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    • 1. 发明申请
    • COMPOSITE SUBSTRATE SENSOR DEVICE AND METHOD OF MANUFACTURING SUCH SENSOR DEVICE
    • 复合基板传感器装置及制造这种传感器装置的方法
    • US20160305796A1
    • 2016-10-20
    • US15096661
    • 2016-04-12
    • MEI-YEN LEE
    • HSIEN-MING WU
    • G01D5/24G06K9/00
    • G06K9/00053G06K9/0002
    • A composite substrate sensor device comprises: a first substrate sensing chip having an upper surface, a lower surface, side surfaces and sensing circuit cells; a second substrate surrounding the first substrate sensing chip; an insulating layer set comprising insulating layers and disposed on upper surfaces of the second substrate and the first substrate sensing chip on a virtual common plane; sensing electrode cells disposed on an upper surface of the insulating layer set on a physical common plane substantially parallel to the virtual common plane; and interconnect wires formed in the insulating layer set and electrically connecting the sensing electrode cells to the sensing circuit cells, respectively, so that the sensing circuit cells sense an electric field variation of an approaching object through the sensing electrode cells and the interconnect wires. A method of manufacturing the sensor device is also provided.
    • 复合衬底传感器装置包括:具有上表面,下表面,侧表面和感测电路单元的第一衬底感测芯片; 围绕所述第一基板感测芯片的第二基板; 绝缘层组,其包括绝缘层并且设置在所述第二基板的上表面上,并且所述第一基板感测芯片设置在虚拟公共平面上; 设置在基本上平行于所述虚拟公共平面的物理公用平面上的所述绝缘层的上表面上的感测电极单元; 以及形成在绝缘层组中的互连线,并分别将感测电极单元电连接到感测电路单元,使得感测电路单元通过感测电极单元和互连线感测接近物体的电场变化。 还提供了一种制造传感器装置的方法。
    • 3. 发明申请
    • COMPOSITE SUBSTRATE SENSOR DEVICE AND METHOD OF MANUFACTURING SUCH SENSOR DEVICE
    • 复合基板传感器装置及制造这种传感器装置的方法
    • US20160305998A1
    • 2016-10-20
    • US15096621
    • 2016-04-12
    • MEI-YEN LEE
    • HSIEN-MING WU
    • G01R29/12H05K3/30H05K3/10H05K3/46
    • H05K3/10G06F3/044G06K9/0002H01L23/5389H01L2224/04105
    • A composite substrate sensor device comprises: a first substrate sensing chip having an upper surface, a lower surface, side surfaces and scanning and receiving circuit cells; a second substrate connected to the first substrate sensing chip; an insulating layer set comprising insulating layers and disposed on upper surfaces of the second substrate and the first substrate sensing chip on a virtual common plane; scanning and receiving electrode cells disposed on an upper surface of the insulating layer set on a physical common plane substantially parallel to the virtual common plane; and scanning and receiving wires formed on the insulating layer set and electrically connecting the scanning and receiving electrode cells to the scanning and receiving circuit cells, respectively, so that the receiving circuit cells sense an electric field variation of an object through the receiving electrode cells and receiving wires. A method of manufacturing the sensor device is also provided.
    • 复合基板传感器装置包括:具有上表面,下表面,侧表面以及扫描和接收电路单元的第一基板检测芯片; 连接到第一衬底感测芯片的第二衬底; 绝缘层组,其包括绝缘层并且设置在所述第二基板的上表面上,并且所述第一基板感测芯片设置在虚拟公共平面上; 设置在绝缘层的上表面上的扫描和接收电极单元,其设置在基本上平行于虚拟公共平面的物理公用平面上; 以及形成在所述绝缘层上的扫描和接收线分别设置并将所述扫描和接收电极单元电连接到所述扫描和接收电路单元,使得所述接收电路单元通过所述接收电极单元感测物体的电场变化;以及 接收线。 还提供了一种制造传感器装置的方法。