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1. 发明公开

US20240124955A1 HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET 审中-公开
公开(公告)号：US20240124955A1
公开(公告)日：2024-04-18
申请号：US18547409
申请日：2022-02-08
申请人： MITSUBISHI MATERIALS CORPORATION
发明人： Yosuke NAKASATO , Kazunari MAKI , Yasuhiro TSUGAWA , U TANI
IPC分类号： C22C9/01 , B22D11/00 , C22C1/02 , C22C9/00 , C22F1/08 , C23C14/34 , H01J37/34
CPC分类号： C22C9/01 , B22D11/004 , C22C1/02 , C22C9/00 , C22F1/08 , C23C14/3414 , H01J37/3426 , H01J2237/332
摘要： This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size μ in a sheet-thickness central portion is 40 μm or less.

2. 发明公开

US20240183009A1 HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET 审中-公开
公开(公告)号：US20240183009A1
公开(公告)日：2024-06-06
申请号：US18547597
申请日：2022-02-08
申请人： MITSUBISHI MATERIALS CORPORATION
发明人： Yosuke NAKASATO , Kazunari MAKI , Yasuhiro TSUGAWA , U TANI
IPC分类号： C22C9/01 , C23C14/34
CPC分类号： C22C9/01 , C23C14/3414 , C22F1/08
摘要： This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, and Al: 0.4 mass % or more and 5.7 mass % or less, with a remainder being Cu and inevitable impurities, among the inevitable impurities, an amount of Fe is 0.0020 mass % or less, an amount of O is 0.0020 mass % or less, an amount of S is 0.0030 mass % or less, and an amount of P is 0.0010 mass % or less, a special grain boundary length ratio (Lσ/L) which is a ratio of a sum Lσ of lengths of grain boundaries with 3≤Σ≤29 to a length L of all measured crystal grain boundaries by an EBSD method is 20% or more, and an average crystal grain size μA in a sheet-thickness central portion is 40 μm or less.

3. 发明申请

US20150318068A1 COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL, AND METHOD FOR PRODUCING COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL 有权
标题翻译：用于端子/连接器材料的铜合金板和用于生产用于端子/连接器材料的铜合金板的方法
公开(公告)号：US20150318068A1
公开(公告)日：2015-11-05
申请号：US14395430
申请日：2013-03-19
申请人： Mitsubishi Shindoh Co., Ltd. , MITSUBISHI MATERIALS CORPORATION
发明人： Keiichiro Oishi , Takashi HOKAZONO , Michio TAKASAKI , Yosuke NAKASATO
IPC分类号： H01B1/02 , C22F1/08 , C22C9/04
CPC分类号： H01B1/026 , C22C9/04 , C22F1/08
摘要： A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11≦[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≦19 is satisfied, a relationship of 7≦[Ni]/[P]≦40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t≦0.5 at W bending, solderability is excellent, and a Young's modulus is 100×103 N/mm2 or more.
摘要翻译：用于端子和连接材料的铜合金板含有Zn：4.5质量％〜12.0质量％，Sn：0.40质量％〜0.9质量％，P：0.01质量％〜0.08质量％，Ni：0.20质量％〜0.85质量％剩余部分为Cu和不可避免的杂质，满足关系式11和nlE; [Zn] +7.5×[Sn] +16×[P] + 3.5×[Ni]＆nlE; 19满足7＆nlE; [Ni] / 在Ni的含量在0.35质量％〜0.85质量％的范围内，平均结晶粒径在2.0〜8.0微米的范围内，平均粒径为[P]＆nlE; 40 圆形或椭圆形析出物的浓度范围为4.0nm〜25.0nm，析出物中的粒径为4.0nm〜25.0nm的析出物数的比例为70％以上，导电率为29 ％IACS以上，应力松弛的百分比在150℃为30％以下，1000小时为抗应力松弛性，弯曲加工性为R / t＆nlE; 0.5在W弯曲时，可焊性 ty优异，杨氏模量为100×10 3 N / mm 2以上。

4. 发明申请

US20150122380A1 COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL, AND METHOD FOR PRODUCING COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL 审中-公开
公开(公告)号：US20150122380A1
公开(公告)日：2015-05-07
申请号：US14517703
申请日：2014-10-17
申请人： Mitsubishi Shindoh Co., Ltd. , MITSUBISHI MATERIALS CORPORATION
发明人： Keiichiro Oishi , Takashi HOKAZONO , Michio TAKASAKI , Yosuke NAKASATO
IPC分类号： H01B1/02 , C22C9/04 , C22F1/08
摘要： A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11≦[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≦19 is satisfied, a relationship of 7≦[Ni]/[P]≦40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t≦0.5 at W bending, solderability is excellent, and a Young's modulus is 100×103 N/mm2 or more.

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