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    • 1. 发明授权
    • Chip-type capacitor, method of manufacturing the same and molding die
    • 片式电容器,其制造方法和成型模具
    • US06882521B2
    • 2005-04-19
    • US10738863
    • 2003-12-16
    • Makoto TsutsuiToshihisa Nagasawa
    • Makoto TsutsuiToshihisa Nagasawa
    • H01G4/228H01G2/06H01G9/00H01G9/004H01G9/008H01G9/012H01G9/042H01G9/08H01G9/10H01G13/00
    • H01G9/012H01G2/065H01G9/042H01G9/10Y10T29/417
    • A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.
    • 芯片型电容器包括电容器元件,覆盖整个电容器元件的封装树脂,阳极端子,底部表面暴露在封装树脂的安装表面上的基部和垂直于该电容元件的竖直部分 基部,其一端连接到基部,另一端焊接到从电容器元件引出的阳极引线,以及阴极端子,其通过导电粘合剂固定到电容器元件,以暴露在电容器元件上的底表面 封装树脂的安装表面。 在封装树脂的相对侧面的每一侧形成有凹部,从而部分露出与底面相反的阳极和阴极端子的上表面,形成从封装树脂露出的端子露出部。