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1. 发明授权

US07499279B2 Cold plate stability 失效
标题翻译：冷板稳定
公开(公告)号：US07499279B2
公开(公告)日：2009-03-03
申请号：US11741852
申请日：2007-04-30
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
IPC分类号： H05K7/20
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译：冷板组件包括具有至少两个管道端口的冷板。冷板组件还包括向冷板施加致动负载的弹簧板组件。致动负载被配置为将冷板机械地致动到模块。

2. 发明授权

US07903411B2 Cold plate stability 失效
标题翻译：冷板稳定
公开(公告)号：US07903411B2
公开(公告)日：2011-03-08
申请号：US12185141
申请日：2008-08-04
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
IPC分类号： H05K7/20
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译：冷板组件包括具有至少两个管道端口的冷板。冷板组件还包括向冷板施加致动负载的弹簧板组件。弹簧板组件包括弹簧板和可在弹簧板组件的槽中移动的弹簧销，以保持致动负载。致动负载被配置为将冷板机械地致动到模块。

3. 发明申请

US20080308260A1 COLD PLATE STABILITY 失效
标题翻译：冷板稳定性
公开(公告)号：US20080308260A1
公开(公告)日：2008-12-18
申请号：US12185141
申请日：2008-08-04
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, JR. , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, JR. , Arvind K. Sinha
IPC分类号： F28D15/00
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译：冷板组件包括具有至少两个管道端口的冷板。冷板组件还包括向冷板施加致动负载的弹簧板组件。弹簧板组件包括弹簧板和可在弹簧板组件的槽中移动的弹簧销，以保持致动负载。致动负载被配置为将冷板机械地致动到模块。

4. 发明授权

US07751918B2 Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates 失效
标题翻译：用于配置串联多个液冷冷板的管道的方法
公开(公告)号：US07751918B2
公开(公告)日：2010-07-06
申请号：US11620088
申请日：2007-01-05
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
IPC分类号： G06F19/00 , F25B7/00 , H01G4/002 , H02B1/00
CPC分类号： H05K7/20809 , G06F1/20
摘要： Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level. If so, the coolant-carrying tube layout is chosen as a final design.
摘要翻译：提供了构造用于电子系统的冷却子组件的方法，即，用于建立冷却剂承载管布局，用于将串联流体通信中的多个液冷冷板互连，以冷却电子系统的多个发热电子部件。电子部件将以固定关系插入到预配置的主板中，并且管布置包括至少一个刚性的冷却剂输送管。最初进行简化分析以评估刚性管上的应力，并确定电子部件上的致动负载的损失是否超过可接受的阈值，如果是，则识别和重新配置至少一个具有高应力的管。此后，执行分析以确定在冷却子组件上的可用致动负载下，电子部件和支撑母板之间的电连接负载是否高于可接受的最低水平。如果是这样，选择冷却剂载体管布局作为最终设计。

5. 发明申请

US20080266799A1 Methods and Apparatuses for Cold Plate Stability 失效
标题翻译：冷板稳定性的方法与装置
公开(公告)号：US20080266799A1
公开(公告)日：2008-10-30
申请号：US11741852
申请日：2007-04-30
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth , Arvind K. Sinha
IPC分类号： H05K7/20
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译：冷板组件包括具有至少两个管道端口的冷板。冷板组件还包括向冷板施加致动负载的弹簧板组件。致动负载被配置为将冷板机械地致动到模块。

6. 发明授权

US08985847B2 Thermal resistance-based monitoring of cooling of an electronic component 有权
标题翻译：电子元件冷却的基于热阻的监测
公开(公告)号：US08985847B2
公开(公告)日：2015-03-24
申请号：US13300803
申请日：2011-11-21
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： G01N3/60 , G01N17/00 , G01N25/16 , G01N25/00 , H05K7/20
CPC分类号： H05K7/20836
摘要： Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.
摘要翻译：提供了对电子部件的冷却的监视，其包括：确定与电子部件中的一个或多个相关联的当前热阻，耦合到电子部件的散热器或耦合电子部件和散热器的热接口; 以及通过处理器确定当前热阻是否超过设定的热阻阈值，并且响应于当前热阻超过设定的热阻阈值，指示热阻故障。作为增强，确定热阻时间的变化率，并且与变化率阈值进行比较，并且如果超过阈值，则提供变化率热阻警告。

