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    • 5. 发明申请
    • GARMENT INTEGRATED ELECTRICAL INTERFACE SYSTEM AND METHOD OF MANUFACTURE
    • 服装集成电接口系统及其制造方法
    • US20160270727A1
    • 2016-09-22
    • US14869398
    • 2015-09-29
    • Mad Apparel, Inc.
    • James Artel BergGaston MacMillanChris GlaisterWesley GroomLiang Yao
    • A61B5/00A61B5/0402H01R12/77A61B5/0488A61B5/0205H05K1/11A61B5/0476
    • A61B5/6804A61B5/0006A61B5/0024A61B5/02055A61B5/04A61B5/0402A61B5/0476A61B5/0488A61B5/1118A61B5/7203A61B2562/125A61B2562/227D05D2303/40H01R12/774H01R2201/20H05K1/116
    • A system for electrically coupling a garment to a mating object and manufacture method thereof, the system comprising: a fabric interlayer of the garment including a set of ports; an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and including a set of vias through a thickness of the electronics substrate, aligned with the set of ports, and a set of contacts at a second surface opposing the first surface; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and including a set of holes aligned with the set of vias and the set of ports, as well as a set of openings that correspond to and receive portions of the set of contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners that 1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount assembly by way of the set of ports, the set of vias, and the set of holes in supporting a waterproof seal, and 2) electrically couple the set of embedded ports to the set of vias.
    • 一种用于将衣服电耦合到配合对象的系统及其制造方法,所述系统包括:衣服的织物中间层,包括一组端口; 电子基板,其具有与所述织物中间层的第二侧相邻的第一表面,并且包括通过与所述一组端口对准的所述电子基板的厚度的一组通孔,以及在与所述第一表面相对的第二表面处的一组触点 ; 安装组件,其具有与电子基板的第二表面相邻的第三表面,并且包括与该组通孔和该组端口对准的一组孔,以及对应于并接收该组的一部分的一组开口 以及与所述第三表面相对的第四表面,并且限定被配置成将所述配合对象接收并电接触所述电子基板的空腔; 以及一组紧固件,其通过一组端口,一组通孔和一组支撑防水密封的孔来压缩背板,织物中间层,电子基板和安装组件,以及 2)将一组嵌入式端口电耦合到一组通孔。