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1. 发明授权

US4976393A Semiconductor device and production process thereof, as well as wire bonding device used therefor 失效
标题翻译：半导体装置及其制造方法以及使用的引线接合装置
公开(公告)号：US4976393A
公开(公告)日：1990-12-11
申请号：US134458
申请日：1987-12-17
申请人： Makoto Nakajima , Yoshio Ohashi , Toshio Chuma , Kazuo Hatori , Isao Araki , Masahiro Koizumi , Jin Onuki , Hitoshi Suzuki , Susumu Okikawa
发明人： Makoto Nakajima , Yoshio Ohashi , Toshio Chuma , Kazuo Hatori , Isao Araki , Masahiro Koizumi , Jin Onuki , Hitoshi Suzuki , Susumu Okikawa
IPC分类号： B23K20/00 , H01L21/00
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73265 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85099 , H01L2224/851 , H01L2224/85181 , H01L2224/85205 , H01L2224/85424 , H01L2224/92247 , H01L24/45 , H01L24/73 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01204 , H01L2924/01205 , H01L2924/10253 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H01L2924/3025
摘要： The present invention concerns a semiconductor device and a process for producing semiconductor device, as well as a wire bonding device used therefor.In accordance with the present invention, a ball formed at the top end of a bonding wire is sphericalized by electric discharge within a reducing gas atmosphere at a high temperature from 100.degree. C. to 200.degree. C. By using the ball of the bonding wire formed under such a condition to the bonding of the bonding pad of a semiconductor pellet, it is possible to conduct highly reliable ball bonding with excellent bondability and with no development of cracks or the like in the semiconductor pellet, as well as to obtain a highly reliable semiconductor device, that is, LSI or IC.

2. 发明授权

US5559678A Electronic device housing 失效
标题翻译：电子设备外壳
公开(公告)号：US5559678A
公开(公告)日：1996-09-24
申请号：US542350
申请日：1995-10-12
申请人： Hirofumi Fukuda , Kazuo Hatori , Kazumi Yamada , Toshiaki Nogiri , Kozo Mori
发明人： Hirofumi Fukuda , Kazuo Hatori , Kazumi Yamada , Toshiaki Nogiri , Kozo Mori
IPC分类号： H05K5/00 , H05K5/02 , H05K7/14 , H05K9/00
CPC分类号： H05K9/0062 , H05K7/1425
摘要： A box-shaped rack forming an electronic device housing has a plurality of guide grooves for guiding upper and lower edges of electronic circuit packages. A plurality of dummy surface plates are pivotably mounted on a front opening portion of the rack and arranged side by side. Each dummy surface plate is biased by a spring, so that when the electronic circuit package is not inserted in the rack, the dummy surface plate is kept in abutment against the inner surface of the rack to shield a part of the front opening portion of the rack. When the electronic circuit package is inserted into the rack, the dummy surface plate is pushed by the electronic circuit package to pivot inward of the rack, and is finally replaced in position by the package surface plate mounted on the electronic circuit package. When the electronic circuit package is removed from the rack, the dummy surface plate is reversely pivoted to restore an original position and again shield the part of the front opening portion of the rack. Accordingly, even when the electronic circuit package is inserted or exchanged during the operation of the electronic device, the occurrence of electromagnetic interference and the reduction in cooling efficiency can be prevented to thereby improve the efficiency of working such as exchanging of the electronic circuit package.
摘要翻译：形成电子设备壳体的盒形齿条具有用于引导电子电路封装的上边缘和下边缘的多个引导槽。多个虚拟表面板可枢转地安装在齿条的前开口部分并排设置。每个虚拟表面板被弹簧偏压，使得当电子电路封装未插入到支架中时，虚拟表面板保持抵靠在机架的内表面上，以遮蔽架。当电子电路封装被插入到机架中时，虚拟表面板被电子电路封装件推动以使其枢转到支架的内部，并且最终被安装在电子电路封装上的封装表面板替换。当将电子电路封装从机架中取出时，虚拟表面板反向枢转以恢复原始位置，并再次屏蔽机架前部开口部分的一部分。因此，即使在电子设备的操作期间插入或更换电子电路封装时，也可以防止电磁干扰的发生和冷却效率的降低，从而提高诸如电子电路封装的更换的工作效率。

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