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    • 4. 发明授权
    • Method of forming a barrier layer arrangement for conductive layers on
silicon substrates
    • 在硅衬底上形成用于导电层的阻挡层布置的方法
    • US4994434A
    • 1991-02-19
    • US326813
    • 1989-03-21
    • Liang-Sun HungJohn A. Agostinelli
    • Liang-Sun HungJohn A. Agostinelli
    • H01L39/24
    • H01L39/2461Y10S505/73Y10S505/739Y10S505/817Y10S505/818Y10S505/826Y10S505/832Y10S505/92
    • A process is disclosed of producing on a crystalline silicon substrate a barrier layer triad capable of protecting a rare earth alkaline earth copper oxide conductive coating from direct interaction with the substrate. A silica layer of at least 2000 .ANG. in thickness is deposited on the silicon substrate, and followed by deposition on the silica layer of a Group 4 heavy metal to form a layer having a thickness in the range of from 1500 to 3000 .ANG.. Heating the layers in the absence of a reactive atmosphere to permit oxygen migration from the silica layer forms a barrier layer triad consisting of a silica first triad layer located adjacent the silicon substrate, a heavy Group 4 metal oxide third triad layer remote from the silicon substrate, and a Group 4 heavy metal silicide second triad layer interposed between the first and third triad layers.
    • 公开了一种在晶体硅衬底上制备能够保护稀土类碱土铜氧化物导电涂层与衬底直接相互作用的阻挡层三元组的方法。 将厚度至少为2000的二氧化硅层沉积在硅衬底上,随后沉积在第4组重金属的二氧化硅层上,以形成厚度在1500至3000范围内的层。 在没有反应气氛的情况下加热层以允许氧从二氧化硅层迁移形成由位于硅衬底附近的二氧化硅第一三元组构成的阻挡层三元组,远离硅衬底的重的第4族金属氧化物第三三电极层 以及插入在第一和第三三单层之间的第4族重金属硅化物第二三单元组层。