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    • 2. 发明申请
    • NON-UNIFORM FEEDTHROUGH AND LEAD CONFIGURATION FOR A TRANSISTOR OUTLINE PACKAGE
    • 用于晶体管外形封装的非均匀性和引线配置
    • US20080237835A1
    • 2008-10-02
    • US11694725
    • 2007-03-30
    • Chris Kiyoshi TogamiDarin J. Douma
    • Chris Kiyoshi TogamiDarin J. Douma
    • H01L23/52
    • H01L23/045H01L31/0203H01L2224/48091H01L2924/19107H01L2924/3011H01L2924/00014
    • A transistor outline package having a feedthrough via and lead configuration that maximizes the amount of usable area on a header of the package is disclosed. In one embodiment, the package includes a header having an interior surface that includes a first and second lead assembly. The first lead assembly includes two vias having a first diameter, with each first via being positioned along a first pin circle imaginarily defined on the interior surface of the header. Each first via also includes first leads received therein. The second lead assembly includes four vias having a second diameter each, with each second via being positioned along a second pin circle that has a diameter greater than that of the first pin circle. Each second via includes second leads received therein. This configuration increases usable area on the header interior surface between the leads, enabling relatively larger submounts to be placed thereon.
    • 公开了一种晶体管外形封装,其具有使封装的封头上的可用区域的数量最大化的馈通通孔和引线配置。 在一个实施例中,包装包括具有包括第一和第二引线组件的内表面的插头。 第一引线组件包括具有第一直径的两个通孔,每个第一通孔沿着形成在头部的内表面上的第一引脚环定位。 每个第一通孔还包括接收在其中的第一引线。 第二引线组件包括具有第二直径的四个通孔,每个第二通孔沿着具有大于第一引脚圆的直径的第二引脚圆定位。 每个第二通孔包括接收在其中的第二引线。 该配置增加了引线之间的头部内表面上的可用面积,使得能够将相对较大的基座放置在其上。
    • 3. 发明授权
    • Non-uniform feedthrough and lead configuration for a transistor outline package
    • 晶体管外形封装的不均匀馈通和引线配置
    • US08093710B2
    • 2012-01-10
    • US11694725
    • 2007-03-30
    • Chris Kiyoshi TogamiDarin J. Douma
    • Chris Kiyoshi TogamiDarin J. Douma
    • H01L23/52
    • H01L23/045H01L31/0203H01L2224/48091H01L2924/19107H01L2924/3011H01L2924/00014
    • A transistor outline package having a feedthrough via and lead configuration that maximizes the amount of usable area on a header of the package is disclosed. In one embodiment, the package includes a header having an interior surface that includes a first and second lead assembly. The first lead assembly includes two vias having a first diameter, with each first via being positioned along a first pin circle imaginarily defined on the interior surface of the header. Each first via also includes first leads received therein. The second lead assembly includes four vias having a second diameter each, with each second via being positioned along a second pin circle that has a diameter greater than that of the first pin circle. Each second via includes second leads received therein. This configuration increases usable area on the header interior surface between the leads, enabling relatively larger submounts to be placed thereon.
    • 公开了一种晶体管外形封装,其具有使封装的封头上的可用区域的数量最大化的馈通通孔和引线配置。 在一个实施例中,包装包括具有包括第一和第二引线组件的内表面的插头。 第一引线组件包括具有第一直径的两个通孔,每个第一通孔沿着形成在头部的内表面上的第一引脚环定位。 每个第一通孔还包括接收在其中的第一引线。 第二引线组件包括具有第二直径的四个通孔,每个第二通孔沿着具有大于第一引脚圆的直径的第二引脚圆定位。 每个第二通孔包括其中接收的第二引线。 该配置增加了引线之间的头部内表面上的可用面积,使得能够将相对较大的基座放置在其上。
    • 6. 发明授权
    • Integrated optical transceiver array
    • 集成光收发器阵列
    • US07594766B1
    • 2009-09-29
    • US10715576
    • 2003-11-17
    • Gary Dean SasserChris Kiyoshi Togami
    • Gary Dean SasserChris Kiyoshi Togami
    • G02B6/36G02B6/42
    • G02B6/4246G02B6/4261
    • An integrated array for optoelectronic components in an optical communications system is disclosed. The integrated array incorporates a plurality of optoelectronic modules, such as optical transceivers, in a compact, integrated geometry for positioning within an optical device, such as an optical switch or router. In one embodiment, the integrated array includes a component structure comprised of a plurality of optical transceiver sub-modules, each having dual optical ports. The component structure is integrated as a single structure to minimize the spacing between each transceiver sub-module. This in turn increases the optical port density of the integrated array. The integrated array is received by a cage that is attached to a host board within the optical device. A latching mechanism is included to selectively secure the integrated array within the cage.
