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    • 6. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08247873B2
    • 2012-08-21
    • US12621965
    • 2009-11-19
    • Shinji Takeoka
    • Shinji Takeoka
    • H01L29/76
    • H01L21/823468H01L21/823864H01L29/6656H01L29/6659H01L29/7833
    • A semiconductor device includes a first MISFET and a second MISFET, wherein the first MISFET includes a semiconductor substrate 100, a first gate insulating film 101a and a first gate electrode 102a formed on the first region of the semiconductor substrate, and first side walls (103a, 120a) formed on the side surface of the first gate electrode 102a, and the second MISFET includes a second gate insulating film 101b and a second gate electrode 102b formed on the second region of the semiconductor substrate 100, and second side walls (103b, 120b) formed on the side surface of the second gate electrode 102b. The width of the first side wall is smaller than the width of the second side wall, and the second side wall includes the second spacer 103b containing a higher concentration of hydrogen than the first spacer 103a.
    • 半导体器件包括第一MISFET和第二MISFET,其中第一MISFET包括形成在半导体衬底的第一区域上的半导体衬底100,第一栅极绝缘膜101a和第一栅电极102a以及第一侧壁(103a ,120a),并且第二MISFET包括形成在半导体衬底100的第二区域上的第二栅极绝缘膜101b和第二栅极电极102b,以及第二侧壁(103b, 120b)形成在第二栅电极102b的侧表面上。 第一侧壁的宽度小于第二侧壁的宽度,并且第二侧壁包括含有比第一间隔件103a更高浓度的氢的第二间隔件103b。