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    • 1. 发明申请
    • RESISTANCE RANDOM ACCESS MEMORY, OPERATING METHOD THEREOF AND OPERATING SYSTEM THEREOF
    • 电阻随机存取存储器,其操作方法及其操作系统
    • US20160372195A1
    • 2016-12-22
    • US14838478
    • 2015-08-28
    • MACRONIX INTERNATIONAL CO., LTD.
    • Chao-I WuTien-Yen Wang
    • G11C13/00
    • G11C13/0069G11C13/0064G11C2013/0066G11C2013/0078G11C2013/009G11C2013/0092G11C2213/79
    • An operating method, an operating system and a resistance random access memory (ReRAM) are provided. The operating method includes the following steps. A write voltage and a write current are set at a first predetermined voltage value and a first predetermined current value respectively. The write voltage and the write current are applied to a memory cell of the ReRAM for writing. Whether the write current reaches a second predetermined current value is verified, if a read current of the memory cell is not within a predetermined current range. The write current is increased, if the write current does not reach the second predetermined current value. Whether the write voltage reaches a second predetermined voltage value is verified, if the write current reaches the second predetermined current value. The write voltage is increased, if the write voltage does not reach the second predetermined voltage value.
    • 提供操作方法,操作系统和电阻随机存取存储器(ReRAM)。 操作方法包括以下步骤。 写入电压和写入电流分别设定在第一预定电压值和第一预定电流值。 写入电压和写入电流被施加到用于写入的ReRAM的存储单元。 如果存储单元的读取电流不在预定电流范围内,则验证写入电流是否达到第二预定电流值。 如果写入电流未达到第二预定电流值,则写入电流增加。 验证写入电压是否达到第二预定电压值,如果写入电流达到第二预定电流值。 如果写入电压未达到第二预定电压值,则写入电压增加。
    • 2. 发明授权
    • Multiple phase change materials in an integrated circuit for system on a chip application
    • 用于芯片应用系统的集成电路中的多相变材料
    • US09336879B2
    • 2016-05-10
    • US14603647
    • 2015-01-23
    • MACRONIX INTERNATIONAL CO., LTD.
    • Hsiang-Lan LungChao-I WuWei-Chih Chien
    • H01L21/8242G11C13/00H01L45/00
    • G11C13/0069G11C13/0004G11C13/0064H01L45/06H01L45/144
    • A device includes first and second pluralities of memory cells with memory elements and first and second capping materials on the first and second pluralities of memory cells. First and second capping materials can comprise lower and higher density silicon nitrides. The memory elements can include a programmable resistance memory material, and the capping materials can contact the memory elements. The first and second pluralities of memory cells can have a common cell structure. The first memory cells in the can comprise a top and bottom electrodes with a memory material therebetween and the first capping material contacting the memory material. Control circuits can apply different write algorithms to the first and second pluralities of memory cells. The first and second sets of memory cells can have different operational memory characteristics by forming the first and second capping layers using different capping materials but with the same cell structure.
    • 一种装置包括具有存储元件的第一和第二多个存储单元,以及在第一和第二多个存储单元上的第一和第二封盖材料。 第一和第二封盖材料可以包括较低和较高密度的氮化硅。 存储器元件可以包括可编程电阻存储器材料,并且封盖材料可以接触存储器元件。 第一和第二多个存储器单元可以具有公共的单元结构。 罐中的第一存储器单元可以包括顶部和底部电极,其间具有记忆材料,并且第一封盖材料与记忆材料接触。 控制电路可以对第一和第二多个存储单元应用不同的写入算法。 通过使用不同的封盖材料但是具有相同的单元结构形成第一和第二封盖层,第一和第二组存储器单元可以具有不同的操作存储器特性。
    • 3. 发明授权
    • Method and apparatus for healing phase change memory devices
    • 用于治愈相变存储器件的方法和装置
    • US09336878B2
    • 2016-05-10
    • US14566453
    • 2014-12-10
    • Macronix International Co., Ltd.