    • 公开了一种用于光通信系统中的光电子部件的集成阵列。 集成阵列以紧凑的集成几何形式结合有多个光电模块,例如光收发器,用于定位在诸如光开关或路由器之类的光学装置内。 在一个实施例中,集成阵列包括由多个光收发器子模块组成的组件结构,每个子模块具有双光口。 组件结构集成为单个结构,以最小化每个收发器子模块之间的间距。 这又增加了集成阵列的光口密度。 集成阵列由附接到光学装置内的主板的笼子接收。 包括锁定机构以选择性地将集成阵列固定在保持架内。
    • 7. 发明授权
    • Optical transceiver module array system
    • 光收发模块阵列系统
    • US07350984B1
    • 2008-04-01
    • US10716149
    • 2003-11-17
    • Chris Kiyoshi TogamiGary Dean Sasser
    • Chris Kiyoshi TogamiGary Dean Sasser
    • G02B6/36G03B6/42
    • G02B6/4292G02B6/4201G02B6/4246G02B6/4261G02B6/4277G02B6/4284H01R12/716H01R13/6658
    • An array system that enables compact positioning of optoelectronic modules, such as optical transceiver modules, within an optical device is disclosed. The array system increases the optical port density of the modules within the optical device, which can comprise an optical switch, an optical router, or the like. In one embodiment, the array system includes a host board and a plurality of daughter cards that connect with the host board edge-on in a perpendicular orientation. A cage is mounted to each daughter card, and an optical transceiver module is received into each cage to electrically connect with a connector receptacle that is positioned on the daughter card. A connectorized optical fiber can be connected to the optical ports of the transceiver using a release sleeve that enables engagement and disengagement of the optical fiber without difficulty despite the increased port density.
    • 公开了一种能够使光电子模块(例如光收发器模块)在光学装置内紧凑定位的阵列系统。 阵列系统增加了光学装置内的模块的光端口密度,光学装置可以包括光学开关,光学路由器等。 在一个实施例中,阵列系统包括主板和多个子卡,其以垂直取向与主板边缘连接。 笼子安装到每个子卡上,并且光收发器模块被接收到每个笼中以与位于子卡上的连接器插座电连接。 连接的光纤可以使用释放套筒连接到收发器的光学端口,即使端口密度增加也能够轻松地接合和分离光纤。
    • 9. 发明申请
    • OPTICAL SUBASSEMBLY HAVING INSERTABLE CYLINDRICAL SLEEVE
    • 具有插入式圆柱形套筒的光学分层
    • US20080019643A1
    • 2008-01-24
    • US11458948
    • 2006-07-20
    • Tat Ming TeoChris Kiyoshi TogamiJinxiang Liu
    • Tat Ming TeoChris Kiyoshi TogamiJinxiang Liu
    • G02B6/36G02B6/38
    • G02B6/4292G02B6/4204G02B6/4246
    • An optical subassembly (“OSA”) for use in optical communications modules is disclosed. The OSA solves various issues related to the insertion and removal of an optical fiber connector into and from the OSA receptacle, including hard plug, wiggle performance, and shavings production. In one embodiment, an optical communications module is disclosed and includes a housing and an optical subassembly of the present invention partially contained within the housing. The optical subassembly includes various components, including a body composed of a first material, and a plug receptacle formed with the body. The plug receptacle includes an inner surface on which surface features, such as threads, are formed. A hollow cylindrical sleeve composed of a second material is received in the plug receptacle such that the outer sleeve surface engages the surface features of the plug receptacle inner surface and such that an optical fiber connector can be received by the sleeve.
    • 公开了一种用于光通信模块的光学子组件(“OSA”)。 OSA解决了将光纤连接器插入和移出OSA插座的各种问题,包括硬插头,摆动性能和刨削生产。 在一个实施例中,公开了一种光通信模块,并且包括部分地包含在壳体内的本发明的壳体和光学子组件。 光学子组件包括各种部件,包括由第一材料构成的主体和形成有主体的插头插座。 插头插座包括内表面,其上形成有诸如螺纹的表面特征。 由第二材料构成的中空圆柱形套筒被容纳在插头插座中,使得外套筒表面接合插头插座内表面的表面特征,并且使得光纤连接器可以被套筒容纳。
    • 10. 发明授权
    • Optical subassembly having insertable cylindrical sleeve
    • 具有可插入圆柱套筒的光学组件
    • US07695199B2
    • 2010-04-13
    • US11458948
    • 2006-07-20
    • Tat Ming TeoChris Kiyoshi TogamiJinxiang Liu
    • Tat Ming TeoChris Kiyoshi TogamiJinxiang Liu
    • G02B6/36G02B6/38
    • G02B6/4292G02B6/4204G02B6/4246
    • An optical subassembly (“OSA”) for use in optical communications modules is disclosed. The OSA solves various issues related to the insertion and removal of an optical fiber connector into and from the OSA receptacle, including hard plug, wiggle performance, and shavings production. In one embodiment, an optical communications module is disclosed and includes a housing and an optical subassembly of the present invention partially contained within the housing. The optical subassembly includes various components, including a body composed of a first material, and a plug receptacle formed with the body. The plug receptacle includes an inner surface on which surface features, such as threads, are formed. A hollow cylindrical sleeve composed of a second material is received in the plug receptacle such that the outer sleeve surface engages the surface features of the plug receptacle inner surface and such that an optical fiber connector can be received by the sleeve.
    • 公开了一种用于光通信模块的光学子组件(“OSA”)。 OSA解决了将光纤连接器插入和移出OSA插座的各种问题,包括硬插头,摆动性能和刨削生产。 在一个实施例中,公开了一种光通信模块,并且包括部分地包含在壳体内的本发明的壳体和光学子组件。 光学子组件包括各种部件,包括由第一材料构成的主体和形成有主体的插头插座。 插头插座包括内表面,其上形成有诸如螺纹的表面特征。 由第二材料构成的中空圆柱形套筒被容纳在插头插座中,使得外套筒表面接合插头插座内表面的表面特征,并且使得光纤连接器可以被套筒容纳。