7. 发明授权

US08922998B2 Coolant manifold with separately rotatable manifold section(s) 有权
标题翻译：具有可分开旋转的歧管部分的冷却液歧管
公开(公告)号：US08922998B2
公开(公告)日：2014-12-30
申请号：US13281495
申请日：2011-10-26
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Eric J. McKeever , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Eric J. McKeever , Robert E. Simons
IPC分类号： G06F1/20 , H05K5/00 , H05K7/20 , F28D7/10 , F28D7/12 , F28D7/02 , F28F3/12 , F28F1/10 , F28F1/00
CPC分类号： H05K7/20272 , H05K7/2079 , Y10T29/4935 , Y10T29/49389
摘要： A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.
摘要翻译：提供了一种冷却装置，其包括连接到一个或多个电子部件，一个或多个冷却剂管道和一个或多个冷却剂歧管的一个或多个冷却剂冷却结构。冷却剂冷却结构包括一个或多个冷却剂输送通道，并且冷却剂歧管包括一个或多个可旋转的歧管段。一个冷却剂管道将相应的可旋转歧管部分和相应冷却剂冷却结构的冷却剂输送通道流体连通地连接。相应的可旋转歧管部分可相对于冷却剂歧管的另一部分旋转，以便于将冷却剂冷却结构与其相关联的电子部件分离，同时保持冷却剂冷却结构与相应的可旋转歧管部分流体连通，通过一个冷却剂管道，其在一个实施例中是基本刚性的冷却剂导管。

8. 发明授权

US08857057B2 Apparatus and method for facilitating servicing of a liquid-cooled electronics rack 有权
标题翻译：便于维修液冷电子机架的装置和方法
公开(公告)号：US08857057B2
公开(公告)日：2014-10-14
申请号：US13447421
申请日：2012-04-16
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： B21D53/02 , B23P6/00 , F28D15/00 , H01S4/00 , H05K7/20
CPC分类号： H05K7/20781 , Y10T29/49002 , Y10T29/4935 , Y10T29/49352 , Y10T29/49826
摘要： An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.
摘要翻译：提供一种用于便利液体冷却电子机架的维修的装置。该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线，冷却液返回口和冷却液箱。每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

9. 发明授权

US08789385B2 Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component 有权
标题翻译：有助于冷却电子部件的热电增强蒸气压缩制冷方法
公开(公告)号：US08789385B2
公开(公告)日：2014-07-29
申请号：US13451668
申请日：2012-04-20
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12
CPC分类号： F25B21/02 , F25B40/00 , H05K7/20836
摘要： A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.
摘要翻译：提供了一种便于冷却电子部件的方法。该方法包括：提供构造成制冷剂流过环路的制冷剂回路; 联接压缩机与环路流体连通，其中环路的第一部分位于压缩机的制冷剂入口的上游，第二部分位于下游; 并配置可控热电阵列与制冷剂回路热连通。热电阵列设置成与制冷剂回路的第一部分至少部分地与阵列的第一侧热接触，并且环的第二部分至少部分地与阵列的第二侧热接触。控制阵列以确保进入压缩机的制冷剂回路中的制冷剂处于过热的热力学状态。

10. 发明授权

US08713955B2 Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus 失效
标题翻译：用于蒸气压缩式制冷装置的冷凝器内污染物提取器
公开(公告)号：US08713955B2
公开(公告)日：2014-05-06
申请号：US13271290
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Evan G. Colgan , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Evan G. Colgan , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12
CPC分类号： F25B43/003 , F25B2400/01 , H05K7/20327 , H05K7/20809
摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system. The vapor-compression refrigeration system includes an expansion component, an evaporator, a compressor, and a condenser coupled in fluid communication via a refrigerant flow path. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant extractor coupled in fluid communication with the refrigerant flow path. The extractor includes a refrigerant boiling filter and a heater. At least a portion of refrigerant passing through the refrigerant flow path passes through the refrigerant boiling filter, and the heater provides heat to the refrigerant boiling filter to boil refrigerant passing through the filter. By boiling refrigerant passing through the filter, contaminants are extracted from the refrigerant, and are deposited in the refrigerant boiling filter.
摘要翻译：提供了便于冷却电子部件的装置和方法。该装置包括蒸气压缩制冷系统。蒸汽压缩式制冷系统包括膨胀部件，蒸发器，压缩机以及通过制冷剂流动路径流体连通的冷凝器。蒸发器与电子部件联接并冷却。该装置还包括与制冷剂流动路径流体连通地联接的污染物提取器。提取器包括制冷剂沸腾过滤器和加热器。通过制冷剂流路的制冷剂的至少一部分通过制冷剂沸腾过滤器，并且加热器向制冷剂沸腾过滤器提供热量以沸腾通过过滤器的制冷剂。通过沸腾通过过滤器的制冷剂，污染物从制冷剂中排出，并沉积在制冷剂沸腾过滤器中。

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