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    • 8. 发明申请
    • METHOD FOR PRODUCING LIGHT EMITTING DIODE DEVICE
    • 用于生产发光二极管器件的方法
    • US20130048209A1
    • 2013-02-28
    • US13597341
    • 2012-08-29
    • Yasunari OOYABUHiroyuki KatayamaDaisuke TsukaharaMunehisa Mitani
    • Yasunari OOYABUHiroyuki KatayamaDaisuke TsukaharaMunehisa Mitani
    • H01L33/00
    • H01L33/52H01L2933/005
    • A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate.
    • 一种发光二极管器件的制造方法,其特征在于,具有如下工序:在厚度方向上形成有依次层叠的支撑层,约束层和密封树脂层。 将层压体中的封装树脂层和约束层切割成对应于发光二极管元件的图案; 去除与切割成图案的封装树脂层和约束层中的发光二极管元件不对应的部分; 使与发光二极管元件相对应的封装树脂层与发光二极管元件相对,以使它们彼此靠近的方向被按压,以便通过封装树脂层封装发光二极管元件; 并从层叠体上除去支撑层和约束层。