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    • 6. 发明申请
    • SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME
    • 半芳族聚酰胺树脂组合物及其成型品
    • US20160312027A1
    • 2016-10-27
    • US15104626
    • 2014-12-19
    • MITSUI CHEMICALS, INC.
    • Kaoru MINAGAWAHiroki EBATAIsao WASHIOKouichi SANONobuhiro TAKIZAWAAkinori AMANO
    • C08L77/06
    • C08L77/06C08G69/265C08K7/14C08L51/06C08L2201/08C08L2205/06
    • The problem of the invention is to provide a semi-aromatic polyamide resin composition having high rigidity, exceptional impact resistance, and exceptional zygosity with very little change in hardness associated with heating and cooling, as well as a molded article of this semi-aromatic polyamide resin composition. A semi-aromatic polyamide resin composition containing a semi-aromatic polyamide resin (A), acid-modified polyolefin resin (B), and fibrous filler (C), wherein the resin (A) contains a certain amount or more of terephthalic acid component units relative to the total number of moles of dicarboxylic acid component units, the semi-aromatic polyamide resin composition contains a certain amount or more of the resin (B), the glass transition temperature of the semi-aromatic polyamide resin composition is within a predetermined range, and the Vicat softening point of the resin (B) is within a predetermined range, is used as the semi-aromatic polyamide resin composition in order to solve this problem.
    • 本发明的问题在于提供具有高刚性,优异的耐冲击性和极好的接合性,与加热和冷却相关的硬度变化很小的半芳族聚酰胺树脂组合物,以及这种半芳族聚酰胺的模塑制品 树脂组合物。 含有半芳族聚酰胺树脂(A),酸改性聚烯烃树脂(B)和纤维状填料(C)的半芳族聚酰胺树脂组合物,其中,树脂(A)含有一定量以上的对苯二甲酸成分 相对于二羧酸成分单元的总摩尔数的单位,半芳香族聚酰胺树脂组合物含有一定量以上的树脂(B),半芳香族聚酰胺树脂组合物的玻璃化转变温度在预定的 范围,并且树脂(B)的维卡软化点在预定范围内,用作半芳族聚酰胺树脂组合物以解决该问题。