic device includes a security system which provides for protection of designated files stored on an electronic device. For example, an electronic device may receive user input selecting a file for protection processing. The user input may select the file for encryption and automatic decryption under certain predetermined conditions and/or for automatic saving to a remote storage device after the device has been reported stolen, for instance. After receiving the user input selecting the file for protection processing, the electronic device may automatically receive theft information from a remote server, wherein the theft information indicates whether the electronic device has been reported stolen. After determining whether the electronic device has been reported stolen, the electronic device may automatically process the selected file according to the selected protection processing, wherein the processing is contingent on whether the electronic device has been reported stolen. Other embodiments are described and claimed.
摘要翻译：一种电子设备包括提供保护存储在电子设备上的指定文件的安全系统。例如，电子设备可以接收选择用于保护处理的文件的用户输入。例如，用户输入可以在某些预定条件下选择用于加密的文件和自动解密，和/或在设备被报告被盗后自动保存到远程存储设备。电子设备在接收到选择用于保护处理的文件的用户输入之后，可以从远程服务器自动接收盗窃信息，其中盗窃信息指示电子设备是否已被报告被盗。在确定电子设备是否被报告被盗之后，电子设备可以根据所选择的保护处理来自动处理所选择的文件，其中处理取决于电子设备是否被报告为被盗。描述和要求保护其他实施例。

8. 发明申请

US20120228739A1 HYDROGEN BARRIER FOR FERROELECTRIC CAPACITORS 有权
标题翻译：用于电容器的氢阻隔器
公开(公告)号：US20120228739A1
公开(公告)日：2012-09-13
申请号：US13480044
申请日：2012-05-24
申请人： Kezhakkedath R. Udayakumar , Scott R. Summerfelt , Ted S. Moise , Manoj K. Jain
发明人： Kezhakkedath R. Udayakumar , Scott R. Summerfelt , Ted S. Moise , Manoj K. Jain
IPC分类号： H01L29/92
CPC分类号： H01L21/76843 , H01L27/11509 , H01L28/57
摘要： An integrated circuit containing a FeCap array. The FeCap array is at least partially surrounded on the sides by hydrogen barrier walls and on the top by a hydrogen barrier top plate. A method for at least partially enclosing a FeCap array with hydrogen barrier walls and a hydrogen barrier top plate.
摘要翻译：包含FeCap阵列的集成电路。 FeCap阵列在侧面至少部分地被氢阻挡壁包围，并且在顶部被氢阻挡顶板包围。一种用于至少部分地封闭具有氢阻挡壁和氢阻挡顶板的FeCap阵列的方法。

9. 发明授权

US08077855B2 Enhanced addressing for fax recipients 有权
标题翻译：传真收件人增强寻址
公开(公告)号：US08077855B2
公开(公告)日：2011-12-13
申请号：US11279214
申请日：2006-04-10
申请人： Vibha Rathi , Manoj K. Jain , Suryanarayana Shastri , Archan Das
发明人： Vibha Rathi , Manoj K. Jain , Suryanarayana Shastri , Archan Das
IPC分类号： H04M1/00 , H04M3/00
CPC分类号： H04L12/66
摘要： A rich, robust fax addressing experience is provided for users. In some embodiments, multiple different ways of addressing a fax and related functionality are exposed to a user and work seamlessly together to give a compelling addressing experience. In some embodiments, a fax application can resolve recipient names and/or numbers. Additionally, a user can type in a fax number and have that number resolved as a valid number. Further, some embodiments can provide a user interface that is designed to help a user compose a fax number, thus ensuring that the number is in the proper format. In some embodiments, the fax application can allow the user to choose from among a number of different address books and then employ the chosen address book in the fax addressing experience.
摘要翻译：为用户提供丰富而强大的传真寻址体验。在一些实施例中，寻址传真和相关功能的多种不同方式暴露给用户，并且无缝地工作在一起以产生令人信服的寻址体验。在一些实施例中，传真应用程序可以解析接收者姓名和/或号码。此外，用户可以键入传真号码，并将该号码解析为有效号码。此外，一些实施例可以提供被设计为帮助用户组成传真号码的用户接口，从而确保号码是正确的格式。在一些实施例中，传真应用程序可以允许用户从多个不同的地址簿中进行选择，然后在传真寻址体验中使用所选择的地址簿。

10. 发明申请

US20080225828A1 Enabling routing of data on a network 审中-公开
标题翻译：启用网络上的数据路由
公开(公告)号：US20080225828A1
公开(公告)日：2008-09-18
申请号：US11724385
申请日：2007-03-15
申请人： Manoj K. Jain , Srinivasulu Grandhi
发明人： Manoj K. Jain , Srinivasulu Grandhi
IPC分类号： H04L12/28
CPC分类号： H04L45/00
摘要： A system and method for enabling routing of data on a network is disclosed. The technology includes a method for enabling routing of data from a non-network enabled devices on a network. The method includes detecting a non-network enabled device locally coupled to a first computer system, the first computer system coupled to the network. The method for enabling sharing of non-network enabled devices on a network also includes enabling a second computer system coupled to the network to access the non-network enabled device by using the first computer system as a communication interface between the non-network enabled device and the second computer system.
摘要翻译：公开了一种用于在网络上进行数据路由的系统和方法。该技术包括一种用于启用来自网络上的非网络启用设备的数据路由的方法。该方法包括检测本地耦合到第一计算机系统的非网络使能设备，第一计算机系统耦合到网络。用于在网络上启用非网络启用设备的共享的方法还包括使得与网络耦合的第二计算机系统能够通过使用第一计算机系统作为非网络使能设备之间的通信接口来访问非网络使能设备和第二台计算机系统。

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