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1. 发明申请

US20130077321A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20130077321A1
公开(公告)日：2013-03-28
申请号：US13587699
申请日：2012-08-16
申请人： Makoto Sato , Satoshi Ota , Masakata Koseki
发明人： Makoto Sato , Satoshi Ota , Masakata Koseki
IPC分类号： F21V7/00
CPC分类号： H01L33/60 , H01L2933/0033
摘要： A light emitting device, comprises a LED chip, and a case having an accommodating recession accommodating the LED chip, wherein the light emitting device emits light from an opening portion of the accommodating recession, the case is monolithically formed by injection molding of a resin composition preparing by mixing fine grains of specular reflection material and glass fibers as diffusion reflecting material as fillers therein, an inner surface of a side wall portion of the case works as a reflector that reflects the light emitted from the LED chip so that the light is output from the opening portion, and a thickness of the side wall portion is selected to be smaller than an average length of the glass fibers.
摘要翻译：一种发光装置，包括LED芯片和具有容纳LED芯片的容纳凹部的壳体，其中，所述发光装置从所述容纳凹部的开口部发射光，所述壳体通过树脂组合物的注射成型而整体地形成通过将镜面反射材料和玻璃纤维的细晶粒作为扩散反射材料作为填料来制备，壳体的侧壁部分的内表面用作反射从LED芯片发射的光以使得光输出的反射器从所述开口部开始，所述侧壁部的厚度选择为小于所述玻璃纤维的平均长度。

2. 发明授权

US08669584B2 Light emitting device including a case having an accommodating recession 有权
标题翻译：发光装置包括具有容纳凹陷的壳体
公开(公告)号：US08669584B2
公开(公告)日：2014-03-11
申请号：US13587699
申请日：2012-08-16
申请人： Makoto Sato , Satoshi Ota , Masakata Koseki
发明人： Makoto Sato , Satoshi Ota , Masakata Koseki
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L2933/0033
摘要： A light emitting device, comprises a LED chip, and a case having an accommodating recession accommodating the LED chip, wherein the light emitting device emits light from an opening portion of the accommodating recession, the case is monolithically formed by injection molding of a resin composition preparing by mixing fine grains of specular reflection material and glass fibers as diffusion reflecting material as fillers therein, an inner surface of a side wall portion of the case works as a reflector that reflects the light emitted from the LED chip so that the light is output from the opening portion, and a thickness of the side wall portion is selected to be smaller than an average length of the glass fibers.
摘要翻译：一种发光装置，包括LED芯片和具有容纳LED芯片的容纳凹部的壳体，其中，所述发光装置从所述容纳凹部的开口部发射光，所述壳体通过树脂组合物的注射成型通过将镜面反射材料和玻璃纤维的细晶粒作为扩散反射材料作为填料来制备，壳体的侧壁部分的内表面用作反射从LED芯片发射的光以使得光输出的反射器从所述开口部开始，所述侧壁部的厚度选择为小于所述玻璃纤维的平均长度。

3. 发明申请

US20100025709A1 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US20100025709A1
公开(公告)日：2010-02-04
申请号：US12458827
申请日：2009-07-23
申请人： Masakata Koseki , Eiki Kawano
发明人： Masakata Koseki , Eiki Kawano
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L2224/04042 , H01L2224/16245 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014
摘要： A light emitting device includes a light emitting element, a sealing material for sealing the light emitting element, a first filler included in the sealing material, and a second filler included in the sealing material. The second filler includes a particle diameter smaller than that of the first filler.
摘要翻译：发光器件包括发光元件，用于密封发光元件的密封材料，包含在密封材料中的第一填料和包含在密封材料中的第二填料。第二填料包括小于第一填料的粒径。

4. 发明申请

US20080296605A1 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US20080296605A1
公开(公告)日：2008-12-04
申请号：US12155107
申请日：2008-05-29
申请人： Hiroaki Oshio , Kazuhiro Tamura , Masakata Koseki , Hiroko Tsukamoto , Tatsuichiro Maki
发明人： Hiroaki Oshio , Kazuhiro Tamura , Masakata Koseki , Hiroko Tsukamoto , Tatsuichiro Maki
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.
摘要翻译：发光装置包括：树脂壳体，其具有在壳体的凹部的底部露出的，具有围绕发光元件的反射器部分的凹部，由金属形成的第一引线和第二引线，在预定方向上彼此远离，并且填充在凹部中的树脂密封材料。第一引线包括发光元件安装部分，第一引线连接部分，第一泄漏防止凹口和相对的凹口。第二引线包括保护装置安装部分，第二导线连接部分和第二防止漏出凹口。第一引线和第二引线被布置成使得在预定方向上，发光元件安装部分与第二防止泄漏槽相对，第一引线连接部分与保护装置安装部分相对，并且相对的槽口与第二线连接部分相对。

5. 发明授权

US07888699B2 Light emitting device including bleed-out preventing notches 有权
标题翻译：发光装置，包括防止漏出的渗漏
公开(公告)号：US07888699B2
公开(公告)日：2011-02-15
申请号：US12155107
申请日：2008-05-29
申请人： Hiroaki Oshio , Kazuhiro Tamura , Masakata Koseki , Hiroko Tsukamoto , Tatsuichiro Maki
发明人： Hiroaki Oshio , Kazuhiro Tamura , Masakata Koseki , Hiroko Tsukamoto , Tatsuichiro Maki
IPC分类号： H01L33/48
CPC分类号： H01L25/167 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.
摘要翻译：发光装置包括：树脂壳体，其具有在壳体的凹部的底部露出的，具有围绕发光元件的反射器部分的凹部，由金属形成的第一引线和第二引线，在预定方向上彼此远离，并且填充在凹部中的树脂密封材料。第一引线包括发光元件安装部分，第一引线连接部分，第一泄漏防止凹口和相对的凹口。第二引线包括保护装置安装部分，第二导线连接部分和第二防止漏出凹口。第一引线和第二引线被布置成使得在预定方向上，发光元件安装部分与第二防止泄漏槽相对，第一引线连接部分与保护装置安装部分相对，并且相对的槽口与第二线连接部分相对。

6. 发明授权

US08242524B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08242524B2
公开(公告)日：2012-08-14
申请号：US12458827
申请日：2009-07-23
申请人： Masakata Koseki , Eiki Kawano
发明人： Masakata Koseki , Eiki Kawano
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L2224/04042 , H01L2224/16245 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014
摘要： A light emitting device includes a light emitting element, a sealing material for sealing the light emitting element, a first filler included in the sealing material, and a second filler included in the sealing material. The second filler includes a particle diameter smaller than that of the first filler.
摘要翻译：发光器件包括发光元件，用于密封发光元件的密封材料，包含在密封材料中的第一填料和包含在密封材料中的第二填料。第二填料包括小于第一填料的粒径。

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