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    • 2. 发明授权
    • Pixel structure and method for fabricating the same
    • 像素结构及其制造方法
    • US08247245B2
    • 2012-08-21
    • US13047610
    • 2011-03-14
    • Hsiang-Lin LinLiu-Chung LeeKuo-Yu Huang
    • Hsiang-Lin LinLiu-Chung LeeKuo-Yu Huang
    • H01L29/72
    • G02F1/136213G02F2001/136218
    • A pixel structure is disclosed. The pixel structure includes a substrate, a first data line having at least one end formed on the substrate, a first insulation layer overlying the first data line and exposing a part of the end of the first data line, a shielding electrode disposed on the first insulation layer and overlapped with the first data line, a second data line formed on the first insulation layer and electrically connected to the exposed end of the first data line, a second insulation layer overlying the shielding electrode and the second data line, and a pixel electrode formed on the second insulation layer and overlapped with the shielding electrode. The invention also provides a method for fabricating the pixel structure.
    • 公开了像素结构。 像素结构包括基板,具有至少一个端部形成在基板上的第一数据线,覆盖第一数据线并暴露第一数据线的端部的一部分的第一绝缘层,设置在第一数据线上的屏蔽电极 绝缘层并与第一数据线重叠,形成在第一绝缘层上并电连接到第一数据线的暴露端的第二数据线,覆盖屏蔽电极和第二数据线的第二绝缘层,以及像素 电极,形成在第二绝缘层上并与屏蔽电极重叠。 本发明还提供了一种用于制造像素结构的方法。
    • 5. 发明授权
    • Method of fabricating pixel structure and method of fabricating organic light emitting device
    • 制造像素结构的方法和制造有机发光器件的方法
    • US07981708B1
    • 2011-07-19
    • US12908872
    • 2010-10-20
    • Liu-Chung LeeHung-Che TingChia-Yu Chen
    • Liu-Chung LeeHung-Che TingChia-Yu Chen
    • H01L21/00
    • H01L27/3248H01L27/1225H01L27/3262
    • A method of fabricating a pixel structure is provided. A gate electrode is formed on a substrate, and a dielectric layer is formed on the gate electrode. A patterned metal oxide semiconductor layer and a patterned metallic etching stop layer are formed on the dielectric layer above the gate electrode. A first conductive layer is formed to cover the patterned metallic etching stop layer and the dielectric layer. The first conductive layer is patterned by using the patterned metallic etching stop layer as an etching stop layer to form a source and a drain. A second conductive layer is formed to cover the source, the drain and the dielectric layer. The second conductive layer is patterned by using the patterned metallic etching stop layer as an etching stop layer to form a first electrode layer. The patterned metallic etching stop layer exposed between the source and the drain is removed.
    • 提供了一种制造像素结构的方法。 在基板上形成栅电极,在栅电极上形成介电层。 在栅电极上的电介质层上形成图案化的金属氧化物半导体层和图案化的金属蚀刻停止层。 形成第一导电层以覆盖图案化的金属蚀刻停止层和电介质层。 通过使用图案化的金属蚀刻停止层作为蚀刻停止层来形成第一导电层以形成源极和漏极。 形成第二导电层以覆盖源极,漏极和介电层。 通过使用图案化的金属蚀刻停止层作为蚀刻停止层来图案化第二导电层,以形成第一电极层。 去除在源极和漏极之间暴露的图案化金属蚀刻停止层。
    • 9. 发明授权
    • Displaying device with photocurrent-reducing structure and method of manufacturing the same
    • 具有光电流降低结构的显示装置及其制造方法
    • US08581259B2
    • 2013-11-12
    • US11254726
    • 2005-10-21
    • Tung-Yu ChenLiu-Chung Lee
    • Tung-Yu ChenLiu-Chung Lee
    • H01L27/14H01L29/04H01L29/15H01L31/036
    • H01L29/66765
    • A displaying device includes a substrate, a gate electrode formed on the substrate, a gate insulating layer, a gate a-Si region covering the gate electrode, a source metal region, a drain metal region, a data-line (DL) metal region, a passivation layer and a conductive layer. The gate a-Si region is formed on the gate insulating layer. The source and drain metal regions are formed on the gate a-Si region. The DL metal region is formed on the gate insulating layer and separated from the drain metal region at an interval. The passivation layer formed on the gate insulating layer covers the source, drain, and DL metal regions. The first and second vias of the passivation layer expose partial surfaces of the DL and drain metal regions respectively. The conductive layer formed on the passivation layer covers the first and second vias for electrically connecting the DL and drain metal regions.
    • 显示装置包括基板,形成在基板上的栅极电极,栅极绝缘层,覆盖栅电极的栅极a-Si区域,源极金属区域,漏极金属区域,数据线(DL)金属区域 ,钝化层和导电层。 栅极a-Si区域形成在栅极绝缘层上。 源极和漏极金属区域形成在栅极a-Si区域上。 DL金属区域形成在栅极绝缘层上,并且与漏极金属区域间隔开。 形成在栅极绝缘层上的钝化层覆盖源极,漏极和DL金属区域。 钝化层的第一和第二通孔分别暴露DL和漏极金属区域的部分表面。 形成在钝化层上的导电层覆盖用于电连接DL和漏极金属区域的第一和第二通孔。
    • 10. 发明申请
    • MASK LEVEL REDUCTION FOR MOFET
    • 屏蔽层减少MOFET
    • US20120235138A1
    • 2012-09-20
    • US13481781
    • 2012-05-26
    • Chan-Long ShiehGang YuFatt FoongLiu-Chung Lee
    • Chan-Long ShiehGang YuFatt FoongLiu-Chung Lee
    • H01L29/12H01L21/336
    • H01L27/1288H01L27/1225
    • A method of fabricating a TFT and IPS with reduced masking operations includes a substrate, a gate, a layer of gate dielectric on the gate and surrounding substrate surface and a semiconducting metal oxide on the gate dielectric. A channel protection layer overlies the gate to define a channel area in the semiconducting metal oxide. A S/D metal layer is patterned on the channel protection layer and a portion of the exposed semiconducting metal oxide to define an IPS area. An organic dielectric material is patterned on the S/D terminals and at an opposed side of the IPS area. The S/D metal is etched to expose the semiconducting metal oxide defining a first IPS electrode. A passivation layer covers the first electrode and a layer of transparent conductive material is patterned on the passivation layer to define a second IPS electrode overlying the first electrode.
    • 制造具有减小的掩模操作的TFT和IPS的方法包括基板,栅极,栅极上的栅极电介质层和周围的衬底表面以及栅极电介质上的半导体金属氧化物。 沟道保护层覆盖栅极以限定半导体金属氧化物中的沟道区。 S / D金属层在通道保护层和暴露的半导体金属氧化物的一部分上被图案化以限定IPS区域。 在S / D端子和IPS区域的相对侧上构图有机电介质材料。 蚀刻S / D金属以暴露限定第一IPS电极的半导体金属氧化物。 钝化层覆盖第一电极,并且在钝化层上图案化透明导电材料层以限定覆盖第一电极的第二IPS电极。