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    • 3. 发明申请
    • METHOD AND MATERIAL FOR FORMING HIGH ETCH RESISTANT DOUBLE EXPOSURE PATTERNS
    • 用于形成高耐蚀双重曝光图案的方法和材料
    • US20090011374A1
    • 2009-01-08
    • US12205509
    • 2008-09-05
    • Ching-Yu CHANGChin-Hsiang LIN
    • Ching-Yu CHANGChin-Hsiang LIN
    • G03F7/20
    • G03F7/40G03F7/405
    • The present invention includes a lithography method comprising forming a first patterned resist layer including at least one opening therein over a substrate. A protective layer is formed on the first patterned resist layer and the substrate whereby a reaction occurs at the interface between the first patterned resist layer and the protective layer to form a reaction layer over the first patterned resist layer. The non-reacted protective layer is then removed. Thereafter, a second patterned resist layer is formed over the substrate, wherein at least one portion of the second patterned resist layer is disposed within the at least one opening of the first patterned resist layer. The substrate is thereafter etched using the first and second patterned resist layers as a mask.
    • 本发明包括光刻方法,包括在衬底上形成包括至少一个开口的第一图案化抗蚀剂层。 在第一图案化抗蚀剂层和基板上形成保护层,由此在第一图案化抗蚀剂层和保护层之间的界面处发生反应,以在第一图案化抗蚀剂层上形成反应层。 然后除去未反应的保护层。 此后,在衬底上形成第二图案化抗蚀剂层,其中第二图案化抗蚀剂层的至少一部分设置在第一图案化抗蚀剂层的至少一个开口内。 然后使用第一和第二图案化抗蚀剂层作为掩模蚀刻衬底。
    • 10. 发明申请
    • Photolithography Process and Photomask Structure Implemented in a Photolithography Process
    • 光刻工艺和光掩模结构在光刻工艺中实现
    • US20090096090A1
    • 2009-04-16
    • US12244857
    • 2008-10-03
    • Ching-Yu CHANG
    • Ching-Yu CHANG
    • H01L29/40
    • G03F7/70441G03F1/36
    • In a photolithography process, a photoresist layer is formed on a substrate. A photomask is aligned over the substrate to transfer pattern images defined in the photomask on the substrate. The photomask includes first and second patterns of different light transmission rates, and a dummy pattern surrounding the second pattern having a light transmission rate lower than that of the first pattern. The substrate is exposed to a light radiation through the photomask. The photoresist layer then is developed to form the pattern images. The dummy pattern is dimensionally configured to allow light transmission, but in a substantially amount so that the dummy pattern is not imaged during exposure.
    • 在光刻工艺中,在基板上形成光致抗蚀剂层。 光掩模在衬底上对准以传输在衬底上的光掩模中限定的图案图像。 光掩模包括不同透光率的第一和第二图案,以及围绕第二图案的虚拟图案,其透光率低于第一图案的透光率。 将基板暴露于通过光掩模的光辐射。 然后将光致抗蚀剂层显影以形成图案图像。 虚拟图案被尺寸地构造成允许光透射,但是基本上是这样的,使得在曝光期间伪图案不被成像。