    • Win San KhwaChao-I WuTzu-Hsiang SuHsiang-Pang Li
    • G11C13/00G11C11/56
    • G11C13/0097G11C11/5614G11C11/5678G11C13/0004G11C13/0021G11C13/0033G11C13/0069G11C29/50008G11C2213/79G11C2213/82
    • A first memory cell including a phase change material. The first memory cell is programmable to store one data value of a plurality of data values. The plurality of data values are represented by a plurality of non-overlapping ranges of resistance of the first memory cell. At least one testing pulse is applied to the first memory cell to establish a cell resistance of the first memory cell in an intermediate range of resistance, the intermediate range of resistance in between first and second adjacent ranges in the plurality of non-overlapping ranges of resistance representing the plurality of data values. After applying the at least one testing pulse to the first memory cell, it is determined whether to apply at least one healing pulse to repair the first memory cell, depending on relative values of (i) the cell resistance in the intermediate range of resistance and (ii) a reference resistance in the intermediate range of resistance.
    • 包括相变材料的第一存储单元。 第一存储器单元可编程以存储多个数据值的一个数据值。 多个数据值由第一存储单元的多个非重叠的电阻范围表示。 至少一个测试脉冲被施加到第一存储器单元,以在电阻的中间范围内建立第一存储器单元的单元电阻,在多个非重叠范​​围内的第一和第二相邻范围内的电阻的中间范围 表示多个数据值的电阻。 在将至少一个测试脉冲施加到第一存储器单元之后,根据(i)电阻中间范围内的电池电阻的相对值,确定是否施加至少一个愈合脉冲来修复第一存储器单元,以及 (ii)中间电阻范围内的参考电阻。
    • 4. 发明申请
    • METHOD AND APPARATUS FOR HEALING PHASE CHANGE MEMORY DEVICES
    • 用于治疗相变记忆装置的方法和装置
    • US20150371704A1
    • 2015-12-24
    • US14566453
    • 2014-12-10
    • Macronix International Co., Ltd.
    • Win San KhwaChao-I WuTzu-Hsiang SuHsiang-Pang Li
    • G11C13/00
    • G11C13/0097G11C11/5614G11C11/5678G11C13/0004G11C13/0021G11C13/0033G11C13/0069G11C29/50008G11C2213/79G11C2213/82
    • A first memory cell including a phase change material. The first memory cell is programmable to store one data value of a plurality of data values. The plurality of data values are represented by a plurality of non-overlapping ranges of resistance of the first memory cell. At least one testing pulse is applied to the first memory cell to establish a cell resistance of the first memory cell in an intermediate range of resistance, the intermediate range of resistance in between first and second adjacent ranges in the plurality of non-overlapping ranges of resistance representing the plurality of data values. After applying the at least one testing pulse to the first memory cell, it is determined whether to apply at least one healing pulse to repair the first memory cell, depending on relative values of (i) the cell resistance in the intermediate range of resistance and (ii) a reference resistance in the intermediate range of resistance.
    • 包括相变材料的第一存储单元。 第一存储器单元可编程以存储多个数据值的一个数据值。 多个数据值由第一存储单元的多个非重叠的电阻范围表示。 至少一个测试脉冲被施加到第一存储器单元,以在电阻的中间范围内建立第一存储器单元的单元电阻,在多个非重叠范​​围内的第一和第二相邻范围内的电阻的中间范围 表示多个数据值的电阻。 在将至少一个测试脉冲施加到第一存储器单元之后,根据(i)电阻中间范围内的电池电阻的相对值,确定是否施加至少一个愈合脉冲来修复第一存储器单元,以及 (ii)中间电阻范围内的参考电阻。
    • 9. 发明授权
    • Phase change memory coding
    • 相变存储器编码
    • US09336867B2
    • 2016-05-10
    • US14148545
    • 2014-01-06
    • MACRONIX INTERNATIONAL CO., LTD.
    • Hsiang-Lan LungMing-Hsiu LeeYen-Hao ShihTien-Yen WangChao-I Wu
    • G11C11/00G11C13/00G11C11/56
    • G11C13/0004G11C11/5678G11C13/004G11C13/0069G11C2013/0092
    • An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit.
    • 集成电路相变存储器可以通过在一些单元和存储器中引起第一电阻状态以及存储器中的第二电阻状态以及存储器中的一些其他单元来表示数据集而被预编码。 在对数据集进行编码之后,将集成电路相变存储器安装在基板上。 在安装集成电路相变存储器之后,通过感测第一和第二电阻状态以及将第一电阻状态下的单元改变为第三电阻状态并将第二电阻状态的单元改变为第四电阻状态来读取数据组。 第一和第二电阻状态在焊接或其他热循环过程之后保持感测裕度。 第三和第四电阻状态的特征在于能够使用更高速度和更低功率的转换,适用于电路的任务功能。